TWI499482B - 晶圓之倒角裝置 - Google Patents
晶圓之倒角裝置 Download PDFInfo
- Publication number
- TWI499482B TWI499482B TW100115556A TW100115556A TWI499482B TW I499482 B TWI499482 B TW I499482B TW 100115556 A TW100115556 A TW 100115556A TW 100115556 A TW100115556 A TW 100115556A TW I499482 B TWI499482 B TW I499482B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- processing
- processing table
- chamfering
- grindstone
- Prior art date
Links
- 235000012431 wafers Nutrition 0.000 claims description 343
- 238000012545 processing Methods 0.000 claims description 296
- 230000007246 mechanism Effects 0.000 claims description 130
- 239000004575 stone Substances 0.000 claims description 63
- 238000004140 cleaning Methods 0.000 claims description 48
- 238000001035 drying Methods 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 36
- 238000012805 post-processing Methods 0.000 claims description 17
- 238000007781 pre-processing Methods 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 10
- 238000005259 measurement Methods 0.000 description 11
- 230000032258 transport Effects 0.000 description 9
- 238000005406 washing Methods 0.000 description 7
- 230000003028 elevating effect Effects 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 238000007670 refining Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 238000007788 roughening Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 208000004350 Strabismus Diseases 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
- B24B47/225—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation for bevelling optical work, e.g. lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010109645A JP5491273B2 (ja) | 2010-05-11 | 2010-05-11 | ウェーハの面取り装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201206636A TW201206636A (en) | 2012-02-16 |
| TWI499482B true TWI499482B (zh) | 2015-09-11 |
Family
ID=44914218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100115556A TWI499482B (zh) | 2010-05-11 | 2011-05-04 | 晶圓之倒角裝置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5491273B2 (enExample) |
| KR (1) | KR101598657B1 (enExample) |
| CN (1) | CN102869476B (enExample) |
| TW (1) | TWI499482B (enExample) |
| WO (1) | WO2011142159A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6099960B2 (ja) * | 2012-12-18 | 2017-03-22 | ダイトエレクトロン株式会社 | ウェーハの面取り加工方法およびウェーハの面取り装置 |
| JP6007889B2 (ja) * | 2013-12-03 | 2016-10-19 | 信越半導体株式会社 | 面取り加工装置及びノッチレスウェーハの製造方法 |
| JP6141814B2 (ja) * | 2014-10-30 | 2017-06-07 | 信越半導体株式会社 | 研磨装置 |
| KR101578713B1 (ko) * | 2015-06-22 | 2015-12-18 | 황정하 | 광학렌즈의 양면 모따기 장치 |
| JP6614978B2 (ja) * | 2016-01-14 | 2019-12-04 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
| JP6774263B2 (ja) * | 2016-08-19 | 2020-10-21 | 株式会社ディスコ | 切削装置 |
| CN106181681A (zh) * | 2016-08-31 | 2016-12-07 | 天通银厦新材料有限公司 | 一种蓝宝石加工用精确打磨装置 |
| EP3581331B1 (en) | 2018-06-13 | 2022-07-20 | W-M GLASS Sp. z o.o. | Set of discs for grinding the edges of glass plates |
| CN109333222B (zh) * | 2018-11-01 | 2023-06-27 | 浙江中晶新材料研究有限公司 | 一种全自动硅片倒角加工设备及其加工工艺 |
| JP7153578B2 (ja) * | 2019-01-29 | 2022-10-14 | 信越半導体株式会社 | シリコンウェーハの製造方法 |
| JP7016032B2 (ja) | 2019-09-24 | 2022-02-04 | 日亜化学工業株式会社 | 半導体素子の製造方法 |
| CN114888983B (zh) * | 2022-05-31 | 2025-03-04 | 杭州中为光电技术有限公司 | 硅片自动倒角清洗一体化设备 |
| CN116673817B (zh) * | 2023-06-08 | 2025-09-02 | 芜湖众源复合新材料有限公司 | 一种机械零件边角的打磨设备 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006110642A (ja) * | 2004-10-12 | 2006-04-27 | Shiraitekku:Kk | 研磨装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2554432B2 (ja) * | 1992-11-20 | 1996-11-13 | 住友シチックス株式会社 | 半導体ウエーハの外周面加工装置 |
| CN2186135Y (zh) * | 1994-03-04 | 1994-12-28 | 廖胜钦 | 多轴式圆形玻璃磨斜边机 |
| JP2882458B2 (ja) | 1994-11-28 | 1999-04-12 | 株式会社東京精密 | ウェーハ面取り機 |
| JPH1177501A (ja) * | 1997-09-05 | 1999-03-23 | Asahi Glass Co Ltd | ガラス板端部の加工方法 |
| ITMI991382A1 (it) * | 1999-06-21 | 2000-12-21 | Bavelloni Z Spa | Macchina automatica bilaterale per la lavorazione dei bordi di lastredi vetro materiali lapidei e simili |
| JP4323058B2 (ja) | 2000-04-24 | 2009-09-02 | エムテック株式会社 | ウェーハのノッチの研摩装置 |
| JP4013778B2 (ja) * | 2003-02-04 | 2007-11-28 | 坂東機工株式会社 | ガラス板の加工装置 |
| JP5112703B2 (ja) | 2007-01-18 | 2013-01-09 | ダイトエレクトロン株式会社 | ウェーハ面取り加工方法およびその装置 |
| KR100905094B1 (ko) * | 2007-08-01 | 2009-06-30 | 주식회사 에스에프에이 | 웨이퍼 연마장치 |
| JP5304020B2 (ja) * | 2008-05-14 | 2013-10-02 | 新東工業株式会社 | 板状部材の端面の加工方法 |
| JP4758457B2 (ja) * | 2008-05-22 | 2011-08-31 | 株式会社東京精密 | ウェーハ面取り装置 |
| JP5434014B2 (ja) * | 2008-08-22 | 2014-03-05 | 坂東機工株式会社 | ガラス板の加工方法及びガラス板加工装置 |
-
2010
- 2010-05-11 JP JP2010109645A patent/JP5491273B2/ja active Active
-
2011
- 2011-02-28 WO PCT/JP2011/054445 patent/WO2011142159A1/ja not_active Ceased
- 2011-02-28 KR KR1020127029505A patent/KR101598657B1/ko active Active
- 2011-02-28 CN CN201180022063.1A patent/CN102869476B/zh active Active
- 2011-05-04 TW TW100115556A patent/TWI499482B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006110642A (ja) * | 2004-10-12 | 2006-04-27 | Shiraitekku:Kk | 研磨装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101598657B1 (ko) | 2016-02-29 |
| WO2011142159A1 (ja) | 2011-11-17 |
| JP5491273B2 (ja) | 2014-05-14 |
| TW201206636A (en) | 2012-02-16 |
| CN102869476B (zh) | 2015-08-19 |
| CN102869476A (zh) | 2013-01-09 |
| JP2011235406A (ja) | 2011-11-24 |
| KR20130092401A (ko) | 2013-08-20 |
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