JP5491273B2 - ウェーハの面取り装置 - Google Patents

ウェーハの面取り装置 Download PDF

Info

Publication number
JP5491273B2
JP5491273B2 JP2010109645A JP2010109645A JP5491273B2 JP 5491273 B2 JP5491273 B2 JP 5491273B2 JP 2010109645 A JP2010109645 A JP 2010109645A JP 2010109645 A JP2010109645 A JP 2010109645A JP 5491273 B2 JP5491273 B2 JP 5491273B2
Authority
JP
Japan
Prior art keywords
wafer
processing
chamfering
grindstone
tables
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010109645A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011235406A5 (enExample
JP2011235406A (ja
Inventor
一郎 片山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daitron Co Ltd
Original Assignee
Daito Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daito Electron Co Ltd filed Critical Daito Electron Co Ltd
Priority to JP2010109645A priority Critical patent/JP5491273B2/ja
Priority to KR1020127029505A priority patent/KR101598657B1/ko
Priority to CN201180022063.1A priority patent/CN102869476B/zh
Priority to PCT/JP2011/054445 priority patent/WO2011142159A1/ja
Priority to TW100115556A priority patent/TWI499482B/zh
Publication of JP2011235406A publication Critical patent/JP2011235406A/ja
Publication of JP2011235406A5 publication Critical patent/JP2011235406A5/ja
Application granted granted Critical
Publication of JP5491273B2 publication Critical patent/JP5491273B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B24B47/225—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation for bevelling optical work, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2010109645A 2010-05-11 2010-05-11 ウェーハの面取り装置 Active JP5491273B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010109645A JP5491273B2 (ja) 2010-05-11 2010-05-11 ウェーハの面取り装置
KR1020127029505A KR101598657B1 (ko) 2010-05-11 2011-02-28 웨이퍼의 모따기 장치
CN201180022063.1A CN102869476B (zh) 2010-05-11 2011-02-28 圆片的倒角装置
PCT/JP2011/054445 WO2011142159A1 (ja) 2010-05-11 2011-02-28 ウェーハの面取り装置
TW100115556A TWI499482B (zh) 2010-05-11 2011-05-04 晶圓之倒角裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010109645A JP5491273B2 (ja) 2010-05-11 2010-05-11 ウェーハの面取り装置

Publications (3)

Publication Number Publication Date
JP2011235406A JP2011235406A (ja) 2011-11-24
JP2011235406A5 JP2011235406A5 (enExample) 2013-05-23
JP5491273B2 true JP5491273B2 (ja) 2014-05-14

Family

ID=44914218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010109645A Active JP5491273B2 (ja) 2010-05-11 2010-05-11 ウェーハの面取り装置

Country Status (5)

Country Link
JP (1) JP5491273B2 (enExample)
KR (1) KR101598657B1 (enExample)
CN (1) CN102869476B (enExample)
TW (1) TWI499482B (enExample)
WO (1) WO2011142159A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6099960B2 (ja) * 2012-12-18 2017-03-22 ダイトエレクトロン株式会社 ウェーハの面取り加工方法およびウェーハの面取り装置
JP6007889B2 (ja) * 2013-12-03 2016-10-19 信越半導体株式会社 面取り加工装置及びノッチレスウェーハの製造方法
JP6141814B2 (ja) * 2014-10-30 2017-06-07 信越半導体株式会社 研磨装置
KR101578713B1 (ko) * 2015-06-22 2015-12-18 황정하 광학렌즈의 양면 모따기 장치
JP6614978B2 (ja) * 2016-01-14 2019-12-04 株式会社荏原製作所 研磨装置及び研磨方法
JP6774263B2 (ja) * 2016-08-19 2020-10-21 株式会社ディスコ 切削装置
CN106181681A (zh) * 2016-08-31 2016-12-07 天通银厦新材料有限公司 一种蓝宝石加工用精确打磨装置
EP3581331B1 (en) 2018-06-13 2022-07-20 W-M GLASS Sp. z o.o. Set of discs for grinding the edges of glass plates
CN109333222B (zh) * 2018-11-01 2023-06-27 浙江中晶新材料研究有限公司 一种全自动硅片倒角加工设备及其加工工艺
JP7153578B2 (ja) * 2019-01-29 2022-10-14 信越半導体株式会社 シリコンウェーハの製造方法
JP7016032B2 (ja) 2019-09-24 2022-02-04 日亜化学工業株式会社 半導体素子の製造方法
CN114888983B (zh) * 2022-05-31 2025-03-04 杭州中为光电技术有限公司 硅片自动倒角清洗一体化设备
CN116673817B (zh) * 2023-06-08 2025-09-02 芜湖众源复合新材料有限公司 一种机械零件边角的打磨设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2554432B2 (ja) * 1992-11-20 1996-11-13 住友シチックス株式会社 半導体ウエーハの外周面加工装置
CN2186135Y (zh) * 1994-03-04 1994-12-28 廖胜钦 多轴式圆形玻璃磨斜边机
JP2882458B2 (ja) 1994-11-28 1999-04-12 株式会社東京精密 ウェーハ面取り機
JPH1177501A (ja) * 1997-09-05 1999-03-23 Asahi Glass Co Ltd ガラス板端部の加工方法
ITMI991382A1 (it) * 1999-06-21 2000-12-21 Bavelloni Z Spa Macchina automatica bilaterale per la lavorazione dei bordi di lastredi vetro materiali lapidei e simili
JP4323058B2 (ja) 2000-04-24 2009-09-02 エムテック株式会社 ウェーハのノッチの研摩装置
JP4013778B2 (ja) * 2003-02-04 2007-11-28 坂東機工株式会社 ガラス板の加工装置
JP2006110642A (ja) * 2004-10-12 2006-04-27 Shiraitekku:Kk 研磨装置
JP5112703B2 (ja) 2007-01-18 2013-01-09 ダイトエレクトロン株式会社 ウェーハ面取り加工方法およびその装置
KR100905094B1 (ko) * 2007-08-01 2009-06-30 주식회사 에스에프에이 웨이퍼 연마장치
JP5304020B2 (ja) * 2008-05-14 2013-10-02 新東工業株式会社 板状部材の端面の加工方法
JP4758457B2 (ja) * 2008-05-22 2011-08-31 株式会社東京精密 ウェーハ面取り装置
JP5434014B2 (ja) * 2008-08-22 2014-03-05 坂東機工株式会社 ガラス板の加工方法及びガラス板加工装置

Also Published As

Publication number Publication date
KR101598657B1 (ko) 2016-02-29
WO2011142159A1 (ja) 2011-11-17
TW201206636A (en) 2012-02-16
CN102869476B (zh) 2015-08-19
CN102869476A (zh) 2013-01-09
JP2011235406A (ja) 2011-11-24
KR20130092401A (ko) 2013-08-20
TWI499482B (zh) 2015-09-11

Similar Documents

Publication Publication Date Title
JP5491273B2 (ja) ウェーハの面取り装置
JP6336772B2 (ja) 研削研磨装置
JP5461104B2 (ja) 保持テーブルおよび研削装置
JP2004207606A (ja) ウェーハサポートプレート
JP6099960B2 (ja) ウェーハの面取り加工方法およびウェーハの面取り装置
TWI735649B (zh) 磨削裝置
JP2007173487A (ja) ウエーハの加工方法および装置
JP7516528B2 (ja) 厚み測定装置及び厚み測定方法
JPWO2020153219A1 (ja) 加工装置及び加工方法
JP6552930B2 (ja) 研削装置
CN110809816A (zh) 磨削装置、磨削方法以及计算机存储介质
JP6598668B2 (ja) 研削装置
TWI806935B (zh) 基板處理系統、基板處理方法、基板處理程式及電腦記錄媒體
JP7451043B2 (ja) 被加工物の研削方法及び研削装置
JP2009160705A (ja) ウェーハの研削方法および研削加工装置
JP2014226767A (ja) ウェーハ面取り装置及びウェーハ面取り方法
JP5926042B2 (ja) 板状基板の割れ検知方法
JP2011235388A (ja) 研削された被加工物の厚み計測方法および研削装置
JP2012169487A (ja) 研削装置
JP2011143516A (ja) 加工装置
JP5261125B2 (ja) チャックテーブルの原点高さ位置検出方法
JP2017204606A (ja) ウエーハ製造方法
JP2011125987A (ja) 研削装置
TW202346024A (zh) 研削裝置以及晶圓的研削方法
JP5973284B2 (ja) 研削装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130404

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130405

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140225

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140227

R150 Certificate of patent or registration of utility model

Ref document number: 5491273

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250