TWI483336B - Processing device - Google Patents
Processing device Download PDFInfo
- Publication number
- TWI483336B TWI483336B TW099118379A TW99118379A TWI483336B TW I483336 B TWI483336 B TW I483336B TW 099118379 A TW099118379 A TW 099118379A TW 99118379 A TW99118379 A TW 99118379A TW I483336 B TWI483336 B TW I483336B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing
- substrate
- time
- chamber
- speed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/42—Recording and playback systems, i.e. in which the program is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0612—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39527—Workpiece detector, sensor mounted in, near hand, gripper
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009137500A JP5428556B2 (ja) | 2009-06-08 | 2009-06-08 | 処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201117312A TW201117312A (en) | 2011-05-16 |
| TWI483336B true TWI483336B (zh) | 2015-05-01 |
Family
ID=43263892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099118379A TWI483336B (zh) | 2009-06-08 | 2010-06-07 | Processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5428556B2 (https=) |
| KR (1) | KR101234099B1 (https=) |
| CN (1) | CN101908469B (https=) |
| TW (1) | TWI483336B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5987796B2 (ja) | 2013-07-24 | 2016-09-07 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| KR101842121B1 (ko) | 2016-08-03 | 2018-03-26 | 세메스 주식회사 | 기판 처리 장치 및 이의 구동 속도 제어 방법 |
| CN115020173B (zh) * | 2022-08-10 | 2022-10-28 | 江苏邑文微电子科技有限公司 | 电感耦合等离子体刻蚀系统及其刻蚀控制方法 |
| WO2026062907A1 (ja) * | 2024-09-20 | 2026-03-26 | 株式会社日立ハイテク | 基板処理装置及び搬送計画の作成方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142382A (ja) * | 1993-11-18 | 1995-06-02 | Nikon Corp | 基板搬送装置 |
| JPH11130255A (ja) * | 1997-10-24 | 1999-05-18 | Sharp Corp | 基板搬送移載装置 |
| JP2003007587A (ja) * | 2001-06-20 | 2003-01-10 | Tokyo Electron Ltd | 基板処理装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3485990B2 (ja) * | 1995-02-09 | 2004-01-13 | 東京エレクトロン株式会社 | 搬送方法及び搬送装置 |
| JP3811204B2 (ja) | 1995-10-27 | 2006-08-16 | 大日本スクリーン製造株式会社 | 基板処理装置の制御方法 |
| JPH10284574A (ja) * | 1997-03-31 | 1998-10-23 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
| JP2000031237A (ja) * | 1998-07-09 | 2000-01-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2007194481A (ja) | 2006-01-20 | 2007-08-02 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP4790451B2 (ja) * | 2006-03-08 | 2011-10-12 | 住友精密工業株式会社 | 基板処理装置 |
| JP4313824B2 (ja) * | 2007-03-23 | 2009-08-12 | 東京エレクトロン株式会社 | 基板移載装置及び基板移載方法並びに記憶媒体 |
| JP2009049200A (ja) * | 2007-08-20 | 2009-03-05 | Tokyo Electron Ltd | 基板処理装置、基板処理方法及び記憶媒体 |
-
2009
- 2009-06-08 JP JP2009137500A patent/JP5428556B2/ja not_active Expired - Fee Related
-
2010
- 2010-04-07 KR KR1020100031642A patent/KR101234099B1/ko not_active Expired - Fee Related
- 2010-05-28 CN CN2010101887457A patent/CN101908469B/zh not_active Expired - Fee Related
- 2010-06-07 TW TW099118379A patent/TWI483336B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142382A (ja) * | 1993-11-18 | 1995-06-02 | Nikon Corp | 基板搬送装置 |
| JPH11130255A (ja) * | 1997-10-24 | 1999-05-18 | Sharp Corp | 基板搬送移載装置 |
| JP2003007587A (ja) * | 2001-06-20 | 2003-01-10 | Tokyo Electron Ltd | 基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101908469B (zh) | 2013-07-24 |
| KR20100131913A (ko) | 2010-12-16 |
| TW201117312A (en) | 2011-05-16 |
| JP5428556B2 (ja) | 2014-02-26 |
| JP2010283285A (ja) | 2010-12-16 |
| CN101908469A (zh) | 2010-12-08 |
| KR101234099B1 (ko) | 2013-02-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |