CN101908469B - 处理装置 - Google Patents

处理装置 Download PDF

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Publication number
CN101908469B
CN101908469B CN2010101887457A CN201010188745A CN101908469B CN 101908469 B CN101908469 B CN 101908469B CN 2010101887457 A CN2010101887457 A CN 2010101887457A CN 201010188745 A CN201010188745 A CN 201010188745A CN 101908469 B CN101908469 B CN 101908469B
Authority
CN
China
Prior art keywords
substrate
time
conveying
processing
conveying mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010101887457A
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English (en)
Chinese (zh)
Other versions
CN101908469A (zh
Inventor
驹田秀树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101908469A publication Critical patent/CN101908469A/zh
Application granted granted Critical
Publication of CN101908469B publication Critical patent/CN101908469B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/42—Recording and playback systems, i.e. in which the program is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39527—Workpiece detector, sensor mounted in, near hand, gripper
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CN2010101887457A 2009-06-08 2010-05-28 处理装置 Expired - Fee Related CN101908469B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-137500 2009-06-08
JP2009137500A JP5428556B2 (ja) 2009-06-08 2009-06-08 処理装置

Publications (2)

Publication Number Publication Date
CN101908469A CN101908469A (zh) 2010-12-08
CN101908469B true CN101908469B (zh) 2013-07-24

Family

ID=43263892

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101887457A Expired - Fee Related CN101908469B (zh) 2009-06-08 2010-05-28 处理装置

Country Status (4)

Country Link
JP (1) JP5428556B2 (https=)
KR (1) KR101234099B1 (https=)
CN (1) CN101908469B (https=)
TW (1) TWI483336B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5987796B2 (ja) 2013-07-24 2016-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR101842121B1 (ko) 2016-08-03 2018-03-26 세메스 주식회사 기판 처리 장치 및 이의 구동 속도 제어 방법
CN115020173B (zh) * 2022-08-10 2022-10-28 江苏邑文微电子科技有限公司 电感耦合等离子体刻蚀系统及其刻蚀控制方法
WO2026062907A1 (ja) * 2024-09-20 2026-03-26 株式会社日立ハイテク 基板処理装置及び搬送計画の作成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101034660A (zh) * 2006-03-08 2007-09-12 住友精密工业株式会社 基板处理装置
CN101271857A (zh) * 2007-03-23 2008-09-24 东京毅力科创株式会社 基板移载装置、基板移载方法和存储介质

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3362487B2 (ja) * 1993-11-18 2003-01-07 株式会社ニコン 基板搬送装置および露光装置、ならびに露光方法
JP3485990B2 (ja) * 1995-02-09 2004-01-13 東京エレクトロン株式会社 搬送方法及び搬送装置
JP3811204B2 (ja) 1995-10-27 2006-08-16 大日本スクリーン製造株式会社 基板処理装置の制御方法
JPH10284574A (ja) * 1997-03-31 1998-10-23 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置
JP2000031237A (ja) * 1998-07-09 2000-01-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003007587A (ja) * 2001-06-20 2003-01-10 Tokyo Electron Ltd 基板処理装置
JP2007194481A (ja) 2006-01-20 2007-08-02 Hitachi Kokusai Electric Inc 基板処理装置
JP2009049200A (ja) * 2007-08-20 2009-03-05 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101034660A (zh) * 2006-03-08 2007-09-12 住友精密工业株式会社 基板处理装置
CN101271857A (zh) * 2007-03-23 2008-09-24 东京毅力科创株式会社 基板移载装置、基板移载方法和存储介质

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平8-222618A 1996.08.30

Also Published As

Publication number Publication date
KR20100131913A (ko) 2010-12-16
TW201117312A (en) 2011-05-16
JP5428556B2 (ja) 2014-02-26
JP2010283285A (ja) 2010-12-16
CN101908469A (zh) 2010-12-08
KR101234099B1 (ko) 2013-02-19
TWI483336B (zh) 2015-05-01

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130724

Termination date: 20170528

CF01 Termination of patent right due to non-payment of annual fee