KR101234099B1 - 처리 장치 - Google Patents

처리 장치 Download PDF

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Publication number
KR101234099B1
KR101234099B1 KR1020100031642A KR20100031642A KR101234099B1 KR 101234099 B1 KR101234099 B1 KR 101234099B1 KR 1020100031642 A KR1020100031642 A KR 1020100031642A KR 20100031642 A KR20100031642 A KR 20100031642A KR 101234099 B1 KR101234099 B1 KR 101234099B1
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KR
South Korea
Prior art keywords
substrate
time
processing
chamber
conveyance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020100031642A
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English (en)
Korean (ko)
Other versions
KR20100131913A (ko
Inventor
히데키 코마다
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20100131913A publication Critical patent/KR20100131913A/ko
Application granted granted Critical
Publication of KR101234099B1 publication Critical patent/KR101234099B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/42—Recording and playback systems, i.e. in which the program is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39527—Workpiece detector, sensor mounted in, near hand, gripper
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020100031642A 2009-06-08 2010-04-07 처리 장치 Expired - Fee Related KR101234099B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009137500A JP5428556B2 (ja) 2009-06-08 2009-06-08 処理装置
JPJP-P-2009-137500 2009-06-08

Publications (2)

Publication Number Publication Date
KR20100131913A KR20100131913A (ko) 2010-12-16
KR101234099B1 true KR101234099B1 (ko) 2013-02-19

Family

ID=43263892

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100031642A Expired - Fee Related KR101234099B1 (ko) 2009-06-08 2010-04-07 처리 장치

Country Status (4)

Country Link
JP (1) JP5428556B2 (https=)
KR (1) KR101234099B1 (https=)
CN (1) CN101908469B (https=)
TW (1) TWI483336B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5987796B2 (ja) 2013-07-24 2016-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR101842121B1 (ko) 2016-08-03 2018-03-26 세메스 주식회사 기판 처리 장치 및 이의 구동 속도 제어 방법
CN115020173B (zh) * 2022-08-10 2022-10-28 江苏邑文微电子科技有限公司 电感耦合等离子体刻蚀系统及其刻蚀控制方法
WO2026062907A1 (ja) * 2024-09-20 2026-03-26 株式会社日立ハイテク 基板処理装置及び搬送計画の作成方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10284574A (ja) * 1997-03-31 1998-10-23 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP3811204B2 (ja) 1995-10-27 2006-08-16 大日本スクリーン製造株式会社 基板処理装置の制御方法
JP2007194481A (ja) 2006-01-20 2007-08-02 Hitachi Kokusai Electric Inc 基板処理装置
JP2009049200A (ja) * 2007-08-20 2009-03-05 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3362487B2 (ja) * 1993-11-18 2003-01-07 株式会社ニコン 基板搬送装置および露光装置、ならびに露光方法
JP3485990B2 (ja) * 1995-02-09 2004-01-13 東京エレクトロン株式会社 搬送方法及び搬送装置
JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置
JP2000031237A (ja) * 1998-07-09 2000-01-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003007587A (ja) * 2001-06-20 2003-01-10 Tokyo Electron Ltd 基板処理装置
JP4790451B2 (ja) * 2006-03-08 2011-10-12 住友精密工業株式会社 基板処理装置
JP4313824B2 (ja) * 2007-03-23 2009-08-12 東京エレクトロン株式会社 基板移載装置及び基板移載方法並びに記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3811204B2 (ja) 1995-10-27 2006-08-16 大日本スクリーン製造株式会社 基板処理装置の制御方法
JPH10284574A (ja) * 1997-03-31 1998-10-23 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2007194481A (ja) 2006-01-20 2007-08-02 Hitachi Kokusai Electric Inc 基板処理装置
JP2009049200A (ja) * 2007-08-20 2009-03-05 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体

Also Published As

Publication number Publication date
CN101908469B (zh) 2013-07-24
KR20100131913A (ko) 2010-12-16
TW201117312A (en) 2011-05-16
JP5428556B2 (ja) 2014-02-26
JP2010283285A (ja) 2010-12-16
CN101908469A (zh) 2010-12-08
TWI483336B (zh) 2015-05-01

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