TWI475630B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI475630B
TWI475630B TW101105681A TW101105681A TWI475630B TW I475630 B TWI475630 B TW I475630B TW 101105681 A TW101105681 A TW 101105681A TW 101105681 A TW101105681 A TW 101105681A TW I475630 B TWI475630 B TW I475630B
Authority
TW
Taiwan
Prior art keywords
substrate
unit
processing
transport
transport mechanism
Prior art date
Application number
TW101105681A
Other languages
English (en)
Chinese (zh)
Other versions
TW201243986A (en
Inventor
西村和浩
中村靖
川松康夫
近森隆一
Original Assignee
斯克林半導體科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 斯克林半導體科技有限公司 filed Critical 斯克林半導體科技有限公司
Publication of TW201243986A publication Critical patent/TW201243986A/zh
Application granted granted Critical
Publication of TWI475630B publication Critical patent/TWI475630B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H10P76/204—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/60—Arrangements for mounting, supporting or holding spraying apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H10P72/0456—
    • H10P72/0458—
    • H10P72/3302—
    • H10P72/3404—
    • H10P72/3412—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Robotics (AREA)
TW101105681A 2011-03-29 2012-02-21 基板處理裝置 TWI475630B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011071376A JP5666361B2 (ja) 2011-03-29 2011-03-29 基板処理装置

Publications (2)

Publication Number Publication Date
TW201243986A TW201243986A (en) 2012-11-01
TWI475630B true TWI475630B (zh) 2015-03-01

Family

ID=46926850

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101105681A TWI475630B (zh) 2011-03-29 2012-02-21 基板處理裝置
TW104102427A TWI571955B (zh) 2011-03-29 2012-02-21 基板處理裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104102427A TWI571955B (zh) 2011-03-29 2012-02-21 基板處理裝置

Country Status (4)

Country Link
US (2) US9494877B2 (enExample)
JP (1) JP5666361B2 (enExample)
KR (1) KR101333881B1 (enExample)
TW (2) TWI475630B (enExample)

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Publication number Priority date Publication date Assignee Title
KR101690970B1 (ko) * 2010-02-19 2016-12-29 주성엔지니어링(주) 기판 처리 시스템 및 기판 반송 방법
US8985929B2 (en) * 2011-09-22 2015-03-24 Tokyo Electron Limited Substrate processing apparatus, substrate processing method and storage medium
JP6099449B2 (ja) 2013-03-25 2017-03-22 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
KR102413131B1 (ko) * 2015-06-19 2022-06-24 주식회사 에이씨엔 건식처리와 습식처리를 위한 하이브리드 기판처리 시스템 및 이를 이용한 기판처리 방법
JP6503281B2 (ja) 2015-11-13 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN110943018B (zh) 2018-09-21 2024-12-27 株式会社斯库林集团 衬底处理装置及衬底处理方法
JP7300817B2 (ja) * 2018-09-21 2023-06-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置の制御方法
JP7185461B2 (ja) 2018-09-21 2022-12-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および、基板処理装置の制御方法
JP7190979B2 (ja) * 2018-09-21 2022-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7190900B2 (ja) * 2018-12-28 2022-12-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、キャリア搬送方法およびキャリアバッファ装置
KR102008509B1 (ko) * 2019-06-14 2019-08-07 ㈜ 엘에이티 디스플레이용 글라스 기판 온도조절시스템
JP7050735B2 (ja) * 2019-10-02 2022-04-08 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法
CN113611646B (zh) * 2021-08-27 2024-04-16 沈阳芯源微电子设备股份有限公司 晶圆搬运装置及晶圆搬运方法

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TW200802559A (en) * 2005-12-26 2008-01-01 Sokudo Co Ltd Method of processing substrate, substrate processing system and substrate processing apparatus
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JP2004014966A (ja) * 2002-06-11 2004-01-15 Dainippon Screen Mfg Co Ltd 基板処理装置
TW200802559A (en) * 2005-12-26 2008-01-01 Sokudo Co Ltd Method of processing substrate, substrate processing system and substrate processing apparatus
TW201005865A (en) * 2008-06-04 2010-02-01 Ebara Corp Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

Also Published As

Publication number Publication date
US20170008017A1 (en) 2017-01-12
TWI571955B (zh) 2017-02-21
JP2012209288A (ja) 2012-10-25
TW201517204A (zh) 2015-05-01
KR101333881B1 (ko) 2013-11-27
US9494877B2 (en) 2016-11-15
US20120249990A1 (en) 2012-10-04
US10216099B2 (en) 2019-02-26
TW201243986A (en) 2012-11-01
KR20120112012A (ko) 2012-10-11
JP5666361B2 (ja) 2015-02-12

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