TWI470721B - A substrate holder, a substrate handling device, and a substrate processing system - Google Patents
A substrate holder, a substrate handling device, and a substrate processing system Download PDFInfo
- Publication number
- TWI470721B TWI470721B TW97147411A TW97147411A TWI470721B TW I470721 B TWI470721 B TW I470721B TW 97147411 A TW97147411 A TW 97147411A TW 97147411 A TW97147411 A TW 97147411A TW I470721 B TWI470721 B TW I470721B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- support
- substrate holder
- main body
- protective member
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0075—Means for protecting the manipulator from its environment or vice versa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Robotics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007315397A JP5059573B2 (ja) | 2007-12-06 | 2007-12-06 | 基板保持具、基板搬送装置および基板処理システム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200941627A TW200941627A (en) | 2009-10-01 |
TWI470721B true TWI470721B (zh) | 2015-01-21 |
Family
ID=40733267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97147411A TWI470721B (zh) | 2007-12-06 | 2008-12-05 | A substrate holder, a substrate handling device, and a substrate processing system |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5059573B2 (ja) |
KR (2) | KR101196126B1 (ja) |
CN (2) | CN102556662A (ja) |
TW (1) | TWI470721B (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101208644B1 (ko) * | 2009-07-03 | 2012-12-06 | 도쿄엘렉트론가부시키가이샤 | 위치 이탈 방지 장치, 이를 구비한 기판 보지구, 기판 반송 장치 및 기판 반송 방법 |
JP5357694B2 (ja) * | 2009-07-03 | 2013-12-04 | 東京エレクトロン株式会社 | 位置ずれ防止装置、これを備えた基板保持具、基板搬送装置および基板搬送方法 |
JP5480605B2 (ja) * | 2009-12-01 | 2014-04-23 | 東京エレクトロン株式会社 | 基板搬送装置および基板処理システム |
JP5425656B2 (ja) * | 2010-02-15 | 2014-02-26 | 東京エレクトロン株式会社 | 基板処理装置及びロードロック装置 |
JP5746483B2 (ja) * | 2010-07-13 | 2015-07-08 | 日本電産サンキョー株式会社 | 産業用ロボット |
KR101265685B1 (ko) * | 2011-04-01 | 2013-05-22 | (주) 청심이엔지 | 글래스 운반용 로봇 핸드 |
JP2013074112A (ja) * | 2011-09-28 | 2013-04-22 | Yaskawa Electric Corp | ハンドおよび基板搬送装置 |
CN102642714B (zh) * | 2012-04-27 | 2015-02-18 | 深圳市华星光电技术有限公司 | 基板移运装置 |
CN102674007B (zh) * | 2012-04-27 | 2015-05-20 | 深圳市华星光电技术有限公司 | 液晶面板搬运方法及搬运装置 |
KR101479930B1 (ko) * | 2012-11-21 | 2015-01-12 | 주식회사 에스에프에이 | 멀티태스킹 스토커 시스템 |
JP6126396B2 (ja) * | 2013-02-07 | 2017-05-10 | 三星ダイヤモンド工業株式会社 | 基板加工装置 |
US9004564B2 (en) * | 2013-03-13 | 2015-04-14 | Varian Semiconductor Equipment Associates, Inc. | Wafer handling apparatus |
WO2015174256A1 (ja) * | 2014-05-16 | 2015-11-19 | 日本電産サンキョー株式会社 | 産業用ロボットのハンドおよび産業用ロボット |
JP6456065B2 (ja) * | 2014-05-16 | 2019-01-23 | 日本電産サンキョー株式会社 | 産業用ロボットのハンドおよび産業用ロボット |
CN104444351B (zh) | 2014-11-07 | 2016-11-02 | 京东方科技集团股份有限公司 | 机械手臂及基板拾取装置 |
CN104440950B (zh) * | 2014-11-17 | 2016-03-16 | 上海华力微电子有限公司 | 一种炉管用传片机械手的保护装置及保护方法 |
JP6594177B2 (ja) * | 2015-11-24 | 2019-10-23 | 平田機工株式会社 | ハンド部材およびハンド |
TWI725115B (zh) * | 2016-01-29 | 2021-04-21 | 日商達誼恆股份有限公司 | 基板移載用機器手 |
CN108493136A (zh) * | 2018-04-26 | 2018-09-04 | 武汉华星光电技术有限公司 | 支撑治具及干蚀刻设备结构 |
CN110556324A (zh) * | 2018-05-31 | 2019-12-10 | 日月光半导体制造股份有限公司 | 转载治具及其使用方法 |
JP7257813B2 (ja) * | 2019-02-21 | 2023-04-14 | 東京エレクトロン株式会社 | 水蒸気処理装置及び水蒸気処理方法 |
JP7325260B2 (ja) * | 2019-08-21 | 2023-08-14 | 株式会社ニューフレアテクノロジー | 真空装置 |
KR102273287B1 (ko) * | 2019-09-27 | 2021-07-07 | (주)선익시스템 | 로봇 핸드 |
CN111334782B (zh) * | 2020-02-28 | 2022-05-27 | 北京北方华创微电子装备有限公司 | 半导体设备及其电极装置 |
TW202211357A (zh) * | 2020-08-17 | 2022-03-16 | 日商東京威力科創股份有限公司 | 搬運裝置、搬運系統、及末端執行器 |
US20220063113A1 (en) * | 2020-08-26 | 2022-03-03 | WaferPath, Inc. | Protective cap for a robot end effector |
JP2023105858A (ja) | 2022-01-20 | 2023-08-01 | 東京エレクトロン株式会社 | 基板支持部材、基板搬送装置及び基板支持部材の製造方法 |
CN115256016B (zh) * | 2022-08-31 | 2023-05-05 | 中品智能机械有限公司 | 数控开料加工中心单元流水线 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11188681A (ja) * | 1997-12-24 | 1999-07-13 | Canon Inc | 基板搬送用ハンド及びその吸着機構 |
TW200539996A (en) * | 2004-04-20 | 2005-12-16 | Nippon Oil Corp | Hand portion of industrial robot and method for making the same |
US20060113806A1 (en) * | 2004-11-29 | 2006-06-01 | Asm Japan K.K. | Wafer transfer mechanism |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11121580A (ja) * | 1997-10-13 | 1999-04-30 | Hitachi Ltd | 板状物体の支持方法及び処理装置 |
KR100306125B1 (ko) * | 1999-03-10 | 2001-09-24 | 윤덕용 | 로봇암의 말단부 |
JP2001176945A (ja) * | 1999-12-16 | 2001-06-29 | Assist Japan Kk | ロボット用ハンドの保護装置 |
JP2003060004A (ja) * | 2001-08-20 | 2003-02-28 | Yaskawa Electric Corp | ロボットハンド |
US7641247B2 (en) * | 2002-12-17 | 2010-01-05 | Applied Materials, Inc. | End effector assembly for supporting a substrate |
JP2004221538A (ja) * | 2002-12-24 | 2004-08-05 | Kyocera Corp | 基板載置治具 |
JP4364001B2 (ja) * | 2004-02-06 | 2009-11-11 | 株式会社ダイヘン | 搬送ロボット |
US7073834B2 (en) * | 2004-06-25 | 2006-07-11 | Applied Materials, Inc. | Multiple section end effector assembly |
KR20060134740A (ko) * | 2005-06-23 | 2006-12-28 | 삼성전자주식회사 | 웨이퍼 이송 장치 |
-
2007
- 2007-12-06 JP JP2007315397A patent/JP5059573B2/ja active Active
-
2008
- 2008-12-04 KR KR1020080122624A patent/KR101196126B1/ko active IP Right Grant
- 2008-12-05 TW TW97147411A patent/TWI470721B/zh active
- 2008-12-08 CN CN2011103712428A patent/CN102556662A/zh active Pending
- 2008-12-08 CN CNA200810185712XA patent/CN101450752A/zh active Pending
-
2011
- 2011-01-17 KR KR1020110004618A patent/KR20110013551A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11188681A (ja) * | 1997-12-24 | 1999-07-13 | Canon Inc | 基板搬送用ハンド及びその吸着機構 |
TW200539996A (en) * | 2004-04-20 | 2005-12-16 | Nippon Oil Corp | Hand portion of industrial robot and method for making the same |
US20060113806A1 (en) * | 2004-11-29 | 2006-06-01 | Asm Japan K.K. | Wafer transfer mechanism |
Also Published As
Publication number | Publication date |
---|---|
JP2009141091A (ja) | 2009-06-25 |
KR20110013551A (ko) | 2011-02-09 |
TW200941627A (en) | 2009-10-01 |
KR101196126B1 (ko) | 2012-10-30 |
KR20090060173A (ko) | 2009-06-11 |
CN102556662A (zh) | 2012-07-11 |
JP5059573B2 (ja) | 2012-10-24 |
CN101450752A (zh) | 2009-06-10 |
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