TWI470721B - A substrate holder, a substrate handling device, and a substrate processing system - Google Patents

A substrate holder, a substrate handling device, and a substrate processing system Download PDF

Info

Publication number
TWI470721B
TWI470721B TW97147411A TW97147411A TWI470721B TW I470721 B TWI470721 B TW I470721B TW 97147411 A TW97147411 A TW 97147411A TW 97147411 A TW97147411 A TW 97147411A TW I470721 B TWI470721 B TW I470721B
Authority
TW
Taiwan
Prior art keywords
substrate
support
substrate holder
main body
protective member
Prior art date
Application number
TW97147411A
Other languages
English (en)
Chinese (zh)
Other versions
TW200941627A (en
Inventor
Hideki Komada
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200941627A publication Critical patent/TW200941627A/zh
Application granted granted Critical
Publication of TWI470721B publication Critical patent/TWI470721B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0075—Means for protecting the manipulator from its environment or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW97147411A 2007-12-06 2008-12-05 A substrate holder, a substrate handling device, and a substrate processing system TWI470721B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007315397A JP5059573B2 (ja) 2007-12-06 2007-12-06 基板保持具、基板搬送装置および基板処理システム

Publications (2)

Publication Number Publication Date
TW200941627A TW200941627A (en) 2009-10-01
TWI470721B true TWI470721B (zh) 2015-01-21

Family

ID=40733267

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97147411A TWI470721B (zh) 2007-12-06 2008-12-05 A substrate holder, a substrate handling device, and a substrate processing system

Country Status (4)

Country Link
JP (1) JP5059573B2 (ja)
KR (2) KR101196126B1 (ja)
CN (2) CN102556662A (ja)
TW (1) TWI470721B (ja)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101208644B1 (ko) * 2009-07-03 2012-12-06 도쿄엘렉트론가부시키가이샤 위치 이탈 방지 장치, 이를 구비한 기판 보지구, 기판 반송 장치 및 기판 반송 방법
JP5357694B2 (ja) * 2009-07-03 2013-12-04 東京エレクトロン株式会社 位置ずれ防止装置、これを備えた基板保持具、基板搬送装置および基板搬送方法
JP5480605B2 (ja) * 2009-12-01 2014-04-23 東京エレクトロン株式会社 基板搬送装置および基板処理システム
JP5425656B2 (ja) * 2010-02-15 2014-02-26 東京エレクトロン株式会社 基板処理装置及びロードロック装置
JP5746483B2 (ja) * 2010-07-13 2015-07-08 日本電産サンキョー株式会社 産業用ロボット
KR101265685B1 (ko) * 2011-04-01 2013-05-22 (주) 청심이엔지 글래스 운반용 로봇 핸드
JP2013074112A (ja) * 2011-09-28 2013-04-22 Yaskawa Electric Corp ハンドおよび基板搬送装置
CN102642714B (zh) * 2012-04-27 2015-02-18 深圳市华星光电技术有限公司 基板移运装置
CN102674007B (zh) * 2012-04-27 2015-05-20 深圳市华星光电技术有限公司 液晶面板搬运方法及搬运装置
KR101479930B1 (ko) * 2012-11-21 2015-01-12 주식회사 에스에프에이 멀티태스킹 스토커 시스템
JP6126396B2 (ja) * 2013-02-07 2017-05-10 三星ダイヤモンド工業株式会社 基板加工装置
US9004564B2 (en) * 2013-03-13 2015-04-14 Varian Semiconductor Equipment Associates, Inc. Wafer handling apparatus
WO2015174256A1 (ja) * 2014-05-16 2015-11-19 日本電産サンキョー株式会社 産業用ロボットのハンドおよび産業用ロボット
JP6456065B2 (ja) * 2014-05-16 2019-01-23 日本電産サンキョー株式会社 産業用ロボットのハンドおよび産業用ロボット
CN104444351B (zh) 2014-11-07 2016-11-02 京东方科技集团股份有限公司 机械手臂及基板拾取装置
CN104440950B (zh) * 2014-11-17 2016-03-16 上海华力微电子有限公司 一种炉管用传片机械手的保护装置及保护方法
JP6594177B2 (ja) * 2015-11-24 2019-10-23 平田機工株式会社 ハンド部材およびハンド
TWI725115B (zh) * 2016-01-29 2021-04-21 日商達誼恆股份有限公司 基板移載用機器手
CN108493136A (zh) * 2018-04-26 2018-09-04 武汉华星光电技术有限公司 支撑治具及干蚀刻设备结构
CN110556324A (zh) * 2018-05-31 2019-12-10 日月光半导体制造股份有限公司 转载治具及其使用方法
JP7257813B2 (ja) * 2019-02-21 2023-04-14 東京エレクトロン株式会社 水蒸気処理装置及び水蒸気処理方法
JP7325260B2 (ja) * 2019-08-21 2023-08-14 株式会社ニューフレアテクノロジー 真空装置
KR102273287B1 (ko) * 2019-09-27 2021-07-07 (주)선익시스템 로봇 핸드
CN111334782B (zh) * 2020-02-28 2022-05-27 北京北方华创微电子装备有限公司 半导体设备及其电极装置
TW202211357A (zh) * 2020-08-17 2022-03-16 日商東京威力科創股份有限公司 搬運裝置、搬運系統、及末端執行器
US20220063113A1 (en) * 2020-08-26 2022-03-03 WaferPath, Inc. Protective cap for a robot end effector
JP2023105858A (ja) 2022-01-20 2023-08-01 東京エレクトロン株式会社 基板支持部材、基板搬送装置及び基板支持部材の製造方法
CN115256016B (zh) * 2022-08-31 2023-05-05 中品智能机械有限公司 数控开料加工中心单元流水线

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11188681A (ja) * 1997-12-24 1999-07-13 Canon Inc 基板搬送用ハンド及びその吸着機構
TW200539996A (en) * 2004-04-20 2005-12-16 Nippon Oil Corp Hand portion of industrial robot and method for making the same
US20060113806A1 (en) * 2004-11-29 2006-06-01 Asm Japan K.K. Wafer transfer mechanism

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11121580A (ja) * 1997-10-13 1999-04-30 Hitachi Ltd 板状物体の支持方法及び処理装置
KR100306125B1 (ko) * 1999-03-10 2001-09-24 윤덕용 로봇암의 말단부
JP2001176945A (ja) * 1999-12-16 2001-06-29 Assist Japan Kk ロボット用ハンドの保護装置
JP2003060004A (ja) * 2001-08-20 2003-02-28 Yaskawa Electric Corp ロボットハンド
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
JP2004221538A (ja) * 2002-12-24 2004-08-05 Kyocera Corp 基板載置治具
JP4364001B2 (ja) * 2004-02-06 2009-11-11 株式会社ダイヘン 搬送ロボット
US7073834B2 (en) * 2004-06-25 2006-07-11 Applied Materials, Inc. Multiple section end effector assembly
KR20060134740A (ko) * 2005-06-23 2006-12-28 삼성전자주식회사 웨이퍼 이송 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11188681A (ja) * 1997-12-24 1999-07-13 Canon Inc 基板搬送用ハンド及びその吸着機構
TW200539996A (en) * 2004-04-20 2005-12-16 Nippon Oil Corp Hand portion of industrial robot and method for making the same
US20060113806A1 (en) * 2004-11-29 2006-06-01 Asm Japan K.K. Wafer transfer mechanism

Also Published As

Publication number Publication date
JP2009141091A (ja) 2009-06-25
KR20110013551A (ko) 2011-02-09
TW200941627A (en) 2009-10-01
KR101196126B1 (ko) 2012-10-30
KR20090060173A (ko) 2009-06-11
CN102556662A (zh) 2012-07-11
JP5059573B2 (ja) 2012-10-24
CN101450752A (zh) 2009-06-10

Similar Documents

Publication Publication Date Title
TWI470721B (zh) A substrate holder, a substrate handling device, and a substrate processing system
TWI409907B (zh) Substrate placement mechanism and substrate transfer method
JP3139155B2 (ja) 真空処理装置
JP5593299B2 (ja) 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP5547147B2 (ja) 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP2007165659A (ja) 基板処理装置、及び該装置の蓋釣支装置
TWI555681B (zh) A position shift preventing device, a substrate holder including the same, a substrate handling device, and a substrate handling method
KR101464039B1 (ko) 기판 반송 용기의 개폐 장치, 덮개의 개폐 장치 및 반도체 제조 장치
CN101312143A (zh) 载置台和使用该载置台的等离子体处理装置
CN101944497B (zh) 防位置偏移装置、具有它的基板保持器、基板输送装置及基板输送方法
TW201302584A (zh) 破損晶圓回收系統
EP3605598A1 (en) Thin-plate substrate holding finger and transfer robot provided with said finger
JP4227623B2 (ja) 半導体処理装置
JP6799147B2 (ja) 基板処理装置
JP2010165998A (ja) 円盤状物把持装置並びに搬送機、移載装置及び搬送方法。
JP4748795B2 (ja) 基板支持体及び基板搬送機構
JP2014150288A (ja) 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
KR20120054004A (ko) 기판 탑재 기구, 기판 처리 장치, 기판 탑재 기구의 제어 방법 및 기억 매체
JP2003068824A (ja) 吸着保持器、搬送装置、基板の搬送方法、及び、電気光学装置の製造方法
JP5427856B2 (ja) 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
WO2003088351A1 (fr) Structure d'orifice dans un dispositif de traitement de semi-conducteur
CN109563616B (zh) 成膜装置
JP3816929B2 (ja) 半導体処理装置
JP2011036980A (ja) 真空吸着ヘッド
WO2015040915A1 (ja) 搬入出装置および搬入出方法