TW200941627A - Substrate holder, substrate conveying device and substrate processing system - Google Patents

Substrate holder, substrate conveying device and substrate processing system Download PDF

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Publication number
TW200941627A
TW200941627A TW097147411A TW97147411A TW200941627A TW 200941627 A TW200941627 A TW 200941627A TW 097147411 A TW097147411 A TW 097147411A TW 97147411 A TW97147411 A TW 97147411A TW 200941627 A TW200941627 A TW 200941627A
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Taiwan
Prior art keywords
substrate
support
substrate holder
holder according
fork
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TW097147411A
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Chinese (zh)
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TWI470721B (en
Inventor
Hideki Komada
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0075—Means for protecting the manipulator from its environment or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

The present invention provides a substrate holding member, a substrate conveying device and a substrate processing system, which may possibly prevent damage of a support member even the substrate holding member with a support member for supporting the substrate contacts with components of the system. A fork section (101) of the substrate holding member comprises a pick-up device base section (117) fixed on a slide member (127); and, such as a four support pick-up device (119) as support member connected with the pick-up device base section (117). The support pick-up device (119) comprises a body (131) with hollow corner barrel shape and a cap body (133) as a protect member freely assembled on the body (131).

Description

200941627 九、發明說明 【發明所屬之技術領域】 本發明係關於在搬運例如平面顯示器（FPD)用之基板 時用以保持此之基板保持具及具備有該基板保持具之基板 搬運裝置以及基板處理系統。 【先前技術】 ❹ 在液晶顯示器（LCD)所代表之FPD之製造過程中，在 真空下對玻璃基板等之基板被施予蝕刻、成膜等之各種處 理。於FPD之製造時使用具備多數基板處理室之所謂的 多腔室類型之基板處理系統。如此之基板處理系統具有配 設搬運基板之基板搬運裝置的搬運室，和被設置在該搬運 室周圍之多數製程腔室。然後，藉由搬運室內之基板搬運 裝置，基板被搬入至各製程腔室內，或是已處理完之基板 自各製程腔室被搬出。基板之搬運通常使用被稱爲叉架 (Fork)之基板保持具。叉架具有在被安裝於可進出、退避 之搬運手臂部上的共同基部上梳齒狀形成多數支持撿取器 之構造。 近來，對FPD用之基板強烈要求大型化，也有以一 邊超過2m之巨大基板當作處理對象之情形。然後，對應 於基板之大型化，上述叉架也大型化。當叉架大型化時， 即使在無載置基板之狀態下，由於其自重，使得從支持撿 取器之基端部到前端部弓狀地產生彎曲。再者，在將大型 基板載置於叉架之狀態下，又施加了基板的荷重。爲了防 -5- 200941627 止如此之彎曲，也執行以高剛性之陶瓷形成叉架。但是’ 因於製造陶瓷零件必須執行燒成工程’故爲了藉由陶瓷製 造大型叉架，必須要有大型燒成爐。爲了解決該問題’在 專利文獻1中，提案有具備肘桿（wrist)部’和與肘桿部結 合之多數終端效應器，該終端效應器係藉由與肘桿部結合 之基部，和與基部結合之前端部而形成之終端效應器組 件。即是，在專利文獻1中，將叉架之支持撿取器以其一 半左右之長度分割成基部和前端部，藉由設成接上兩者之 構造，使得容易製造當作前端部使用之陶瓷零件。 然而，叉架中之支持撿取器之材質係使用CFRP (Carbon Fiber Reinforced Plastics :碳纖維強化塑膠）。輕 量且高剛性之CFRP具有當作支持撿取器之材質爲佳之特 性。但是，就以CFRP之缺點而言，由於強固碳纖維之複 合材料，故有於破損之時有難以修理、修復之問題。再 者，CFRP因碳纖維構成層構造，故也有當損傷時則碳纖 維自其部分剝落，層構造之纖維捲起，容易成爲顆粒產生 源之問題。並且，例如使用CFRP製之支持撿取器而在搬 運途中玻璃基板破損之時，也有當支持撿取器具有損傷 時，微小之玻璃片自此進入至碳纖維間而變得難以除去， 成爲新顆粒產生源之問題。 由上述所舉出之問題，以高價位之CFRP材料所形成 之支持撿取器即使其一部分破損時，則必須更換支持撿取 器之全體。 [專利文獻1]日本特開2006-41496號公報 -6- 200941627 【發明內容】 (發明所欲解決之課題） 隨著叉架之大型化，在基板處理系統內移動叉架之時 的控制，比起使用以往之小型叉架之時，變的更加困難。 因此，支持撿取器之前端接觸於構成基板處理系統之腔室 壁等之系統構成構件而受到損傷之確率較以往增加。於使 〇 用CFRP作爲支持撿取器之材質之時，也避免不了以某程 度之頻率與系統構成構件接觸。 本發明係鑑於上述情形而所硏究出者，其目的爲即使 於具有用以支持基板之支持構件的基板保持具與系統構成 構件接觸之時，亦可以極力迴避支持構件之損傷。 (用以解決課題之手段） 本發明所涉及之基板保持具，具備有基部，和互相隔 © 著間隔連結於上述基部之多數支持構件，在該些多數支持 構件上保持基板。然後，在本發明之基板保持具中，上述 支持構件具備有本體和保護該本體之前端的可裝卸之保護 構件。 在本發明之基板保持具中，上述本體即使構成中空之 筒形狀亦可。此時，本發明之基板保持具即使藉由上述保 護構件塞住上述本體之前端亦可。再者，上述保護構件即 使具有插入至上述本體之內部的凸部亦可。 再者，在本發明之基板保持具中，上述保護構件即使 200941627 具有覆蓋上述本體之前端附近之周圍的被覆部亦可。再 者，在本發明之基板保持具中，上述本體即使由CFRP構 成亦可。 再者，在本發明之基板保持具中，上述保護構件即使， 由金屬或楊氏係數爲1 MPa以上lOGPa以下之高分子材料 所構成亦可。此時，上述金屬即使爲不鏽鋼或鋁亦可，上 述高分子材料即使爲氟橡膠、聚四氟乙烯樹脂或是尼龍樹 脂亦可。 0 再者，本發明之基板保持具即使在上述本體之上面具 有從下方抵接於基板之可裝卸的第1突起部亦可。此時， 即使在上述保護構件之上部，具有從下方抵接於基板之第 2突起部亦可。並且，即使以上述本體之上面爲基準，相 對於上述第1突起部之頂點的高度，上述第2突起部之頂 點的高度被形成較高亦可。再者，上述本體即使具有能夠 可變調節上述第1突起部之配設位置及/或配設數量的多 數安裝部亦可。 ◎ 本發明所涉及之基板搬運裝置具備有可進出及退避之 搬運手臂部，和被安裝於該搬運手臂部之基板保持具，藉 由上述基板保持具保持基板而予以搬運。在該基板搬運裝 置中，上述基板保持具具備基部，和互相隔著間隔而被連 結於上述基部之多數支持構件，然後，在本發明之基板搬 運裝置中，上述支持構件係具備有本體，和保護該本體之 前端的可裝卸之保護構件，或是上述支持構件具有本體， 和保護該本體前端之可裝卸的保護構件，和被設置在上述 -8- 200941627 本體之上面，從下方抵接於基板之可裝卸的突起部。 本發明所涉及之基板處理系統1具備處理基板之基板處 理裝置，和將基板搬運至該基板處理裝置之基板搬運裝 置。在該基板處理系統中，上述基板搬運裝置具備有可進 出及退避之搬運手臂部，和被安裝於該搬運手臂部保持基 板之基板保持具。並且，在該基板處理系統中，上述基板 保持具具備基部，和互相隔著間隔而被連結於上述基部之 Ο 多數支持構件。然後，在本發明之基板處理系統中，上述 支持構件具備有本體和保護該本體之前端的可裝卸之保護 構件。 [發明效果] 若藉由本發明之基板保持具，藉由在支持構件之前端 設置保護構件，即使支持構件接觸於腔室壁等之時，亦可 以保護支持構件，防止支持構件之損傷。因此，達成可以 © 使支持構件之壽命長期化並且可以防止因支持構件之損傷 引起產生顆粒的效果。 【實施方式】 [第1實施型態] 以下，針對本發明之實施型態，參照圖面予以詳細說 明。在此，針對具備有本發明之第1實施型態之基板保持 具的基板搬運裝置以及具備有該基板搬運裝置之基板處理 系統舉例進行說明。第1圖爲槪略性表示當作基板處理系 -9- 200941627 統之真空處理系統100之斜視圖，第2圖爲槪略性表示各 腔室之內部之俯視圖。該真空處理系統100係構成具有多 數製程腔室la、lb、lc之多腔室構造。真空處理系統 100係構成用以對例如FPD用之玻璃基板（以下，單稱爲 「基板」）S執行電漿處理之處理系統。並且，就以FPD 而言例示有液晶顯示器（LCD)、電激發光（Electro Luminescence: EL)顯示器、電漿顯示面板（PDP)等。 真空處理系統100係多數大型腔室俯視觀看時連結成 0 十字形狀。在中央部配置搬運室3，鄰接於其三方之側面 配設有對基板S執行電漿處理之3個製程腔室la、lb、 lc。再者，鄰接於搬運室3之殘留之一方之側面，配設有 裝載鎖定室5。該些3個製程腔室la、lb、lc、搬運室3 及裝載鎖定室5中之任一者皆構成真空腔室。搬運室3和 各製程腔室la、lb、lc之間設置有無圖式之開口部，在 該開口部各配設有具有開關功能之閘閥7a。再者，在搬 運室3和裝載鎖定室5之間配設有閘閥7b。閘閥7a、7b Q 係在關閉狀態下氣密密封各腔室之間，並且在打開狀態下 使腔室間連通而可移送基板S。再者，在裝載鎖定室5和 外部大氣環境之間也配備有閘閥7c，使在關閉狀態下能 夠維持裝載鎖定室5之氣密性，並且在打開狀態下能夠在 裝載鎖定室5和外部之間移送基板S。 在裝載鎖定室5之外側，設置有兩個匣盒指示器 9a、9b。在各匣盒指示器9a、9b上載置有各收容基板S 之匣盒11a、lib。在各匣盒11a、lib內於上下隔著間隔 -10- 200941627 多段配置有基板s。再者，各匣盒lla、lib藉由升降機 構部13a、13b構成各升降自如。在本實施型態中’構成 在例如卡匣11a可以收容未處理基板’在另一方之匣盒 lib可以收容處理完之基板。 在該些兩個匣盒Ha、lib之間設置有用以搬運基板 S之搬運裝置15。該搬運裝置15具備有被設置在上下兩 段當作基板保持具之叉架17a及叉架17b，和可進出、退 ❹ 避及旋轉支持該些叉架17a、叉架17b之驅動部19’和支 持該驅動部19之支持台21。 製程腔室la、lb、lc係被構成可以在其內部空間維 持特定減壓環境（真空狀態）。在各製程腔室la、lb、lc 內如第2圖所示般，配備有當作載置基板S之載置台的承 載器2。然後，各製程腔室la、lb、lc係在將基板S載 置在承載器2之狀態下，對基板S，執行例如真空條件下 之蝕刻處理、灰化處理、成膜處理等之電漿處理。 ® 在本實施型態中，即使以3個製程腔室la、lb、lc 執行同種處理亦可，即使對每製程腔室執行不同種類之處 理亦可。並且，製程腔室之數量並不限定於3個，即使爲 4個以上亦可。 搬運室3係構成與真空處理室之製程腔室U〜“相 同，可以保持於特定減壓環境。在搬運室3中，如第2圖 所示般配設有搬運裝置23。然後，藉由搬運裝置23，在 3個製程腔室la、lb、lc及裝載鎖定室5之間執行基板S 之搬運。 -11 - 200941627 搬運裝置23具備設置成上下兩段之搬運機構，構成 各個獨立而可以執行基板S之搬出搬入。第3圖係表示具 有當作基板保持具之叉架的上段搬運機構23 a之槪略 構成。搬運機構23a主要之構成具備有台座部113，和被 設置成對台座部113可滑動之滑動手臂115，和被設置成 可在該滑動手臂115上滑動，當作支持基板S之支持構件 的叉架101。叉架101具備有當作基部之撿取器基座 117，和被連結於該撿取器基座117之多數（例如4根）的 @ 支持撿取器119。在支持撿取器119之前端設置有當作保 護構件之蓋部133。接著，針對該叉架101之詳細構成於 後說明。 在滑動手臂115之側部設置有用以使滑動手臂115對 台座部113滑動之導件121。然後，在基部113設置有可 滑動地支持導件121之滑動支持部123。 再者，在滑動手臂115之側部，與上述導件121平行 設置有用以使叉架101對滑動手臂1 15滑動之導件125。 © 然後，設置有沿著導件1 25滑動之滑動件1 27，在該滑動 件127安裝有叉架1〇1。 在第3圖中，雖然針對上段之搬運機構23a予以說 明’但是下段之搬運機構（省略圖示）也具有與上段之搬運 機構23a相同之構成。然後，上下之搬運機構藉由無圖示 之連結機構連結，成爲一體構成可以在水平方向旋轉。再 者’構成上下兩段之搬運機構連結於執行滑動手臂115及 叉架101之滑動動作，或台座部113之旋轉動作及升降動 -12- 200941627 作之無圖示之驅動單元。 裝載鎖定室5係被構成與各製程腔室la〜lc及搬運 室3相同可以保持於特定減壓環境。裝載室5爲用以在位 於大氣環境之匣盒11a、lib和減壓環境之搬運室3之間 執行基板S之交接。裝載鎖定室5在反覆大氣環境和減壓 環境之關係上，係構成極力縮小其內容積。在裝載鎖定室 5上下兩段設置有基板收容部27(在第2圖中僅圖示上 〇 段），在各基板收容部27隔著間隔設置有支持基板S之多 數緩衝器28。在該些緩衝器28之間隔成爲梳齒狀之支持 撿取器（例如叉架101之支持叉架11 9)之退避溝。再者， 在裝載鎖定室5內，設置有抵接於矩形狀基板S之互相對 向的角部附近而執行定位之定位器29。 如第2圖所示般，真空處理系統100之各構成部成爲 被連接於控制部30而被控制之構成（在第1圖中省略圖 式）》控制部30具備有：具有CPU之控制器31、使用者 © 介面3 2和記憶部3 3。控制器3 1係在真空處理系統100 中，統籌例如製程腔室la〜lc、搬運裝置15、搬運裝置 23等之各構成部而加以控制。使用者介面32係由工程管 理者爲了管理真空處理系統100執行指令輸入操作等之鍵 盤，或使真空處理系統100之運轉狀況可觀視而所顯示之 顯示器等所構成。記憶部33係保存有處理程式，該處理 程式記錄有用以在控制器31之控制下實現在真空處理系 統1〇〇所實行之各種處理之控制程式（軟體），或處理條件 資料等。使用者介面32及記億部33係被連接於控制器 -13- 200941627 3 1° 然後，依其所需，以來自使用者介面32之指示等自 記憶部3 3叫出任意處理程式，使製程控制器3 1實行，依 此，在製程控制器3 1之控制下，執行在真空處理系統 100中的所欲處理。 上述控制程式或處理條件資料等之處理程式係可以利 用儲存於電腦可讀取之記憶媒體，例如CD-ROM、硬碟、 軟碟、快閃記憶體等之狀態者。或是，亦可自其他裝置經 例如專用迴線隨時傳送而在線上利用。 接著，針對構成上述般之真空處理系統100動作予以 說明。 首先，使搬運裝置15之兩片叉架17a、17b進退驅 動，自收容未處理基板之匣盒11a接取基板S，各載置於 裝載鎖定室5之上下兩段基板收容部27之緩衝器28。 於使叉架17a、17b退避之後，關閉裝載鎖定室5之 大氣側之閘閥7C。之後，使裝載鎖定室5內排氣，將內 部減壓至特定真空度。接著，打開搬運室3和裝載鎖定室 5之間的閘閥7b，藉由搬運裝置23之叉架101，接取被 收容於裝載鎖定室5之基板收容部27之基板S。 接著，藉由搬運裝置23之叉架101，將基板S搬入 至製程腔室la、lb、lc中之任一者，交接至承載器2。 然後，在製程腔室la、lb、lc內對基板S實施蝕刻等之 特定處理。接著，處理完之基板S從承載器2被交接至搬 運裝置23之叉架101，自製程腔室la、lb、lc被搬出。 -14- 200941627 然後，基板S係以與上述相反之路徑，經由裝載鎖定 室5，藉由搬運裝置15被收容在匣盒lib。並且，即使將 處理完之基板S返回至原來之匣盒11a亦可。 接著，一面參照第4圖以及第5圖，針對當作第1實 施型態所涉及之基板保持具之叉架101予以說明。第4圖 爲表示叉架101之外觀的斜視圖。如上述般，叉架101具 備有固定於滑動件1 27之撿取器基座1 1 7，和當作被連結 Φ 於該撿取器基座117之支持構件的多數（例如4根）之支持 撿取器119。 撿取器基座117確實固定多數支持撿取器119(在本 實施型態中爲4根），若爲可以連結於滑動手臂11 5(滑動 器127)者則不管其構成。再者，撿取器基座117和支持 撿取器119之連結構造也爲任意。例如，撿取器基座117 即使爲使用能夠夾持支持撿取器119之基端部之兩片板材 的固定構造亦可，即使爲使用能夠支持多數支持撿取器 Ο 119之一片板材的固定構造亦可。在本實施型態中，撿取 器基座Π 7係藉由彎曲成例如剖面觀視呈C字型之板材所 構成。然後，在彎曲之板材之間隙插入多數支持撿取器 119之各個基端部，藉由無圖示之固定手段例如螺桿等固 定。 叉架101之支持撿取器119具有構成中空之角筒狀的 本體131，和裝卸自如地被安裝於本體131之前端的當作 保護構件之蓋部133。作爲支持撿取器119之本體131的 材質，使用輕量，並且具有高剛性之材料，使得在載置大 -15- 200941627 型基板S之狀態下盡量不會產生因荷重所造成之彎曲，例 如 CFRP。 在叉架101之各支持撿取器119之上面，多處（在第 4圖中，在一個支持撿取器119中有兩處）可裝卸地設置 有當作支持基板S之第1突起部的支持突起200。支持突 起 200 係藉由例如橡膠或 PEEK(聚酸酮： Polyetheretherketone)樹脂、PTFE(聚四氟乙烯： Polytetrafluoroethylene)樹脂等之彈性材料所構成。不管 ^ 支持突起200之形狀，即使例如半球狀或0型環般之環 狀亦可。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holder for holding such a substrate for a flat panel display (FPD), a substrate carrying device provided with the substrate holder, and a substrate processing. system. [Prior Art] In the manufacturing process of the FPD represented by a liquid crystal display (LCD), various processes such as etching, film formation, and the like are applied to a substrate such as a glass substrate under vacuum. A so-called multi-chamber type substrate processing system having a plurality of substrate processing chambers is used in the manufacture of FPD. Such a substrate processing system has a transfer chamber in which a substrate transfer device for transporting a substrate is disposed, and a plurality of process chambers provided around the transfer chamber. Then, the substrate is carried into the respective process chambers by the substrate transfer device in the transfer chamber, or the processed substrates are carried out from the respective process chambers. The substrate is usually transported using a substrate holder called a Fork. The fork has a structure in which a plurality of support grippers are formed in a comb shape on a common base attached to the transportable arm portion that can be accessed and retracted. Recently, there has been a strong demand for a large-sized substrate for FPD, and a large substrate of more than 2 m is used as a processing target. Then, the fork is also enlarged in size in accordance with the enlargement of the substrate. When the fork frame is enlarged, even in the state where the substrate is not placed, due to its own weight, the base end portion of the support gripper is bowed to the front end portion in an arc shape. Further, in the state where the large substrate is placed on the fork, the load of the substrate is applied. In order to prevent such bending from -5 to 200941627, it is also possible to form a fork with a highly rigid ceramic. However, since it is necessary to perform a firing process for manufacturing ceramic parts, it is necessary to have a large-scale firing furnace in order to manufacture a large fork by ceramics. In order to solve this problem, Patent Document 1 proposes a wrist unit having a wrist portion and a plurality of end effectors combined with a toggle portion, the end effector being coupled to the base portion of the toggle portion, and The end effector assembly formed by the base in combination with the front end. In other words, in Patent Document 1, the support holder of the yoke is divided into a base portion and a front end portion by a length of about half of the length, and the structure is provided so that the front end portion can be easily manufactured. Ceramic parts. However, the material of the support picker in the fork is CFRP (Carbon Fiber Reinforced Plastics). The lightweight and highly rigid CFRP has the advantage of being a material that supports the picker. However, in terms of the disadvantages of CFRP, due to the composite material of the strong carbon fiber, there is a problem that it is difficult to repair and repair at the time of damage. Further, since the CFRP has a carbon fiber constituting layer structure, the carbon fiber is peeled off from the portion when the fiber is damaged, and the fiber of the layer structure is rolled up, which tends to be a source of particles. Further, for example, when the glass substrate is damaged during the conveyance by using the CFRP-supported pick-up device, when the support picker is damaged, the minute glass piece enters the carbon fiber and becomes difficult to remove, thereby becoming a new particle. The problem of generating the source. According to the above-mentioned problems, even if a part of the support picker formed of the CFRP material of a high price is damaged, the entire support picker must be replaced. [Problem to be Solved by the Invention] With the increase in the size of the fork, the control of moving the fork in the substrate processing system, It is more difficult than when using a small fork in the past. Therefore, the accuracy of damage to the system constituent members that support the front end of the picker in contact with the chamber wall or the like constituting the substrate processing system is increased as compared with the prior art. When CFRP is used as the material to support the picker, it is also impossible to avoid contact with the system components at a certain frequency. The present invention has been made in view of the above circumstances, and an object thereof is to prevent damage of a supporting member as much as possible even when a substrate holder having a supporting member for supporting a substrate is in contact with a system constituent member. (Means for Solving the Problem) The substrate holder according to the present invention includes a base portion and a plurality of support members that are connected to each other at intervals, and the substrate is held by the plurality of support members. Then, in the substrate holder of the present invention, the support member is provided with a body and a detachable protection member that protects the front end of the body. In the substrate holder of the present invention, the body may have a hollow cylindrical shape. In this case, the substrate holder of the present invention may be inserted into the front end of the body by the protective member. Further, the protective member may have a convex portion that is inserted into the inside of the main body. Further, in the substrate holder of the present invention, the protective member may have a covering portion covering the periphery of the front end of the main body even if 200941627. Further, in the substrate holder of the present invention, the body may be composed of CFRP. Further, in the substrate holder of the present invention, the protective member may be composed of a metal material having a metal or a Young's modulus of 1 MPa or more and 10 MPa or less. In this case, the metal may be stainless steel or aluminum, and the polymer material may be a fluororubber, a polytetrafluoroethylene resin or a nylon resin. Further, in the substrate holder of the present invention, the detachable first projection portion may be placed on the main body to be detachably attached to the substrate from below. At this time, even in the upper portion of the protective member, the second projection portion that abuts against the substrate from below may be provided. Further, even if the height of the apex of the first projection is based on the upper surface of the main body, the height of the apex of the second projection may be increased. Further, the main body may have a plurality of mounting portions that can variably adjust the arrangement positions and/or the number of the first projections. The substrate transfer device according to the present invention includes a transport arm portion that can be moved in and out, and a substrate holder that is attached to the transport arm portion, and is transported by the substrate holder holding substrate. In the substrate transfer device, the substrate holder includes a base portion and a plurality of support members that are coupled to the base portion with a space therebetween. In the substrate transfer device of the present invention, the support member is provided with a main body, and a detachable protective member protecting the front end of the body, or the support member having a body and a detachable protective member for protecting the front end of the body, and being disposed on the upper body of the above-mentioned-8-200941627, abutting the substrate from below Removable protrusions. The substrate processing system 1 according to the present invention includes a substrate processing apparatus for processing a substrate, and a substrate transfer device that transports the substrate to the substrate processing apparatus. In the substrate processing system, the substrate transfer device includes a transport arm portion that can be moved in and out, and a substrate holder that is attached to the transport arm portion holding substrate. Further, in the substrate processing system, the substrate holder includes a base portion and a plurality of support members that are coupled to the base portion with a gap therebetween. Then, in the substrate processing system of the present invention, the support member is provided with a body and a detachable protective member for protecting the front end of the body. [Effect of the Invention] According to the substrate holder of the present invention, by providing the protective member at the front end of the support member, the support member can be protected from damage of the support member even when the support member comes into contact with the chamber wall or the like. Therefore, it is possible to achieve a long-term life of the supporting member and to prevent the occurrence of particles due to damage of the supporting member. [Embodiment] [First Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, an example of a substrate transfer device including the substrate holder of the first embodiment of the present invention and a substrate processing system including the substrate transfer device will be described. Fig. 1 is a perspective view schematically showing a vacuum processing system 100 as a substrate processing system -9-200941627, and Fig. 2 is a plan view schematically showing the inside of each chamber. The vacuum processing system 100 constitutes a multi-chamber configuration having a plurality of process chambers la, lb, lc. The vacuum processing system 100 is a processing system for performing plasma processing on, for example, a glass substrate (hereinafter simply referred to as "substrate") S for FPD. Further, a liquid crystal display (LCD), an electroluminescence (EL) display, a plasma display panel (PDP), or the like is exemplified as the FPD. The vacuum processing system 100 is connected to a 0-cross shape when most of the large chambers are viewed from above. The transfer chamber 3 is disposed at the center portion, and three process chambers la, lb, and lc for performing plasma treatment on the substrate S are disposed adjacent to the three sides thereof. Further, a load lock chamber 5 is disposed adjacent to one side of the remaining portion of the transfer chamber 3. Any of the three process chambers la, lb, lc, the transfer chamber 3, and the load lock chamber 5 constitutes a vacuum chamber. An opening portion having no pattern is provided between the transfer chamber 3 and each of the process chambers la, lb, and lc, and a gate valve 7a having a switching function is disposed in each of the openings. Further, a gate valve 7b is disposed between the transfer chamber 3 and the load lock chamber 5. The gate valves 7a, 7b are hermetically sealed between the chambers in a closed state, and communicate between the chambers in an open state to transfer the substrate S. Further, a gate valve 7c is also provided between the load lock chamber 5 and the external atmospheric environment so that the airtightness of the load lock chamber 5 can be maintained in the closed state, and the load lock chamber 5 and the outside can be held in the open state. The substrate S is transferred between. On the outer side of the load lock chamber 5, two cassette indicators 9a, 9b are provided. The cassettes 11a and 11b of the respective storage substrates S are placed on the respective cassette indicators 9a and 9b. The substrate s is disposed in a plurality of stages in the respective cassettes 11a and 11b in the upper and lower intervals of the interval --10-200941627. Further, each of the cassettes 11a and 11b is configured to be movable up and down by the elevator units 13a and 13b. In the present embodiment, the configuration is such that, for example, the cassette 11a can accommodate the unprocessed substrate, and the other cassette lib can accommodate the processed substrate. A conveying device 15 for transporting the substrate S is provided between the two cassettes Ha and lib. The conveying device 15 is provided with a fork frame 17a and a fork frame 17b which are provided as a substrate holder in the upper and lower stages, and a driving portion 19' which can support, retreat, and rotatably support the forks 17a and the forks 17b. And a support table 21 that supports the drive unit 19. The process chambers la, lb, and lc are configured to maintain a specific decompression environment (vacuum state) in the internal space thereof. As shown in Fig. 2, in each of the process chambers la, lb, and lc, a carrier 2 serving as a mounting table on which the substrate S is placed is provided. Then, each of the processing chambers la, lb, and lc is placed on the carrier 2 in a state where the substrate S is placed on the carrier 2, and plasma such as etching treatment, ashing treatment, film formation treatment, etc. under vacuum conditions is performed on the substrate S. deal with. ® In this embodiment, even if the same processing is performed in three processing chambers la, lb, and lc, even different types of processing can be performed for each processing chamber. Further, the number of process chambers is not limited to three, and may be four or more. The transfer chamber 3 is configured to be held in a specific decompression environment in the same manner as the process chamber U to the vacuum processing chamber. In the transfer chamber 3, the transfer device 23 is disposed as shown in Fig. 2. Then, the transfer device 23 is disposed. The apparatus 23 performs the conveyance of the substrate S between the three process chambers la, lb, lc and the load lock chamber 5. -11 - 200941627 The transport device 23 is provided with a transport mechanism that is disposed in two stages, and is configured to be independent and executable. The substrate S is carried out and carried in. Fig. 3 shows a schematic configuration of the upper transport mechanism 23a having a fork as a substrate holder. The transport mechanism 23a is mainly provided with a pedestal 113 and a pedestal portion. a slidable sliding arm 115, and a yoke 101 configured to slide on the sliding arm 115 as a supporting member for supporting the substrate S. The yoke 101 is provided with a picker base 117 as a base. And a plurality of (for example, four) @ support pickers 119 coupled to the picker base 117. A cover portion 133 as a protective member is provided at a front end of the support picker 119. Next, for the fork The detailed structure of the frame 101 is later A guide 121 for sliding the sliding arm 115 against the pedestal portion 113 is provided at a side portion of the sliding arm 115. Then, a sliding support portion 123 slidably supporting the guide member 121 is provided at the base portion 113. The side portion of the sliding arm 115 is disposed in parallel with the above-mentioned guide member 121 to provide a guide 125 for sliding the fork frame 101 against the sliding arm 115. © Then, a slider 127 is provided which slides along the guide member 125, The fork 127 is attached to the slider 127. In the third embodiment, the transport mechanism 23a of the upper stage is described. However, the transport mechanism (not shown) of the lower stage has the same configuration as the transport mechanism 23a of the upper stage. Then, the upper and lower transport mechanisms are coupled by a connection mechanism (not shown), and the integrated structure can be rotated in the horizontal direction. Further, the transport mechanism that constitutes the upper and lower stages is coupled to the slide operation of the slide arm 115 and the fork 101, or The rotation operation of the pedestal portion 113 and the driving unit of the hoisting movement -12-200941627. The load lock chamber 5 is configured to be the same as the processing chambers la1 to lc and the transfer chamber 3, and can be held in the same manner. The pressure-reducing environment: The loading chamber 5 is for performing the transfer of the substrate S between the cassettes 11a and 11b in the atmospheric environment and the transfer chamber 3 in the decompression environment. The load lock chamber 5 is in a relationship between the atmospheric environment and the decompression environment. In the upper part of the load lock chamber 5, the substrate accommodating portion 27 is provided in the upper and lower stages (only the upper sipe is shown in Fig. 2), and the substrate accommodating portion 27 is provided with support at intervals. A plurality of buffers 28 of the substrate S. The gaps between the buffers 28 are the escape grooves of the comb-shaped support gripper (for example, the support fork 11 9 of the fork frame 101). Further, in the load lock chamber 5, a positioner 29 that abuts on the vicinity of the opposite corner portions of the rectangular substrate S to perform positioning is provided. As shown in FIG. 2, each component of the vacuum processing system 100 is configured to be connected to the control unit 30 (the drawing is omitted in the first drawing). The control unit 30 includes a controller having a CPU. 31. User © interface 3 2 and memory unit 3 3 . The controller 31 is controlled in the vacuum processing system 100 by coordinating, for example, the respective components of the process chambers la to lc, the conveyance device 15, and the conveyance device 23. The user interface 32 is constituted by a display panel in which the engineering manager performs a command input operation or the like in order to manage the vacuum processing system 100, or a display which is displayed by observing the operation state of the vacuum processing system 100. The memory unit 33 stores a processing program for recording a control program (software) for realizing various processes executed by the vacuum processing system 1 under the control of the controller 31, or processing condition data and the like. The user interface 32 and the tablet 33 are connected to the controller-13-200941627 3 1°, and then, according to the instructions from the user interface 32, an arbitrary processing program is called from the memory unit 3, so that The process controller 31 is executed, whereby the desired processing in the vacuum processing system 100 is performed under the control of the process controller 31. The processing programs such as the control program or the processing condition data can be used in a state in which a computer-readable memory medium such as a CD-ROM, a hard disk, a floppy disk, or a flash memory is used. Alternatively, it may be used on-line from other devices via, for example, a dedicated return line. Next, the operation of the vacuum processing system 100 constituting the above will be described. First, the two forks 17a and 17b of the conveying device 15 are driven forward and backward, and the substrate S is taken up from the cassette 11a for accommodating the unprocessed substrate, and the buffers are placed on the lower two stages of the substrate housing portion 27 on the load lock chamber 5. 28. After the forks 17a, 17b are retracted, the gate valve 7C on the atmospheric side of the load lock chamber 5 is closed. Thereafter, the inside of the load lock chamber 5 is evacuated, and the inner portion is decompressed to a specific degree of vacuum. Then, the gate valve 7b between the transfer chamber 3 and the load lock chamber 5 is opened, and the substrate S accommodated in the substrate housing portion 27 of the load lock chamber 5 is picked up by the fork 101 of the transport device 23. Next, the substrate S is carried into the process chambers la, lb, and lc by the fork 101 of the transfer device 23, and is transferred to the carrier 2. Then, the substrate S is subjected to a specific process such as etching in the process chambers la, lb, and lc. Then, the processed substrate S is transferred from the carrier 2 to the fork 101 of the transporting device 23, and the self-contained chambers la, lb, and lc are carried out. -14- 200941627 Then, the substrate S is housed in the cassette lib by the transport device 15 via the load lock chamber 5 in a path opposite to the above. Further, even if the processed substrate S is returned to the original cassette 11a. Next, the fork frame 101 which is the substrate holder according to the first embodiment will be described with reference to Figs. 4 and 5. Fig. 4 is a perspective view showing the appearance of the fork 101. As described above, the fork 101 is provided with a picker base 1 17 fixed to the slider 127 and a plurality (for example, 4) of the supporting members to be coupled to the picker base 117. The capture device 119 is supported. The gripper base 117 is surely fixed to a plurality of support grippers 119 (four in the present embodiment), and is not constructed if it is connectable to the slide arm 1155 (slider 127). Further, the connection structure of the gripper base 117 and the support gripper 119 is also arbitrary. For example, the picker base 117 may be fixed using a fixing structure capable of holding two sheets of the base end portion of the support gripper 119 even if it is used to support one of the plurality of support pickers 119 Construction is also possible. In the present embodiment, the picker base 7 is formed by bending into a C-shaped plate, for example, in a cross-sectional view. Then, the respective base end portions of the plurality of support grippers 119 are inserted into the gaps of the bent sheets, and fixed by means of a fixing means such as a screw or the like. The support gripper 119 of the fork frame 101 has a main body 131 constituting a hollow rectangular tube shape, and a cover portion 133 as a protective member that is detachably attached to the front end of the main body 131. As a material for supporting the body 131 of the picker 119, a material which is lightweight and has high rigidity is used, so that the bending due to the load is not generated as much as possible in the state in which the large-size -15-200941627 type substrate S is placed, for example. CFRP. On the top of each of the support grippers 119 of the fork frame 101, a plurality of places (in the fourth figure, two in one of the support pickers 119) are detachably provided with a first projection as a support substrate S. Support protrusion 200. The support protrusion 200 is composed of an elastic material such as rubber or PEEK (polyetheretherketone) resin or PTFE (polytetrafluoroethylene) resin. Regardless of the shape of the support protrusion 200, even a ring shape such as a hemispherical shape or a 0-ring type may be used.

第5圖表示在本體131安裝蓋部133之狀態的支持撿 取器119之前端部之剖面構造。蓋部133係被安裝成塞住 支持撿取器119之本體131之前端。爲了使支持撿取器 119輕量化，使用CFRP般之輕量且高剛性之材料，將本 體131形成筒狀，將內部設爲空洞爲佳。但是，在中空角 筒狀之本體131之前端爲開口之狀態下，除對抗衝擊的強 Q 度不充分之外，也擔心在內部附著異物等而成爲顆粒產生 源。在本實施型態中，將本體131設爲中空狀以謀求支持 撿取器119之輕量化，並且藉由蓋部133封閉其前端，依 此確保對抗衝擊性，並且預防產生顆粒。 在本實施型態中，蓋部133藉由螺桿137可裝卸地被 固定在插入於中空狀之本體131之前端的安裝塊135。安 裝塊135係藉由例如接合劑等被固定在本體131之內面。 蓋部133由保護支持撿取器119之前端尤其角部之目的來 -16- 200941627 看，以具有本體131之斷面積以上之大小爲佳。再者’蓋 部133爲僅設置在支持撿取器119之前端附近者。相對於 本體131之長度，蓋部133之長度設爲例如1/1〇〜1/500 左右爲佳。當過度增大支持撿取器119之全長中的蓋部 133長度分配時，因前端重量增加在支持撿取器119產生 彎曲，故蓋部133對本體131之長度比設爲上述範圍內爲 佳。 〇 藉由安裝蓋部133，即使支持撿取器119接觸於基板 處理系統100中之屬於系統構成構件的腔室壁等之時，亦 可以保護藉由高價位之CFRP材料所構成之支持撿取器 119之本體131。此時，即使蓋部133破損時，因僅更換 蓋部133即可，故可以使支持撿取器119之本體131的壽 命長期化。再者，因可以藉由蓋部133防止支持撿取器 119之本體131損傷，故可以防止CFRP材料之碳纖維自 本體131之損傷部位剝離，或捲起而成爲顆粒源。並且， ® 亦可以防止玻璃片等混入至本體131之損傷部位而成爲顆 粒源。 如此一來，藉由安裝蓋部133，有效果預防支持撿取 器119之本體131受到損傷或破損。並且，可以迴避支持 撿取器119本體131之損傷的結果，亦可以降低顆粒產 生。 作爲蓋部133之材質，除例如金屬之外，亦可以使用 橡膠或合成樹脂等之高分子材料。作爲蓋部133之材質所 要求之特性’可舉出輕量、抗衝擊強、容易成形、與其它 -17- 200941627 構件接觸時對另一側所造成之接物損傷的可能性低。由如 此之観點，針對成爲蓋部133之候補的多種材料，執行有 關「重量」、「衝擊強度」、「成形性」、「接物損傷可 能性」之四個項目的評價。 作爲蓋部133之材料候補，選定陶瓷（氧化鋁）、玻 璃、CFRP(東邦 Tenax公司製產品名 Composite)、SUS、 氟橡膠（Nichias公司製產品名Fluoro-Plus)、聚四氟乙烯 (PTFE)、鋁以及MC尼龍樹脂之8種類。 在該評價中，將不適合作爲蓋部133之材質者設爲 「1」，將適合作爲蓋部133之材質者設爲「5」，將在兩 者中間姑且可當作蓋部133之材質使用者設爲「3」，以 三階段進行評價。然後，以所有評價項目之合計點爲基 準，綜合判斷可否當作蓋部133之材質。將其結果表示於 表1。 [表1] 雷量 衝擊強度 成形性 纖損傷性 合計點 評價 陶瓷 3 1 1 1 6 不適合 玻璃 5 1 1 1 8 不適合 CFRP 5 1 1 3 10 不適合 SUS 1 5 5 1 12 _適合 氟橡膠. 5 5 1 5 16 一適合 PTFE 5 3 5 5 18 適合 鋁 3 5 5 3 16 適合 MC尼龍 5 3 5 5 18 適合Fig. 5 shows a cross-sectional structure of the end portion of the support gripper 119 in a state where the cover portion 133 is attached to the main body 131. The cover portion 133 is mounted to plug the front end of the body 131 supporting the picker 119. In order to reduce the weight of the support gripper 119, the body 131 is formed into a cylindrical shape by using a lightweight and highly rigid material such as CFRP, and it is preferable to make the inside a cavity. However, in the state in which the front end of the hollow-cylindrical body 131 is open, the strong Q degree against the impact is insufficient, and foreign matter or the like is attached to the inside to become a particle generating source. In the present embodiment, the main body 131 is hollow so as to support the weight reduction of the picker 119, and the front end thereof is closed by the lid portion 133, thereby ensuring impact resistance and preventing generation of particles. In the present embodiment, the cover portion 133 is detachably fixed to the mounting block 135 inserted at the front end of the hollow body 131 by the screw 137. The mounting block 135 is fixed to the inner surface of the body 131 by, for example, a bonding agent or the like. The cover portion 133 is preferably viewed from the front end of the support ejector 119, especially the corner portion, to have a size larger than the sectional area of the body 131. Further, the cover portion 133 is provided only in the vicinity of the front end of the support picker 119. The length of the lid portion 133 is preferably, for example, about 1/1 〇 to 1/500 with respect to the length of the main body 131. When the length of the cover portion 133 in the entire length of the support gripper 119 is excessively increased, the bending of the support gripper 119 is caused by the increase in the front end weight, so that the length ratio of the cover portion 133 to the main body 131 is preferably within the above range. . By mounting the cover portion 133, even if the support picker 119 is in contact with the chamber wall or the like belonging to the system constituent member in the substrate processing system 100, the support drawing by the high-priced CFRP material can be protected. The body 131 of the device 119. At this time, even if the lid portion 133 is broken, only the lid portion 133 can be replaced, so that the life of the body 131 supporting the gripper 119 can be prolonged. Further, since the cover 131 can prevent the main body 131 of the support gripper 119 from being damaged, it is possible to prevent the carbon fibers of the CFRP material from being peeled off from the damaged portion of the body 131 or rolled up to become a particle source. Further, ® can prevent the glass sheet or the like from being mixed into the damaged portion of the body 131 to become a particle source. As a result, by attaching the cover portion 133, it is effective to prevent the body 131 supporting the picker 119 from being damaged or broken. Moreover, the result of supporting the damage of the body 131 of the picker 119 can be avoided, and the generation of particles can also be reduced. As the material of the lid portion 133, a polymer material such as rubber or synthetic resin can be used in addition to metal. The characteristics required for the material of the lid portion 133' are exemplified by being lightweight, strong against impact, easy to form, and low in damage to the other side due to contact with other members of the -17-200941627 member. As a result, evaluation of four items relating to "weight", "impact strength", "formability", and "access damage possibility" is performed for various materials that are candidates for the lid portion 133. As a material candidate for the lid portion 133, ceramic (aluminum oxide), glass, CFRP (product name, manufactured by Toho Tenax Co., Ltd.), SUS, fluororubber (product name Fluoro-Plus manufactured by Nichias Co., Ltd.), and polytetrafluoroethylene (PTFE) are selected. 8 types of aluminum and MC nylon resins. In this evaluation, the material that is not suitable as the material of the lid portion 133 is "1", and the material that is suitable as the material of the lid portion 133 is "5", and the material of the lid portion 133 can be used as the material of the lid portion 133. The number is set to "3" and evaluated in three stages. Then, based on the total points of all the evaluation items, the overall judgment can be made as the material of the cover portion 133. The results are shown in Table 1. [Table 1] Thunder impact strength Formability fiber damage total evaluation price ceramic 3 1 1 1 6 Not suitable for glass 5 1 1 1 8 Not suitable for CFRP 5 1 1 3 10 Not suitable for SUS 1 5 5 1 12 _ Suitable for fluororubber. 5 5 1 5 16 One suitable for PTFE 5 3 5 5 18 Suitable for aluminum 3 5 5 3 16 Suitable for MC nylon 5 3 5 5 18 Suitable

在本實施型態中，將合計點1 2點以上之材料判斷成 -18- 200941627 「適合」當作蓋部133之材質。另外，合計點低於12點 之材料則判斷成「不適合」當作蓋部1 33之材質。依照以 上之評價，作爲蓋部133之材質，以使用例如鋁、SUS(不 鏽鋼）等之金屬材料，氟橡膠、PTFE樹脂或尼龍樹脂等之 高分子材料等爲佳。另外，陶瓷具有高剛性，相反的接物 損傷性高，並且脆弱缺乏衝擊強度，故作爲蓋部133之材 質較不佳。再者，玻璃或DFRP也有脆弱缺乏衝擊強度之 〇 點，作爲蓋部133之材質較不佳。 再者，在本實施型態中，由充分確保耐衝擊性或耐破 壞韌性之觀點來看，作爲蓋部133之材質，以使用楊氏係 數爲lOOGPa以下（例如IMPa以上lOOGPa以下）之材料爲 佳。作爲楊氏系統爲100 GPa以下之材料，金屬中可舉出 例如鋁。橡膠或合成樹脂等所代表之高分子材料一般爲楊 氏係數lOOGPa以下，但是尤其以使用持有楊氏係數 lOGPa以下（例如IMPa以上lOGPa以下）之彈性的高分子 © 材料爲佳。作爲楊氏係數IMPa以上lOGPa以下之高分子 材料之較佳例，可以舉出例如氟橡膠、PTFE樹脂、MC尼 龍樹脂等。 如上述般，若藉由本實施型態之叉架101，藉由在支 持撿取器119之前端設置蓋部133，即使支持撿取器119 接觸於基板處理系統100中之屬於系統構成構件的腔室壁 等之時，亦可以保護支持撿取器119之本體131。因此， 達成可以使支持撿取器119之使用壽命長期化並且可以防 止因本體131之損傷引起產生顆粒等的效果。 -19- 200941627 [第2實施型態] 第6圖係表示本發明之第2實施型態所涉及之叉架 101中的支持撿取器119之前端部的剖面構造。在本實施 型態中，蓋部139具有主要吸收X方向之衝擊的主保護 部139a，和自該主保護部139a突出設置之插入部139b， 剖面構成凸形。並且，在以下之說明中，以與第1實施型 態不同之點爲中心予以說明’對於與第1實施型態相同之 構成賦予相同符號省略說明。 蓋部139係屬於被其一部分之插入部139b被插入於 支持撿取器119之本體131之前端部分而安裝。蓋部139 係保護支持撿取器119之前端，以減少與基板處理系統 100中之屬於系統構成構件之腔室壁等接觸時所受到之衝 擊。再者，在蓋部139中，藉由在密接於角筒狀之本體 131之內面的狀態下嵌入插入部13 9b，可以持有自內側補 強中空狀之本體131之功能。即是，藉由蓋部139,在支 持撿取器119之前端附近，不僅來自正面（X方向）之衝 擊，即使對來自支持撿取器119之側方或上下方向（例如 Y方向或Z方向）之衝擊亦可以提高耐衝擊性。因此，在 支持撿取器119之前端部分，可以極力防止本體131之破 損。 再者，蓋部139藉由在密接於角筒狀之本體131之內 面嵌入插入部13 9b，依據摩擦阻力被固定於本體131。因 此，插入部13 9b也當作防止蓋部139自支持撿取器U9 200941627 之本體131脫落之防脫作用部而發揮功能。該防脫功能可 以依據被插入至本體131之插入部13 9b之插入長度L1而 適當調整。 在本實施型態中，以例如橡膠或合成樹脂等之彈性材 料構成蓋部139爲佳。並且，雖然省略圖示，但是即使在 蓋部139之插入部139b周圍，形成凹凸（皺摺）而提高防 脫作用亦可。再者，即使以螺桿等將蓋部139固定於本體 ❹ 131亦可。 本實施型態中之其他構成、作用以及效果與第1實施 型態相同。 [第3實施型態] 第7圖係表示本發明之第3實施型態所涉及之叉架中 的支持撿取器119之前端部的剖面構造。在本實施型態 中，如第7圖所示般，蓋部141具有主要吸收來自X方 Φ 向之衝擊的主保護部141a，和大略直角形成於該主保護 部141a之壁狀被覆部141b，剖面構成凹形。屬於蓋部 141之一部分的被覆部141b係以覆蓋支持撿取器119之 本體131之前端附近之周圍的方式而被安裝。 蓋部141係保護支持撿取器119之本體131之前端， 以減少與基板處理系統1〇〇中之屬於系統構成構件之腔室 壁等接觸時所受到之衝擊。在蓋部141中，因可以藉由被 覆部141b覆蓋本體131之前端附近之周圍，故持有不僅 本體131之前端，亦可以從前端保護至些許基端部側之位 -21 - 200941627 置的功能。即是，藉由被覆部141b覆蓋，依此在支持撿 取器119之前端附近，不僅來自正面（X方向）之衝擊，即 使對來自支持撿取器119之側方或上下方向（Y方向或Z 方向）之衝擊，亦可以提高耐衝擊性。再者，藉由被覆部 141b覆蓋，依此防止在支持撿取器119之前端附近造成 細小損傷。因此，可以極力防止本體131之破損或因破損 所產生之顆粒產生。 蓋部141藉由使角筒狀之本體131密接於被覆部 141b之內側而嵌入，依據摩擦阻力被固定於本體131。因 此，被覆部141b也當作防止蓋部141自支持撿取器119 之本體131脫落之防脫作用部而發揮功能。該防脫功能可 以依據覆蓋本體131之側部的被覆部141b之內徑’或被 覆長度L2而適當調整。 在本實施型態中，以例如橡膠或合成樹脂等之彈性材 料構成蓋部141爲佳。藉由以彈性材料形成蓋部141之被 覆部141b，亦可以在被覆部141b之上面從下側支持基板 S»此時，因在支持撿取器119之最前端位置支持基板 S，故可以藉由叉架1〇1安定支持基板S。並且’雖然省 略圖示，但是在本實施型態之蓋部141中’即使在被覆部 141b之內周形成持有防脫作用之凹凸（皺摺）亦可。再者’ 即使以螺桿等將蓋部141固定於本體131亦可。 本實施型態中之其他構成、作用以及效果與第1實施 型態相同。 -22- 200941627 [第4實施型態] 接著，一面參照第8圖至第10圖，針對本發明之第 4實施型態予以說明。第8圖係表示本發明之第4實施型 態所涉及之叉架101中的支持撿取器119之前端部的剖面 構造。在本實施型態中，在與第1實施形態相同之構成的 蓋部133之上部，設置有當作自下方支持基板S之第2突 起部的支持突起143。支持突起143係由例如橡膠、合成 ❹ 樹脂等之彈性材料所形成。支持突起143除第8圖所示般 之半球狀以外，即使爲例如〇型環般之環狀亦可。在本 實施型態中，在例如金屬性之蓋部133上固定以另外之材 質（例如橡膠）所形成之彈性構件而當作支持突起143。將 支持突起143固定於蓋部133之方法，例如螺桿固定、藉 由接合材之固定等任意。並且，即使以例如橡膠等之彈性 材料一體形成蓋部133和支持突起143亦可。 在本實施型態中，藉由在蓋部133之上部設置支持突 © 起，如第8圖所示般，可以在支持撿取器119之最前端支 持基板S。基板S因越大型越容易產生彎曲，故在支持撿 取器119之最前端設置支持突起143在下方予以支持，則 可以在叉架101安定保持基板s。 並且，支持突起143亦可以設置在第2實施型態之蓋 部139或第3實施型態之蓋部141。第9圖爲將支持突起 143 —體形成在第2實施型態所涉及之蓋部139之上部的 例子。再者，第10圖爲將支持突起143 —體形成在第3 實施型態所涉及之蓋部1 4 1之上部的例子。 -23- 200941627 本實施型態中之其他構成、作用以及效果與第1至3 實施型態相同。 [第5實施型態] 第11圖係表示本發明之第5實施型態所涉及之叉架 101中的支持撿取器的俯視圖。在本實施型態之叉架中， 於支持撿取器119之本體131之上面，多處設置有用以安 裝支持突起200之安裝孔150。安裝孔150係以特定間隔 q 被配設在支持撿取器119之本體131之上面。 第12圖以及第13圖係表示利用安裝孔150之支持突 起200之安裝構造之例子。第12圖係表示利用支持撿取 器119之安裝孔150，安裝半球狀之支持突起200a之狀 態。半球狀之支持突起200a係從配置在支持撿取器119 之本體131之上面之金屬製（鋁等）之擋板151之上方，以 螺桿203夾住彈性構件201之下部的凸緣201a，依此可 裝卸地固定於本體131。並且，在第12圖中’因容易執 〇 行藉由螺桿203之固定，故在支持撿取器119之本體131 之安裝孔150安裝有螺母側153。 第13圖係表示利用支持撿取器之安裝孔150’安裝 〇型環狀之支持突起20 0b之狀態。〇型環狀之支持突起 200b係從配置在支持撿取器119之上面的金屬製之擋板 151之上方，隔著盤狀之固定構件211以螺桿203可裝卸 地固定於本體131。盤狀之固定構件211係發揮抵接於〇 型環狀之彈性構件2 1 3之內周側而將該彈性構件2 1 3推壓 -24- 200941627 至擋板151之任務。並且，在第13圖中，因容易執行藉 由螺桿203之固定，故在支持撿取器119之安裝孔150安 裝有螺母側1 5 3。 並且，對第12圖以及第13圖所示之安裝孔150安裝 支持突起200a、200b的安裝構造僅爲例示，並不限定於 該些。 在本實施型態中，藉由在支持撿取器119之上面設置 φ 多數安裝孔150，可以自由變更支持突起200之配置。例 如第14圖係表示在支持撿取器119之兩處配置半球狀之 支持突起200a之例子。第15圖係表示在支持撿取器119 之四處配設半球狀之支持突起200a，並且也在蓋部133 設置支持突起143之例子。再者，第16圖係表示在支持 撿取器 119之上面，各配設兩個半球狀之支持突起 200a，和Ο型環狀之支持突起20 0b，並且也在蓋部133 設置支持突起143之例子。第17圖爲在各支持撿取器 〇 119上適當配置支持突起200a和20 0b之叉架101之俯視 圖。 如此在本實施型態中，因在本體131之多處設置安裝 孔150，故可以提高支持突起200之配置自由度。支持突 起200因在叉架101(各支持撿取器119)上成爲從下之支 持基板S之支點，故因應基板S之大小等，變更支持突起 200之配置或種類，依此可以在叉架101上安定保持基板 S。例如，於欲防止基板S貼於叉架101時，重點性使用 與基板S之接觸面積小之半球狀的支持突起2 00a，或相 -25- 200941627 反的於欲增大基板s和叉架101之吸附力之時，可多數配 置〇型環之支持突起2 0 0b等’能夠作各種應用。並且’ 在本實施型態中，因應所需’也利用蓋部1 3 3之支持突起 143，故藉由組合支持突起200和支持突起143’更提高 叉架101中之基板S保持能力，可以安定保持基板S。 再者，在本實施型態中，因容易交換支持突起200, 故可以持有各種功能之材質構成支持突起200。例如，藉 由使用導電性材料當作支持突起200之材質，可以謀求基 板S和支持撿取器119之導通。再者，作爲支持突起200 之構成材料，使用例如吸附性材料確實保持基板S，或相 反地使用相對於基板S黏著性低之低黏著性材料，依此可 以防止基板S貼附於叉架1 0 1。 並且，在本實施型態中，由於可在支持撿取器119上 配置多數支持突起2 00，故亦可例如第18圖所示般，由 支持撿取器119之撿取器基座117側，朝向最前端之蓋部 133，階段性升高支持突起200之高度。即是，在第18圖 中，對於支持撿取器119之上面，最靠近於撿取器基座 117之側的第1號支持突起200之高度，和第2號之支 持突起200之高度H2，和第3號之支持突起200之高度 H3，和第4號之蓋部133之支持突起143之高度H4係被 設定成 H4 > H3 > H2 > Hi。 如此一來，在本實施型態中，可以以支持基板s之支 持點從支持撿取器119之撿取器基座117側朝向前端側漸 漸升高之方式，設定支持突起200及支持突起143之高 -26- 200941627 度。藉由如此之構成’於依據基板S之重量或支持撿取器 119之自重所產生之彎曲，使得叉架1〇1之前端側下降之 時’下降範圍藉由支持突起200以及支持突起143之高度 可以某程度相抵。因此，可以藉由叉架101在極力接近於 水平之狀態下一邊安定性保持基板S，一邊執行搬運動 作。 並且，在以上之說明中，雖然舉例說明第1實施型態 〇 之蓋部133而予以說明，但是當然可以使用蓋部139(第2 實施型態）或蓋部141 (第3實施型態）來取代蓋部133。本 實施型態中之其他構成、作用以及效果與第1至4實施型 態相同。 以上，雖然敘述本發明之實施型態，但是本發明並不 限定於上述實施型態，當然可作各種之變形。例如，在上 述實施型態中，雖然以支持撿取器119之本體131爲中空 角筒狀之情形爲例，但是本體形狀，即使爲例如剖面構成 〇 三角形之上面爲平的筒形狀亦可。再者，雖然舉出配備於 真空側之搬運室3之搬運裝置23的叉架101作爲基板保 持具之例予以說明，但是本發明亦可適用於例如大氣側之 搬運裝置15之叉架17a、17b。 再者，可使用本發明之基板保持具之基板搬運裝置之 構成，並不限定於配備於上下兩段之滑動手臂式，即使以 一段構成或三段構成亦可，並不限於滑動式，即使爲例如 多關節手臂式之基板搬運裝置亦可。 再者，作爲依據本發明之基板保持具的搬運對象，並 -27- 200941627 不限於FPD製造用之基板，可以以各種用途之基板爲對 象。 【圖式簡單說明】 第1圖爲槪略性表示真空處理系統之斜視圖。 第2圖爲第1圖之真空處理系統的俯視圖。 第3圖爲說明搬運機構之槪略構成之斜視圖。 第4圖爲表示叉架之槪略構成之斜視圖。 第5圖係表示本發明之第1實施型態所涉及之叉架中 的支持撿取器之前端部的剖面圖。 第6圖係表示本發明之第2實施型態所涉及之叉架中 的支持撿取器之前端部的剖面圖。 第7圖係表示本發明之第3實施型態所涉及之叉架中 的支持撿取器之前端部的剖面圖。 第8圖係表示本發明之第4實施型態所涉及之叉架中 的支持撿取器之前端部的剖面圖。 第9圖係表示本發明之第4實施型態所涉及之叉架中 的支持撿取器之前端部的另外剖面圖。 第10圖係表示本發明之第4實施型態所涉及之叉架 中的支持撿取器之前端部的又一另外剖面圖。 第11圖係表示本發明之第5實施型態所涉及之叉架 中的支持撿取器之俯視圖。 第12圖爲說明支持突起之固定構造之圖面。 第13圖爲說明支持突起之固定構造之另外例的圖 -28- 200941627 面。 第14 支!持突起之配置例的支持檢取器之俯 視圖。 第15圖爲表示支持突起之另外配置例的支持檢取器 之俯視圖。 第16圖爲表示支持突起之又一另外配置例的支持撿 取器之俯視圖。 〇 第17圖爲表示支持突起之配置例的叉架之俯視圖。 第18圖爲表示支持突起之配置例的支持撿取器之側 面圖。 【主要元件符號說明】 la、lb、lc:製程腔室 3 :搬運室 5 :裝載鎖定室 β 1〇〇 :真空處理系統 101 :叉架 117 :撿取器基座 119 :支持撿取器 131 :本體 133 :蓋部 135 :安裝塊 200 :支持突起 -29-In the present embodiment, the material of the total point of 12 or more points is judged to be -18-200941627 "suitable" as the material of the lid portion 133. In addition, the material whose total point is lower than 12 points is judged to be "unsuitable" as the material of the lid portion 1 33. In the evaluation of the material of the lid portion 133, for example, a metal material such as aluminum or SUS (stainless steel), a polymer material such as fluororubber, PTFE resin or nylon resin is preferably used. Further, since the ceramic has high rigidity, the opposite joint has high damage, and is weak and lacks impact strength, the material of the lid portion 133 is relatively poor. Furthermore, glass or DFRP also has the disadvantage of being weak and lacking impact strength, and the material of the cover portion 133 is relatively poor. In the present embodiment, from the viewpoint of sufficiently ensuring impact resistance or fracture toughness, a material having a Young's modulus of 100 GPa or less (for example, IMPa or more and 100 GPa or less) is used as the material of the lid portion 133. good. As the material of the Young's system of 100 GPa or less, for example, aluminum is exemplified in the metal. The polymer material represented by the rubber or the synthetic resin or the like generally has a Young's modulus of 100 GPa or less. However, it is preferable to use an elastic polymer material having a Young's modulus of 10 OGPa or less (for example, IMPa or more and 10 GPa or less). Preferred examples of the polymer material having a Young's modulus of 1 MPa or more and 10 MPa or less include fluororubber, PTFE resin, and MC nylon resin. As described above, with the fork 101 of the present embodiment, by providing the cover portion 133 at the front end of the support picker 119, even if the support picker 119 is in contact with the cavity belonging to the system constituent member in the substrate processing system 100 The body 131 supporting the picker 119 can also be protected at the time of the wall or the like. Therefore, it is achieved that the service life of the support gripper 119 can be made long-term and the effect of generating particles or the like due to the damage of the body 131 can be prevented. -19-200941627 [Second Embodiment] Fig. 6 is a cross-sectional view showing a front end portion of the fork holder 101 according to the second embodiment of the present invention. In the present embodiment, the lid portion 139 has a main protection portion 139a that mainly absorbs an impact in the X direction, and an insertion portion 139b that protrudes from the main protection portion 139a, and has a cross section that is convex. In the following description, the differences from the first embodiment will be mainly described. The same components as those in the first embodiment will be denoted by the same reference numerals and will not be described. The lid portion 139 is attached to the front end portion of the body 131 of the support gripper 119 by the insertion portion 139b of a part thereof. The cover portion 139 protects the front end of the support gripper 119 to reduce the impact when it comes into contact with the chamber wall of the system processing member in the substrate processing system 100 or the like. Further, in the lid portion 139, the insertion portion 13 9b is fitted in a state of being in close contact with the inner surface of the square tubular body 131, so that the hollow body 131 can be reinforced from the inside. That is, by the cover portion 139, in the vicinity of the front end of the support gripper 119, not only the impact from the front side (X direction), but also the side from the support gripper 119 or the up and down direction (for example, the Y direction or the Z direction) The impact can also improve the impact resistance. Therefore, the damage of the body 131 can be prevented as much as possible in support of the front end portion of the picker 119. Further, the lid portion 139 is fixed to the body 131 in accordance with the frictional resistance by being fitted into the insertion portion 13 9b in close contact with the inner surface of the square tubular body 131. Therefore, the insertion portion 13 9b also functions as a detachment prevention portion for preventing the lid portion 139 from coming off the body 131 supporting the gripper U9 200941627. This anti-off function can be appropriately adjusted in accordance with the insertion length L1 of the insertion portion 13 9b inserted into the body 131. In the present embodiment, it is preferable to form the lid portion 139 with an elastic material such as rubber or synthetic resin. Further, although not shown in the drawings, irregularities (wrinkles) may be formed around the insertion portion 139b of the lid portion 139 to improve the detachment prevention effect. Further, the cover portion 139 may be fixed to the main body ❹ 131 by a screw or the like. Other configurations, operations, and effects of the present embodiment are the same as those of the first embodiment. [Third Embodiment] Fig. 7 is a cross-sectional view showing the front end portion of the support gripper 119 in the fork frame according to the third embodiment of the present invention. In the present embodiment, as shown in Fig. 7, the lid portion 141 has a main protection portion 141a that mainly absorbs an impact from the X-direction Φ direction, and a wall-shaped coating portion 141b that is formed at a substantially right angle to the main protection portion 141a. The section is concave. The covering portion 141b belonging to a part of the lid portion 141 is attached so as to cover the periphery of the front end of the body 131 supporting the gripper 119. The cover portion 141 protects the front end of the body 131 supporting the picker 119 to reduce the impact received when it comes into contact with the chamber wall or the like of the system constituent member in the substrate processing system 1A. In the cover portion 141, since the periphery of the front end of the main body 131 can be covered by the covering portion 141b, it is possible to hold not only the front end of the main body 131 but also the front end to the side of the base end side - 21 - 41164627. Features. That is, it is covered by the covering portion 141b, whereby in the vicinity of the front end of the support gripper 119, not only the impact from the front side (X direction) but also the side from the support picker 119 or the up and down direction (Y direction or The impact in the Z direction can also improve the impact resistance. Further, it is covered by the covering portion 141b, thereby preventing fine damage near the front end of the support gripper 119. Therefore, it is possible to prevent the breakage of the body 131 or the generation of particles due to breakage as much as possible. The lid portion 141 is fitted by fitting the corner tubular body 131 to the inside of the covering portion 141b, and is fixed to the main body 131 in accordance with the frictional resistance. Therefore, the covering portion 141b also functions as a detachment prevention portion for preventing the lid portion 141 from coming off the body 131 supporting the gripper 119. This anti-off function can be appropriately adjusted in accordance with the inner diameter ' or the covered length L2 of the covering portion 141b covering the side portion of the main body 131. In the present embodiment, it is preferable to form the lid portion 141 with an elastic material such as rubber or synthetic resin. By forming the covering portion 141b of the lid portion 141 with an elastic material, the substrate S» can be supported from the lower side on the upper surface of the covering portion 141b. At this time, since the substrate S is supported at the foremost end position of the support gripper 119, it is possible to borrow The substrate S is stabilized by the fork frame 1〇1. In addition, in the lid portion 141 of the present embodiment, the inside and outside of the covering portion 141b may be formed with irregularities (wrinkles) for preventing the peeling action. Further, the cover portion 141 may be fixed to the main body 131 by a screw or the like. Other configurations, operations, and effects of the present embodiment are the same as those of the first embodiment. -22-200941627 [Fourth Embodiment] Next, a fourth embodiment of the present invention will be described with reference to Figs. 8 to 10 . Fig. 8 is a cross-sectional view showing the front end portion of the fork ejector 101 according to the fourth embodiment of the present invention. In the present embodiment, a support protrusion 143 serving as a second protrusion from the lower support substrate S is provided on the upper portion of the lid portion 133 having the same configuration as that of the first embodiment. The support protrusions 143 are formed of an elastic material such as rubber or synthetic enamel resin. The support protrusion 143 may have a hemispherical shape as shown in Fig. 8, and may be a ring shape such as a 〇-shaped ring. In the present embodiment, an elastic member formed of another material (e.g., rubber) is fixed to, for example, the metallic cover portion 133 as the supporting protrusion 143. The method of fixing the support protrusion 143 to the lid portion 133, for example, screw fixing, fixing by a bonding material, or the like. Further, the cover portion 133 and the support protrusions 143 may be integrally formed of an elastic material such as rubber. In the present embodiment, by providing the support protrusions on the upper portion of the lid portion 133, as shown in Fig. 8, the substrate S can be supported at the foremost end of the support gripper 119. Since the substrate S is more likely to be bent as it is larger, the support protrusion 143 is supported at the foremost end of the support gripper 119 to support the substrate s in the fork frame 101. Further, the support protrusion 143 may be provided in the lid portion 139 of the second embodiment or the lid portion 141 of the third embodiment. Fig. 9 is a view showing an example in which the supporting projections 143 are formed on the upper portion of the lid portion 139 according to the second embodiment. Furthermore, Fig. 10 shows an example in which the support protrusion 143 is formed on the upper portion of the lid portion 141 according to the third embodiment. -23- 200941627 Other configurations, operations, and effects of the present embodiment are the same as those of the first to third embodiments. [Fifth Embodiment] Fig. 11 is a plan view showing a support gripper in the fork 101 according to the fifth embodiment of the present invention. In the fork frame of the present embodiment, mounting holes 150 for mounting the support projections 200 are provided at a plurality of places on the body 131 supporting the picker 119. The mounting holes 150 are disposed above the body 131 supporting the picker 119 at a specific interval q. Fig. 12 and Fig. 13 show an example of the mounting structure of the support protrusion 200 by the mounting hole 150. Fig. 12 shows the state in which the hemispherical support projections 200a are mounted by the mounting holes 150 of the support gripper 119. The hemispherical support protrusions 200a are sandwiched by a metal (aluminum or the like) baffle 151 disposed above the body 131 supporting the picker 119, and the screw 201 203 sandwiches the flange 201a of the lower portion of the elastic member 201. This is detachably fixed to the body 131. Further, in Fig. 12, the nut side 153 is attached to the mounting hole 150 of the main body 131 of the picker 119 because it is easily fixed by the screw 203. Fig. 13 is a view showing a state in which the support ring 20 0b of the meandering ring shape is attached by the mounting hole 150' of the support gripper. The 环状-shaped annular support projection 200b is detachably fixed to the main body 131 by a screw 203 via a disk-shaped fixing member 211 from above a metal baffle 151 disposed above the support gripper 119. The disk-shaped fixing member 211 serves to abut against the inner peripheral side of the ring-shaped elastic member 2 1 3 and press the elastic member 2 1 3 to -24-200941627 to the shutter 151. Further, in Fig. 13, since the fixing by the screw 203 is easily performed, the nut side 1 5 3 is attached to the mounting hole 150 of the support gripper 119. Further, the mounting structure for attaching the support projections 200a and 200b to the mounting hole 150 shown in Fig. 12 and Fig. 13 is merely an example, and is not limited thereto. In the present embodiment, the arrangement of the support protrusions 200 can be freely changed by providing a plurality of mounting holes 150 on the upper surface of the support picker 119. For example, Fig. 14 shows an example in which hemispherical support protrusions 200a are disposed at two places of the support picker 119. Fig. 15 shows an example in which a hemispherical support protrusion 200a is disposed at four places of the support picker 119, and a support protrusion 143 is also provided in the cover portion 133. Further, Fig. 16 shows that on the upper surface of the support gripper 119, two hemispherical support protrusions 200a and a ring-shaped annular support protrusion 20 0b are provided, and a support protrusion 143 is also provided in the cover portion 133. An example. Fig. 17 is a plan view showing the fork frame 101 in which the support projections 200a and 20b are appropriately disposed on the respective support grippers 119. As described above, in the present embodiment, since the mounting holes 150 are provided at a plurality of places of the main body 131, the degree of freedom in the arrangement of the support protrusions 200 can be improved. Since the support protrusions 200 are fulcrums of the support substrate S from the lower support frame 119 (the support holders 119), the arrangement or type of the support protrusions 200 can be changed depending on the size of the substrate S, and the like. The substrate S is held on the 101. For example, when it is desired to prevent the substrate S from being attached to the yoke 101, it is important to use a hemispherical support protrusion 2 00a having a small contact area with the substrate S, or a phase -25-200941627 to increase the substrate s and the yoke. At the time of the adsorption force of 101, most of the support protrusions of the 〇-shaped ring can be used for various applications. And in the present embodiment, the support protrusion 143 of the cover portion 133 is also utilized in response to the requirement, so that by the combination of the support protrusion 200 and the support protrusion 143', the substrate S retention capability in the yoke 101 can be improved. Stabilize the substrate S. Further, in the present embodiment, since the support protrusions 200 are easily exchanged, the support protrusions 200 can be formed of materials having various functions. For example, by using a conductive material as the material of the support protrusion 200, the conduction between the substrate S and the support picker 119 can be achieved. Further, as a constituent material of the support protrusion 200, for example, the substrate S is surely held by using an adsorptive material, or a low-adhesive material having low adhesion to the substrate S is used instead, whereby the substrate S can be prevented from being attached to the fork 1 0 1. Further, in the present embodiment, since the plurality of support protrusions 00 can be disposed on the support gripper 119, the picker base 117 side of the support gripper 119 can be provided, for example, as shown in Fig. 18. The cover portion 133 toward the foremost end gradually raises the height of the support protrusion 200. That is, in Fig. 18, the height of the first support projection 200 closest to the side of the gripper base 117 and the height H2 of the second support projection 200 to the upper surface of the support gripper 119. The height H3 of the support protrusion 200 of the third and the height H4 of the support protrusion 143 of the cover portion 133 of the fourth number are set to H4 > H3 > H2 > Hi. In this manner, in the present embodiment, the support protrusion 200 and the support protrusion 143 can be set such that the support point of the support substrate s gradually rises from the side of the picker base 117 supporting the picker 119 toward the front end side. The height is -26- 200941627 degrees. By thus constituting 'the bending caused by the weight of the substrate S or the self-weight of the support 119, the front end side of the yoke 1 〇1 is lowered by the support protrusion 200 and the support protrusion 143. The height can be offset to some extent. Therefore, the movement of the forks 101 while maintaining the substrate S while maintaining the strength as close to the horizontal level can be performed. In the above description, the cover portion 133 of the first embodiment is described as an example. However, it is needless to say that the cover portion 139 (second embodiment) or the cover portion 141 (third embodiment) can be used. Instead of the cover portion 133. Other configurations, operations, and effects of the present embodiment are the same as those of the first to fourth embodiments. The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various modifications can of course be made. For example, in the above-described embodiment, the case where the main body 131 supporting the picker 119 has a hollow rectangular tube shape is taken as an example, but the main body shape may be, for example, a flat cylindrical shape in which the upper surface of the cross-sectional configuration 〇 triangle is flat. In addition, although the fork 101 which is provided in the conveyance apparatus 23 of the conveyance chamber 3 of the vacuum side is demonstrated as a board|substrate holder, the present invention is also applicable, for example, to the fork 17a of the conveyance apparatus 15 of the atmospheric side, 17b. Further, the configuration of the substrate transfer device of the substrate holder of the present invention can be used, and is not limited to the slide arm type provided in the upper and lower stages, and may be configured not only in one-stage configuration but also in three stages, and is not limited to a sliding type, even if For example, a multi-joint arm type substrate transfer device may be used. Further, as the object to be transported by the substrate holder according to the present invention, -27-200941627 is not limited to the substrate for FPD manufacturing, and can be used as a substrate for various purposes. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view schematically showing a vacuum processing system. Fig. 2 is a plan view of the vacuum processing system of Fig. 1. Fig. 3 is a perspective view showing the schematic configuration of the transport mechanism. Fig. 4 is a perspective view showing a schematic configuration of the fork frame. Fig. 5 is a cross-sectional view showing the front end portion of the fork in the fork frame according to the first embodiment of the present invention. Fig. 6 is a cross-sectional view showing the front end portion of the fork in the fork frame according to the second embodiment of the present invention. Fig. 7 is a cross-sectional view showing the front end portion of the fork in the fork frame according to the third embodiment of the present invention. Fig. 8 is a cross-sectional view showing the front end portion of the fork in the fork frame according to the fourth embodiment of the present invention. Fig. 9 is a cross-sectional view showing the front end portion of the fork in the fork frame according to the fourth embodiment of the present invention. Fig. 10 is still another cross-sectional view showing the front end portion of the fork in the fork frame according to the fourth embodiment of the present invention. Fig. 11 is a plan view showing a support gripper in the fork frame according to the fifth embodiment of the present invention. Fig. 12 is a view showing a fixing structure for supporting the projections. Fig. 13 is a view showing the other example of the fixing structure for supporting the projections, Fig. -28-200941627. The 14th support! The support view of the protuberance is supported. Fig. 15 is a plan view showing a support picker showing another arrangement example of the support projections. Fig. 16 is a plan view showing a support gripper of still another arrangement example of the support projection. 〇 Fig. 17 is a plan view showing the fork of the arrangement example of the support projections. Fig. 18 is a side elevational view showing the support gripper of the arrangement example of the support projections. [Main component symbol description] la, lb, lc: process chamber 3: transfer chamber 5: load lock chamber β 1〇〇: vacuum processing system 101: fork frame 117: picker base 119: support picker 131 : Body 133: Cover portion 135: Mounting block 200: Supporting protrusion -29-

Claims (1)

200941627 十、申請專利範圍 1·—種基板保持具，具備有基部，和互相隔著間隔連 結於上述基部之多數支持搆件，在該些多數支持構件上保 持基板，其特徵爲： 上述支持構件具備有本體和保護該本體之前端的可裝 卸之保護構件。 2.如申請專利範圍第1項所記載之基板保持具，其 中， 上述本體構成中空之筒形狀。 3 .如申請專利範圍第2項所記載之基板保持具，其 中， 藉由上述保護構件塞住上述本體之前端。 4. 如申請專利範圍第3項所記載之基板保持具，其 中， 上述保護構件具有被插入至上述本體之內部的凸部。 5. 如申請專利範圍第1至4項中之任一項所記載之基 板保持具’其中’ 上述保護構件具有覆蓋上述本體之前端附近之周圍的 被覆部。 6. 如申請專利範圍第1至5項中之任一項所記載之基 板保持具，其中’ 上述本體係由CFRP所構成。 7. 如申請專利範圍第1至6項中之任一項所記載之基 板保持具’其中’ 200941627 上述保護構件係由金屬或楊氏係數爲IMpa以上 lOGpa以下之高分子材料所構成。 8 .如申請專利範圍第7項所記載之基板保持具，其 中， 上述金屬爲不鎌鋼或是銘。 9 .如申請專利範圍第7項所記載之基板保持具，其 中， ® 上述高分子材料爲氟橡膠、聚四氟乙烯樹脂或是尼龍 樹脂。 10. 如申請專利範圍第1至9項中之任一項所記載之 基板保持具，其中， 在上述本體之上面具有從下方抵接於基板之可裝卸的 第1突起部。 11. 如申請專利範圍第10項所記載之基板保持具，其 中， 〇 在上述保護構件之上部，具有從下方抵接於基板的第 2突起部。 12. 如申請專利範圍第11項所記載之基板保持具，其 中， 以上述本體之上面爲基準，相對於上述第1突起部之 頂點的高度’上述第2突起部之頂點的高度被形成較高。 1 3 ·如申請專利範圍第11或12項所記載之基板保持 具，其中， 上述本體具有能夠可變調節上述第1突起部之配設位 -31 - 200941627 置及/或配設數量的多數安裝部。 14. 一種基板搬運裝置，具備有可進出及退避之搬運 手臂部，和被安裝於該搬運手臂部之基板保持具’藉囱上 述基板保持具保持基板而予以搬運’其特徵爲： 上述基板保持具具備基部，和互相隔著間隔而被連結 於上述基部之多數支持構件’ 上述支持構件具備有本體和保護該本體之前端的可裝 卸之保護構件。 0 15. —種基板搬運裝置，具備有可進出及退避之搬運 手臂部，和被安裝於該搬運手臂部之基板保持具’藉由上 述基板保持具保持基板而予以搬運’其特徵爲： 上述基板保持具具備基部，和互相隔著間隔而被連結 於上述基部之多數支持構件， 上述支持構件具備有本體，和保護該本體之前端的可 裝卸之保護構件，和被設置在上述本體之上面，從下方抵 接於基板之可裝卸的突起部。 © 16. —種基板處理系統，具備處理基板之基板處理裝 置，和將基板搬運至該基板處理裝置之基板搬運裝置，其 特徵爲： 上述基板搬運裝置具備有可進出及退避之搬運手臂 部，和被安裝於該搬運手臂部保持基板之基板保持具， 上述基板保持具具備基部，和互相隔著間隔而被連結 於上述基部之多數支持構件， 上述支持構件具備有本體和保護該本體之前端的可裝 -32- 200941627 卸之保護構件。200941627 X. Patent Application No. 1 - A substrate holder having a base portion and a plurality of support members joined to each other at intervals with respect to each other, and holding a substrate on the plurality of support members, characterized in that: the support member A detachable protective member having a body and protecting the front end of the body. 2. The substrate holder according to claim 1, wherein the main body has a hollow cylindrical shape. 3. The substrate holder according to claim 2, wherein the front end of the body is plugged by the protective member. 4. The substrate holder according to claim 3, wherein the protective member has a convex portion that is inserted into the inside of the body. 5. The substrate holder according to any one of claims 1 to 4, wherein the protective member has a covering portion covering a periphery of the front end of the body. 6. The substrate holder according to any one of claims 1 to 5, wherein the above system is composed of CFRP. 7. The substrate holder according to any one of claims 1 to 6, wherein the above-mentioned protective member is composed of a metal material having a metal or a Young's modulus of IMpa or more and 10 MPa or less. 8. The substrate holder according to claim 7, wherein the metal is stainless steel or stainless steel. 9. The substrate holder according to claim 7, wherein the polymer material is fluororubber, polytetrafluoroethylene resin or nylon resin. The substrate holder according to any one of claims 1 to 9, wherein the upper surface of the main body has a detachable first projection that abuts against the substrate from below. 11. The substrate holder according to claim 10, wherein the upper portion of the protective member has a second protrusion that abuts against the substrate from below. 12. The substrate holder according to claim 11, wherein the height of the apex of the second protrusion is formed with respect to the height of the apex of the first protrusion based on the upper surface of the body high. The substrate holder according to claim 11 or 12, wherein the main body has a plurality of positions that can variably adjust the arrangement position of the first protrusions - 31 - 200941627 and/or the number of the arrangement Installation department. A substrate transfer device comprising: a transport arm portion that can be moved in and out; and a substrate holder attached to the transport arm portion, which is transported by the substrate holder holding substrate, wherein the substrate is held A plurality of support members having a base portion and being coupled to the base portion with a gap therebetween. The support member includes a body and a detachable protection member that protects the front end of the body. 0. The substrate transporting device includes a transport arm portion that can be moved in and out, and a substrate holder that is attached to the transport arm portion and that is transported by the substrate holder holding substrate. The substrate holder includes a base portion and a plurality of support members coupled to the base portion with a space therebetween. The support member includes a body, and a detachable protection member that protects the front end of the body, and is disposed on the upper surface of the body. The detachable protrusion of the substrate is abutted from below. A substrate processing system comprising: a substrate processing apparatus for processing a substrate; and a substrate transfer device for transporting the substrate to the substrate processing apparatus, wherein the substrate transfer device includes a transport arm portion that can be moved in and out. And a substrate holder attached to the conveyance arm portion holding substrate, wherein the substrate holder includes a base portion and a plurality of support members coupled to the base portion with a space therebetween, and the support member includes a body and a front end for protecting the body Can be installed -32- 200941627 Unloading protective components.
TW97147411A 2007-12-06 2008-12-05 A substrate holder, a substrate handling device, and a substrate processing system TWI470721B (en)

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