TWI470348B - 感光性樹脂組成物，使用其之光阻薄膜，光阻圖案之形成方法及印刷佈線板之製造方法 - Google Patents

感光性樹脂組成物，使用其之光阻薄膜，光阻圖案之形成方法及印刷佈線板之製造方法 Download PDF

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Publication number
TWI470348B
TWI470348B TW100112760A TW100112760A TWI470348B TW I470348 B TWI470348 B TW I470348B TW 100112760 A TW100112760 A TW 100112760A TW 100112760 A TW100112760 A TW 100112760A TW I470348 B TWI470348 B TW I470348B
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TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
wavelength
meth
acrylate
Prior art date
Application number
TW100112760A
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English (en)
Chinese (zh)
Other versions
TW201205187A (en
Inventor
Tsuyoshi Terada
Hiroki Toyota
Original Assignee
Nichigo Morton Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichigo Morton Co Ltd filed Critical Nichigo Morton Co Ltd
Publication of TW201205187A publication Critical patent/TW201205187A/zh
Application granted granted Critical
Publication of TWI470348B publication Critical patent/TWI470348B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW100112760A 2010-04-15 2011-04-13 感光性樹脂組成物，使用其之光阻薄膜，光阻圖案之形成方法及印刷佈線板之製造方法 TWI470348B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010093694 2010-04-15

Publications (2)

Publication Number Publication Date
TW201205187A TW201205187A (en) 2012-02-01
TWI470348B true TWI470348B (zh) 2015-01-21

Family

ID=44798565

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100112760A TWI470348B (zh) 2010-04-15 2011-04-13 感光性樹脂組成物，使用其之光阻薄膜，光阻圖案之形成方法及印刷佈線板之製造方法

Country Status (5)

Country Link
JP (1) JP5036890B2 (https=)
KR (1) KR101719025B1 (https=)
CN (1) CN102844709B (https=)
TW (1) TWI470348B (https=)
WO (1) WO2011129186A1 (https=)

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US9962923B2 (en) * 2013-10-15 2018-05-08 Agfa Nv Method for providing lithographic printing plates
KR102279715B1 (ko) 2014-05-09 2021-07-22 삼성전자주식회사 반도체 장치의 제조 방법 및 이에 의해 제조된 반도체 장치
CN106462066A (zh) * 2014-05-13 2017-02-22 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷布线板的制造方法
CN108121159B (zh) * 2016-11-29 2021-04-20 常州强力电子新材料股份有限公司 一种感光性树脂组合物及其应用
CN110357989B (zh) * 2018-04-11 2022-04-22 常州强力电子新材料股份有限公司 叔胺光敏剂、其制备方法、包含其的感光性树脂组合物及感光性树脂组合物的应用
CN110531583B (zh) * 2019-09-14 2023-09-29 浙江福斯特新材料研究院有限公司 感光性树脂组合物、干膜抗蚀层
CN116097171A (zh) * 2020-08-25 2023-05-09 富士胶片株式会社 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法
CN118235088A (zh) * 2022-01-17 2024-06-21 株式会社力森诺科 感光性树脂组合物、感光性元件及层叠体的制造方法

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CN1952792A (zh) * 2005-10-19 2007-04-25 京瓷美达株式会社 电子照相感光体以及图像形成装置
JP2007121751A (ja) * 2005-10-28 2007-05-17 Kyocera Mita Corp 電子写真感光体
EP1793275A2 (en) * 2005-12-02 2007-06-06 Fujifilm Corporation Method for preparation of lithographic printing plate and lithographic printing plate precursor
JP2009003177A (ja) * 2007-06-21 2009-01-08 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2009145613A (ja) * 2007-12-13 2009-07-02 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム、感光性樹脂組成物層およびレジストパターンの形成方法

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JP4652516B2 (ja) 1999-03-09 2011-03-16 株式会社林原生物化学研究所 ピラン誘導体
JP4556531B2 (ja) 2003-09-09 2010-10-06 三菱化学株式会社 青紫色レーザー感光性組成物、並びにそれを用いた画像形成材料、感光性画像形成材及び画像形成方法
EP1668417B1 (en) * 2003-09-22 2009-05-13 Agfa Graphics N.V. Photopolymerizable composition.
JP4446779B2 (ja) 2004-03-31 2010-04-07 ニチゴー・モートン株式会社 フォトレジストフィルム
JP2006154740A (ja) 2004-07-14 2006-06-15 Fuji Photo Film Co Ltd 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
JP2006091488A (ja) * 2004-09-24 2006-04-06 Kyocera Mita Corp 画像形成装置
JP4461005B2 (ja) * 2004-12-06 2010-05-12 日本合成化学工業株式会社 感光性樹脂組成物及びそれを用いたフォトレジストフィルム、レジストパターン形成方法
KR100934046B1 (ko) * 2005-05-23 2009-12-24 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP4911457B2 (ja) * 2005-12-02 2012-04-04 富士フイルム株式会社 平版印刷版の作製方法および平版印刷版原版
JP2007156111A (ja) * 2005-12-05 2007-06-21 Fujifilm Corp 感光性組成物、パターン形成材料、感光性積層体、及びパターン形成方法
JP4874659B2 (ja) 2006-01-24 2012-02-15 富士フイルム株式会社 アニリン化合物及びその製造方法、並びに、感光性組成物
JP4941182B2 (ja) 2007-08-29 2012-05-30 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1952792A (zh) * 2005-10-19 2007-04-25 京瓷美达株式会社 电子照相感光体以及图像形成装置
JP2007121751A (ja) * 2005-10-28 2007-05-17 Kyocera Mita Corp 電子写真感光体
EP1793275A2 (en) * 2005-12-02 2007-06-06 Fujifilm Corporation Method for preparation of lithographic printing plate and lithographic printing plate precursor
JP2009003177A (ja) * 2007-06-21 2009-01-08 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2009145613A (ja) * 2007-12-13 2009-07-02 Nippon Synthetic Chem Ind Co Ltd:The フォトレジストフィルム、感光性樹脂組成物層およびレジストパターンの形成方法

Also Published As

Publication number Publication date
CN102844709A (zh) 2012-12-26
KR101719025B1 (ko) 2017-03-22
KR20130095640A (ko) 2013-08-28
TW201205187A (en) 2012-02-01
JP2011237780A (ja) 2011-11-24
JP5036890B2 (ja) 2012-09-26
CN102844709B (zh) 2014-08-20
WO2011129186A1 (ja) 2011-10-20

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