TWI467681B - 半導體裝置之製造方法 - Google Patents

半導體裝置之製造方法 Download PDF

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Publication number
TWI467681B
TWI467681B TW97142607A TW97142607A TWI467681B TW I467681 B TWI467681 B TW I467681B TW 97142607 A TW97142607 A TW 97142607A TW 97142607 A TW97142607 A TW 97142607A TW I467681 B TWI467681 B TW I467681B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
bump
heater
bumps
substrate
Prior art date
Application number
TW97142607A
Other languages
English (en)
Chinese (zh)
Other versions
TW200933792A (en
Inventor
沖田孝典
Original Assignee
瑞薩電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞薩電子股份有限公司 filed Critical 瑞薩電子股份有限公司
Publication of TW200933792A publication Critical patent/TW200933792A/zh
Application granted granted Critical
Publication of TWI467681B publication Critical patent/TWI467681B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW97142607A 2007-11-16 2008-11-05 半導體裝置之製造方法 TWI467681B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007298500A JP5167779B2 (ja) 2007-11-16 2007-11-16 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200933792A TW200933792A (en) 2009-08-01
TWI467681B true TWI467681B (zh) 2015-01-01

Family

ID=40640851

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97142607A TWI467681B (zh) 2007-11-16 2008-11-05 半導體裝置之製造方法

Country Status (5)

Country Link
US (1) US20090127315A1 (https=)
JP (1) JP5167779B2 (https=)
KR (1) KR20090050989A (https=)
CN (1) CN101436560B (https=)
TW (1) TWI467681B (https=)

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US8381965B2 (en) 2010-07-22 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compress bonding
US8651359B2 (en) * 2010-08-23 2014-02-18 International Business Machines Corporation Flip chip bonder head for forming a uniform fillet
US8104666B1 (en) 2010-09-01 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compressive bonding with separate die-attach and reflow processes
US8177862B2 (en) * 2010-10-08 2012-05-15 Taiwan Semiconductor Manufacturing Co., Ltd Thermal compressive bond head
JP5565966B2 (ja) * 2011-01-26 2014-08-06 パナソニック株式会社 部品実装方法および部品実装装置
JP5865639B2 (ja) * 2011-09-15 2016-02-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
US8349116B1 (en) 2011-11-18 2013-01-08 LuxVue Technology Corporation Micro device transfer head heater assembly and method of transferring a micro device
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
US9773750B2 (en) * 2012-02-09 2017-09-26 Apple Inc. Method of transferring and bonding an array of micro devices
JP5973753B2 (ja) * 2012-03-08 2016-08-23 東レエンジニアリング株式会社 チップ受け渡し治具およびチップ受け渡し方法
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
US9165902B2 (en) * 2013-12-17 2015-10-20 Kulicke And Soffa Industries, Inc. Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
JP6450923B2 (ja) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
CN104201122B (zh) * 2014-08-13 2017-08-11 通富微电子股份有限公司 热压焊头水平调节的方法
SG11201706844QA (en) * 2015-04-10 2017-10-30 Ev Group E Thallner Gmbh Substrate holder and method for bonding two substrates
JP6581389B2 (ja) * 2015-05-12 2019-09-25 東芝メモリ株式会社 半導体装置の製造装置及び製造方法
US9929121B2 (en) 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
JP6553459B2 (ja) * 2015-09-09 2019-07-31 東芝メモリ株式会社 半導体装置の製造方法および実装装置
US10472823B2 (en) * 2016-06-24 2019-11-12 Apache Industrial Services, Inc. Formwork system
TWI607587B (zh) * 2016-09-13 2017-12-01 台灣琭旦股份有限公司 固晶穩固製程
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
EP4135040A1 (en) 2017-09-19 2023-02-15 Google LLC Pillars as stops for precise chip-to-chip separation
KR102252552B1 (ko) * 2019-05-03 2021-05-17 주식회사 프로텍 플립칩 레이저 본딩 시스템
CN111128773A (zh) * 2019-12-20 2020-05-08 江苏长电科技股份有限公司 一种贴装芯片的方法
TWI727853B (zh) * 2020-07-15 2021-05-11 歆熾電氣技術股份有限公司 晶片移轉系統與晶片移轉方法
KR102690639B1 (ko) * 2020-07-30 2024-08-05 가부시키가이샤 신가와 실장 장치 및 실장 장치에 있어서의 평행도 검출 방법
US20230268313A1 (en) * 2020-09-02 2023-08-24 Shinkawa Ltd. Semiconductor device manufacturing device and manufacturing method
CN114597138A (zh) * 2020-12-03 2022-06-07 群创光电股份有限公司 半导体封装的制造方法
KR102537573B1 (ko) * 2023-01-27 2023-05-30 주식회사 엠아이이큅먼트코리아 플립 칩 레이저 본딩장치의 본딩 툴

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JP2006073873A (ja) * 2004-09-03 2006-03-16 Matsushita Electric Ind Co Ltd 電子部品実装方法及び装置
US7148081B2 (en) * 2003-05-30 2006-12-12 Renesas Technology Corp. Method of manufacturing a semiconductor device

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US5368217A (en) * 1993-08-25 1994-11-29 Microelectronics And Computer Technology Corporation High force compression flip chip bonding method and system
JP2793528B2 (ja) * 1995-09-22 1998-09-03 インターナショナル・ビジネス・マシーンズ・コーポレイション ハンダ付け方法、ハンダ付け装置
JPH09153525A (ja) * 1995-11-30 1997-06-10 Toshiba Corp ボンディング装置およびボンディング方法
JP3335826B2 (ja) * 1995-12-05 2002-10-21 株式会社日立製作所 はんだバンプの測定装置
US20020046627A1 (en) * 1998-06-10 2002-04-25 Hitoshi Amita Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product
JP2002110740A (ja) * 2000-10-03 2002-04-12 Fujitsu Ltd 半導体装置の実装方法及び実装装置
JP2004119430A (ja) * 2002-09-24 2004-04-15 Tadatomo Suga 接合装置および方法
WO2005029658A1 (ja) * 2003-09-22 2005-03-31 Murata Manufacturing Co., Ltd. 発光素子の装着方法および装着装置
JP2005259925A (ja) * 2004-03-11 2005-09-22 Sony Corp 実装方法
JP2006054275A (ja) * 2004-08-11 2006-02-23 Sony Corp 半導体装置の製造方法および半導体製造装置
JP2006177730A (ja) * 2004-12-21 2006-07-06 Renesas Technology Corp 撮像検査装置および方法
CN100363709C (zh) * 2005-03-25 2008-01-23 鸿富锦精密工业（深圳）有限公司 激光量测机台扫描精度验证方法
JP4669371B2 (ja) * 2005-10-12 2011-04-13 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置の製造装置

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US7148081B2 (en) * 2003-05-30 2006-12-12 Renesas Technology Corp. Method of manufacturing a semiconductor device
JP2006073873A (ja) * 2004-09-03 2006-03-16 Matsushita Electric Ind Co Ltd 電子部品実装方法及び装置

Also Published As

Publication number Publication date
JP2009124047A (ja) 2009-06-04
KR20090050989A (ko) 2009-05-20
CN101436560B (zh) 2012-06-20
TW200933792A (en) 2009-08-01
US20090127315A1 (en) 2009-05-21
JP5167779B2 (ja) 2013-03-21
CN101436560A (zh) 2009-05-20

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