JP4669371B2 - 半導体装置の製造方法および半導体装置の製造装置 - Google Patents
半導体装置の製造方法および半導体装置の製造装置 Download PDFInfo
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Description
この問題は、ほとんどの半田バンプ1の大きさが設計値通りであったとしても、大きな半田バンプ1Lが一つ含まれているだけで、生じてしまう。
Claims (19)
- 半導体チップと基板とを半田を介して接続する半導体装置の製造方法であって、
前記半導体チップをヘッドで保持する工程と、
前記半導体チップと前記基板とを前記半田を介して接触させる工程と、
前記半田を加熱し溶解させる工程と、
前記半田が融解した状態において、前記半導体チップを実質的に一定の力で前記基板方向に押すか、又は、前記半導体チップを実質的に一定の力で前記基板と逆の方向に引く荷重一定制御を行う工程と、
前記荷重一定制御を行いながら前記ヘッドの温度が安定した時点での前記ヘッドの位置を基準位置として記憶する工程と、
前記半田の加熱を終了する直前もしくは直後に、前記荷重一定制御を終了するとともに前記基準位置からの前記ヘッドの変位量が所定の値になるように前記ヘッドの位置を制御する位置制御を開始する工程と、
をこの順に行うことを特徴とする半導体装置の製造方法。 - 前記荷重一定制御を行いながら前記ヘッドの温度を上昇させることによって前記半田を更に高温に加熱する工程を更に有し、この工程に続いて、前記ヘッドの温度が安定した時点での前記ヘッドの位置を基準位置として記憶する工程を行うことを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記荷重一定制御では、
前記半田が融解した状態において前記半導体チップを実質的に一定の力で前記基板方向に押すこと、
を特徴とする請求項1又は2に記載の半導体装置の製造方法。 - 前記荷重一定制御では、
前記半田が融解した状態において前記半導体チップを実質的に一定の力で前記基板と逆の方向に引くこと、
を特徴とする請求項1又は2に記載の半導体装置の製造方法。 - 前記荷重一定制御は、
前記半導体チップを前記基板方向へ押す力を測定する工程と、
前記力が実質的に一定となるように前記半導体チップと前記基板との距離を調整する工程と、
を有すること、
を特徴とする請求項3に記載の半導体装置の製造方法。 - 前記半導体チップを前記基板方向へ押す力を測定する工程では、前記半導体チップが前記ヘッドを押す力を測定すること、
を特徴とする請求項5に記載の半導体装置の製造方法。 - 前記荷重一定制御は、
前記半導体チップを前記基板と逆の方向へ引く力を測定する工程と、
前記力が実質的に一定となるように前記半導体チップと前記基板との距離を調整する工程と、
を有すること、
を特徴とする請求項4に記載の半導体装置の製造方法。 - 前記半導体チップを前記基板と逆の方向へ引く力を測定する工程では、前記半導体チップが前記ヘッドを引く力を測定すること、
を特徴とする請求項7に記載の半導体装置の製造方法。 - 融解した状態の前記半田の温度が上昇している間に、前記半導体チップを実質的に一定の力で前記基板方向に押すこと、
を特徴とする請求項3に記載の半導体装置の製造方法。 - 融解した状態の前記半田の温度が降下している間に、前記半導体チップを実質的に一定の力で前記基板と逆の方向に引くこと、
を特徴とする請求項4に記載の半導体装置の製造方法。 - 基板を載せるステージと、
前記基板上に半田を介して半導体チップが接続されるように前記半導体チップを移動させる駆動機構と、
駆動機構を制御する制御部と、
前記半田が融解した状態において、前記半導体チップが前記基板方向に押される力、又は、前記半導体チップが前記基板と逆の方向に引かれる力を検出するセンサと、
を有し、
前記駆動機構は、前記半導体チップを保持するヘッドと、前記ヘッドを加熱するヒータと、を有し、
前記制御部は、
前記半導体チップを前記ヘッドで保持させる制御と、
前記半導体チップと前記基板とを前記半田を介して接触させる制御と、
前記半田を加熱し溶解させる制御と、
前記半田が融解した状態において、前記半導体チップを実質的に一定の力で前記基板方向に押し込ませるか、又は、前記半導体チップを実質的に一定の力で前記基板と逆の方向に引かせる荷重一定制御と、
前記荷重一定制御を行いながら前記ヘッドの温度が安定した時点での前記ヘッドの位置を基準位置として記憶する制御と、
前記ヒータを切る直前もしくは直後に、前記荷重一定制御を終了するとともに前記基準位置からの前記ヘッドの変位量が所定の値になるように前記ヘッドの位置を制御する位置制御を開始する制御と、
をこの順に行うことを特徴とする半導体装置の製造装置。 - 前記制御部は、前記荷重一定制御を行いながら前記ヘッドの温度を上昇させることによって前記半田を更に高温に加熱させる制御を更に行い、この制御に続いて、前記ヘッドの温度が安定した時点での前記ヘッドの位置を基準位置として記憶する制御を行うことを特徴とする請求項11に記載の半導体装置の製造装置。
- 前記センサが、前記半田が融解した状態において前記半導体チップが前記基板方向に押される力を検出すること、
を特徴とする請求項11又は12に記載の半導体装置の製造装置。 - 前記センサが、前記半田が融解した状態において前記半導体チップが前記基板と逆の方向に引かれる力を検出すること、
を特徴とする請求項11又は12に記載の半導体装置の製造装置。 - 前記センサが、前記半導体チップが前記ヘッドを押す力を検出することを特徴とする請求項13に記載の半導体装置の製造装置。
- 前記センサが、前記半導体チップが前記ヘッドを引く力を検出することを特徴とする請求項14に記載の半導体装置の製造装置。
- 前記センサの分解能が0.02N以下であることを特徴とする請求項11乃至16の何れか一項に記載の半導体装置の製造装置。
- 半導体チップと基板とを外部端子を介して接続する半導体装置の製造方法であって、
前記半導体チップをヘッドで保持する工程と、
前記半導体チップと前記基板とを前記外部端子を介して接触させる工程と、
前記外部端子を加熱し溶解させる工程と、
前記外部端子が融解した状態において、前記半導体チップを実質的に一定の力で前記基板方向に押すか、又は、前記半導体チップを実質的に一定の力で前記基板と逆の方向に引く荷重一定制御を行う工程と、
前記荷重一定制御を行いながら前記ヘッドの温度が安定した時点での前記ヘッドの位置を基準位置として記憶する工程と、
前記外部端子の加熱を終了する直前もしくは直後に、前記荷重一定制御を終了するとともに前記基準位置からの前記ヘッドの変位量が所定の値になるように前記ヘッドの位置を制御する位置制御を開始する工程と、
をこの順に行うことを特徴とする半導体装置の製造方法。 - 基板を載せるステージと、
前記基板上に外部端子を介して半導体チップが接続されるように前記半導体チップを移動させる駆動機構と、
駆動機構を制御する制御部と、
前記外部端子が融解した状態において、前記半導体チップが前記基板方向に押される力、又は、前記半導体チップが前記基板と逆の方向に引かれる力を検出するセンサと、
を有し、
前記駆動機構は、前記半導体チップを保持するヘッドと、前記ヘッドを加熱するヒータと、を有し、
前記制御部は、
前記半導体チップを前記ヘッドで保持させる制御と、
前記半導体チップと前記基板とを前記外部端子を介して接触させる制御と、
前記外部端子を加熱し溶解させる制御と、
前記外部端子が融解した状態において、前記半導体チップを実質的に一定の力で前記基板方向に押し込ませるか、又は、前記半導体チップを実質的に一定の力で前記基板と逆の方向に引かせる荷重一定制御と、
前記荷重一定制御を行いながら前記ヘッドの温度が安定した時点での前記ヘッドの位置を基準位置として記憶する制御と、
前記ヒータを切る直前もしくは直後に、前記荷重一定制御を終了するとともに前記基準位置からの前記ヘッドの変位量が所定の値になるように前記ヘッドの位置を制御する位置制御を開始する制御と、
をこの順に行うことを特徴とする半導体装置の製造装置。
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JP2005297586A JP4669371B2 (ja) | 2005-10-12 | 2005-10-12 | 半導体装置の製造方法および半導体装置の製造装置 |
US11/545,467 US20070099412A1 (en) | 2005-10-12 | 2006-10-11 | Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor |
CNA2006101318360A CN1949469A (zh) | 2005-10-12 | 2006-10-12 | 在布线板上贴装半导体器件以确保其间不变间隙的焊接方法及其焊接装置 |
US12/232,577 US7861913B2 (en) | 2005-10-12 | 2008-09-19 | Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor |
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