TWI489571B - Electronic component building device and method thereof - Google Patents

Electronic component building device and method thereof Download PDF

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Publication number
TWI489571B
TWI489571B TW100107875A TW100107875A TWI489571B TW I489571 B TWI489571 B TW I489571B TW 100107875 A TW100107875 A TW 100107875A TW 100107875 A TW100107875 A TW 100107875A TW I489571 B TWI489571 B TW I489571B
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Taiwan
Prior art keywords
substrate
electronic component
bonding tool
electrode
bonding
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TW100107875A
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English (en)
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TW201205701A (en
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Koji Hojo
Makoto Takahashi
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Shinkawa Kk
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Publication of TW201205701A publication Critical patent/TW201205701A/zh
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Publication of TWI489571B publication Critical patent/TWI489571B/zh

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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/3494—Heating methods for reflowing of solder
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  • Engineering & Computer Science (AREA)
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Description

電子零件構裝裝置及其方法
本發明係關於將電子零件構裝於基板等之電子零件構裝裝置之構造及其方法。
將於電極形成焊料凸塊之附有焊料凸塊之電子零件，藉由熱壓接構裝於基板之方法已多有被使用。該方法係以壓接工具將電子零件按壓於基板的同時，加熱電子零件使焊料熔融，將焊料接合於基板之電極。於該熱壓接步驟，若焊料凸塊熔融後亦持續按壓，由於會將熔融之焊料壓毀，因此，在焊料凸塊熔融前先固定熱壓接工具的位置，以防止壓毀焊料凸塊。然而，即使熱壓接工具在被固定的狀態，檢測按壓載重之測力計殘留有因載重造成之變形扭曲，當該殘留之扭曲被釋放時，熱壓接工具往下方移動，有時會將熔融之焊料凸塊壓毀。
於是已有下列提案，亦即在焊料凸塊熔融前，降低熱壓接工具之按壓載重，以熱壓接工具將具有焊料凸塊之電子零件按壓於基板，開始加熱電子零件後，按壓載重減少至既定值以下時，即判斷焊料已熔融並使熱壓接工具上升(例如，參照專利文獻1,2)。
又，已有下列提案，亦即以熱壓接工具使電子零件的溫度開始上升後，將按壓頭對電子零件的按壓載重作一定控制，檢測出測力計測定之載重減少，即判斷焊料已熔融，從按壓頭之載重為一定載重控制切換為吸附嘴前端高度之位置為一定之位置控制，焊料熔融時亦可確實管理電子零件之背面高度(例如，參照專利文獻3)。
(專利文獻1)日本專利第3399323號說明書
(專利文獻2)日本專利第3399324號說明書
(專利文獻3)日本特開2003-31993號公報
另一方面，近年亦多使用金焊料熔融接合，亦即於電子零件之電極形成金凸塊，再於基板之銅電極表面設置薄的焊料皮膜，將金凸塊的金與焊料熱熔融接合。此時，於基板之電極表面形成之皮膜厚度為10~30μm程度，由於很薄，因此在專利文獻1~3所揭示之習知技術，在載重減少之後一刻之熱壓接工具的下沈量比焊料之皮膜厚度大，構裝電子零件時，於電子零件之電極形成之金凸塊的前端有時會接觸基板之銅電極的表面。此時，使熱壓接工具上升前，電子零件或金凸塊負有載重，電子零件因其載重而受損，或因金凸塊與銅電極之接觸，造成金凸塊變形而與相鄰之金凸塊彼此接觸，有時無法維持良好之接合品質。
在此，本發明係以於透過熱熔融之接合金屬將電子零件與基板接合之電子零件構裝裝置，提升接合品質為目的。
本發明之電子零件構裝裝置，係透過熱熔融之接合金屬將電子零件之電極與基板之電極接合，以將電子零件構裝於基板上，其特徵在於，具備：接合工具，被驅動於與基板接近離開之方向，將電子零件熱壓接於基板；驅動部，於接合工具之與基板接近離開之方向進行驅動；位置檢測部，檢測接合工具之與基板接近離開之方向之位置；以及控制部，藉由驅動部使接合工具之與基板接近離開之方向之位置變化；控制部具有接合工具位置保持手段，該接合工具位置保持手段，在加熱電子零件之同時接合工具自基準位置接近基板既定距離時，判斷電子零件之電極與基板之電極間之接合金屬已熱熔融，保持此時接合工具之相對於基板接近離開之方向之位置。
於本發明之電子零件構裝裝置，較佳為，電子零件於電極上形成凸塊；基板於電極形成接合金屬之皮膜；控制部，進一步具有：抵接檢測手段，根據來自位置檢測部之訊號判斷凸塊與皮膜之抵接；以及基準位置設定手段，藉由抵接檢測手段判斷凸塊與皮膜已抵接時，將接合工具之相對於基板之位置設定為基準位置。
於本發明之電子零件構裝裝置，較佳為，控制部，進一步具有：第2基準位置設定手段，藉由基準位置設定手段設定基準位置後，在接合工具之與基板接近離開之方向之距離從增加變化成減少時，將接合工具之相對於基板之位置設定為第2基準位置；以及第2接合工具位置保持手段，在加熱電子零件之同時接合工具自第2基準位置接近基板第2既定距離時，判斷電子零件之電極與基板之電極間之接合金屬已熱熔融，保持此時接合工具之相對於基板接近離開之方向之位置。
本發明之電子零件構裝方法，係透過熱熔融之接合金屬將電子零件之電極與基板之電極接合，以將電子零件構裝於基板上，其特徵在於，具有：準備電子零件構裝裝置之步驟；以及接合工具位置保持步驟，在加熱電子零件之同時接合工具自基準位置接近基板既定距離時，判斷電子零件之電極與基板之電極間之接合金屬已熱熔融，保持此時接合工具之相對於基板接近離開之方向之位置；該電子零件構裝裝置，具備：接合工具，被驅動於與基板接近離開之方向，將電子零件熱壓接於基板；驅動部，於接合工具之與基板接近離開之方向進行驅動；以及位置檢測部，檢測接合工具之與基板接近離開之方向之位置。
於本發明之電子零件構裝方法，較佳為，電子零件於電極上形成凸塊；基板於電極形成接合金屬之皮膜；進一步具有：抵接檢測步驟，根據來自位置檢測部之訊號判斷凸塊與皮膜之抵接；以及基準位置設定步驟，藉由抵接檢測步驟判斷凸塊與皮膜已抵接時，將接合工具之相對於基板之位置設定為基準位置。
於本發明之電子零件構裝方法，較佳為，進一步具有：第2基準位置設定步驟，藉由基準位置設定步驟設定基準位置後，在接合工具之與基板接近離開之方向之距離從增加變化成減少時，將接合工具之相對於基板之位置設定為第2基準位置；以及第2接合工具位置保持步驟，在加熱電子零件之同時接合工具自第2基準位置接近基板第2既定距離時，判斷電子零件之電極與基板之電極間之接合金屬已熱熔融，保持此時接合工具之相對於基板接近離開之方向之位置。
本發明於透過熱熔融之接合金屬將電子零件與基板接合之電子零件構裝裝置，可達成提升接合品質之效果。
以下，參照圖式說明本發明之實施形態。如圖1所示，本發明之電子零件構裝裝置100，具備：基座10、從基座10往上部延伸之框架11、從框架11上部突出之上部凸緣12、設置於框架11側面上下方向之導件14、可於上下方向自由滑動地安裝於導件14之滑件16、固定於滑件16且可與滑件16同時於上下方向移動之升降塊15、固定於升降塊15之螺帽17、螺入螺帽17之進給螺桿18、固定於上部凸緣12並使進給螺桿18旋轉之馬達13、安裝於升降塊15下部之音圈馬達20、藉由音圈馬達20於上下方向移動之桿件26、安裝於桿件26前端之陶瓷加熱器27、安裝於陶瓷加熱器27下端用以吸附電子零件31之接合工具28、吸附固定基板42之接合載台41、以及控制部50。馬達13與音圈馬達20係可將接合工具28驅動於上下方向之驅動部。
音圈馬達20，包含：套管21、沿著套管21內周固定之永久磁鐵之固定件22、以及配置於固定件22內周之可動件即線圈23。桿件26，透過板簧25安裝於套管21。又，於桿件26固定有L字形線性標尺61並於其垂直部分設有微小刻度。又，於與線性標尺61對向之套管21的外面安裝有用以讀取設於線性標尺61之刻度之線性標尺讀頭62。線性標尺61與線性標尺讀頭62構成用以檢測接合工具28之高度方向位置的位置檢測部。從電源19供應驅動用電源至音圈馬達20之線圈23。接合載台41於內部具備用以加熱吸附固定於接合載台41之基板42之載台加熱器48。
控制部50，係於內部包含進行訊號處理之CPU51與記憶體52之電腦，記憶體52中含有：進行接合控制之接合程式53、控制用資料58、基準位置設定程式54、接合工具位置保持程式55、第2基準位置設定程式56、第2接合工具位置保持程式57、以及抵接檢測程式59。
馬達13連接於控制部50，依據控制部50之指令來控制旋轉方向、旋轉角度；電源19連接於控制部50，依據控制部50之指令來改變輸出至線圈23之電流、電壓；陶瓷加熱器27、載台加熱器48連接於控制部50，依據控制部50之指令來控制其發熱狀態。
如圖2所示，被上下反轉吸附於接合工具28前端之電子零件31，於表面設有複數個電極32，且於各個電極32上形成有各個金凸塊33。金凸塊33，具有電極32側之圓板型基部34、與圓錐形且從基部突出之突部35。又，吸附固定於接合載台41之基板42，於表面形成有銅電極43，且於銅電極43表面形成有焊料皮膜44。該焊料皮膜44之厚度非常薄，10~30μm程度。電極32、金凸塊33、與基板之銅電極43分別配置成相對向。
如圖3所示，線性標尺61於線性標尺本體61a上設有非常細小間距L之刻度61b。線性標尺讀頭62包含：於內部照射線性標尺61之刻度61b之光源、使來自光源之光透射之格子、檢測線性標尺61之刻度61b所反射之光之受光元件、以及處理自受光元件輸入之訊號之訊號處理部。自光源射出之光通過格子在線性標尺61之刻度61b反射，在如光二極體之受光元件上產生干涉條紋。線性標尺61朝刻度61b之長邊方向與線性標尺讀頭62相對性地移動時，該干涉條紋移動，自受光元件輸出刻度61b之間距L或間距L之1/2週期的正弦波訊號。正弦波訊號係相位相差90度之二相正弦波。線性標尺讀頭62，在訊號處理部根據上述二相正弦波之輸出差輸出線性標尺61與線性標尺讀頭62之相對移動量。當刻度61b之間距L例如為數μm時，移動量之檢測精度為1nm程度。
根據如上構成之電子零件構裝裝置100，參照圖4~圖6說明將圖2所示之電子零件31接合於基板42之接合動作。此處，電子零件係包含半導體晶片、電晶體、二極體等。如圖2所示，電子零件31之電極32與基板42之銅電極43對準後，控制部50，如圖4之步驟S101從圖5之時間t1 ~t2 所示，開始使接合工具從初始高度H0 下降之下降動作。該下降動作，使圖1所示之馬達13旋轉並使進給螺桿18旋轉，使進給螺桿18螺入螺帽17所固定之升降塊15往下方移動。控制部50，藉由馬達13之旋轉角度檢測出下降位置，如圖4之步驟S102，判斷是否已下降至圖5所示之既定高度H1 。下降至高度H1 時，金凸塊33與焊料皮膜44、銅電極43如圖6(a)所示雖相當接近，但金凸塊33之突部35與皮膜44間尚有間隙。在下降動作，由於音圈馬達20、桿件26、接合工具28成為一體下降，所以安裝於桿件26之線性標尺61與音圈馬達20之套管21間未產生高度差，來自線性標尺讀頭62之檢測訊號從初始輸出後未變動。
接著，控制部50判斷已下降至既定高度H1 時，使馬達13停止並停止下降動作，如圖4之步驟S103所示，開始檢測圖2所示之金凸塊33前端抵接基板42之銅電極43之焊料皮膜44之位置的搜尋動作。如圖5之時間t2 ~t3 所示，搜尋動作為漸漸降低接合工具28之高度直到金凸塊33之突部35前端抵接焊料皮膜44表面為止。該動作，例如，以如下使對音圈馬達20之線圈23的通電電流改變來進行。
控制部50輸出搜尋動作之下降位置指令時，電源19根據該下降位置之指令值對音圈馬達20之線圈23通電流。之後，線圈23往下方移動，該前端24接觸桿件26上端。由於桿件26藉由板簧25安裝於套管21，因此流動於線圈23之電流增加，線圈23之前端24將桿件26下壓，板簧25對應其下壓力撓曲後，桿件26朝下方移動，接合工具28前端漸漸下降。桿件26朝下方移動時，由於固定於桿件26之線性標尺61與音圈馬達20之套管21間之相對高度開始有差距，因此，線性標尺讀頭62檢測出線性標尺61之移動量。控制部50，根據該線性標尺讀頭62檢測出之訊號的變化取得接合工具28之下降位置，對下降位置之指令值乘上反饋值，調整自電源輸出之電流。接著，可進行使流動於線圈23之電流漸漸增加並使接合工具28前端漸漸下降的搜尋動作。
搜尋動作期間，控制部50，如圖4之步驟S104所示，藉由抵接檢測手段監視金凸塊33之突部35前端是否已抵接焊料皮膜44表面。金凸塊33之突部35前端抵接焊料皮膜44時，線圈23停止往下方移動，以線性標尺讀頭62檢測出之下降位置與搜尋動作時之下降位置的指令值之間開始有差距。該下降位置之指令值與線性標尺讀頭62檢測出之下降位置的差值超過既定之閾值時，控制部50判斷金凸塊33之突部35前端已抵接焊料皮膜44(抵接檢測步驟)。此外，由於線性標尺61之上下方向位置被調整為金凸塊33之突部35前端抵接焊料皮膜44時，刻度61b之長邊方向之中央會在線性標尺讀頭62的正面，因此，線性標尺讀頭62可測量金凸塊33之突部35前端抵接焊料皮膜44之位置為中心時上下方向的移動量。
如圖4之步驟S105，圖5之時間t3 所示，控制部50判斷金凸塊33之突部35前端已抵接焊料皮膜44時，判斷接合工具28已達基準位置之高度H2 ，將此時線性標尺讀頭62所檢測出之高度H2 設定為接合工具28的基準高度(基準位置)(基準位置設定)。又，圖6(b)表示金凸塊33之突部35前端已抵接焊料皮膜44的狀態。
控制部50，設定基準高度後，如圖4之步驟S106所示，進行接合工具28將基板42下壓之按壓載重為一定之載重一定動作。該動作，例如，可使通電於音圈馬達20之線圈23的電流值略為一定，亦可使線圈23之前端24將桿件26下壓之力成為一定。又，如先前所述，亦可設置檢測出接合工具28將基板42下壓之按壓載重的載重感測器，改變線圈23之電流以使該載重感測器檢測出之按壓載重為一定來進行控制。如圖4之步驟S107，控制部50，取線性標尺讀頭62檢測出之高度方向的移動量與基準高度H2 之差值，金凸塊33之突部35前端抵接焊料皮膜44時，將自接合工具28的高度H2 (基準高度)接近基板42之距離，亦即自基準高度H2 向下之移動距離作為下沈量D來計算。控制部50，如圖4之步驟S108所示，開始監視下沈量D是否超過既定之閾值。
自圖5之時間t1 ~時間t3 間，由於金凸塊33之突部35前端未抵接焊料皮膜44，焊料皮膜44之溫度藉由圖1所示之載台加熱器48，成為與基板42之溫度相同的溫度To 。另一方面，電子零件31被配置於接合工具28上部之陶瓷加熱器27加熱至更高溫。因此，於圖5之時間t3 ，金凸塊33之突部35前端抵接焊料皮膜44時，自金凸塊33之突部35前端開始傳熱至焊料皮膜44。接著，於圖5之時間t4 ，焊料皮膜44之溫度開始上升。接著，自圖5之時間t4 開始至時間t5 ，焊料皮膜44之溫度持續上升，伴隨於此，銅電極43之溫度亦上升，其結果，銅電極43與焊料皮膜44熱膨脹。其間，由於下壓載重為一定，因此，接合工具28之位置自金凸塊33前端抵接焊料皮膜44時之基準高度H2 漸漸上升，於時間t5 上升至高度H3 。此時，由於接合工具28之位置為比基準高度H2 高之高度H3 ，因此，如圖5所示，由於自基準高度H2 之向下移動量D1 (=H2 -H3 )為負值，因此下沈量D未超過既定之閾值。
於圖5所示之時間t5 ，焊料皮膜44之溫度上升至焊料之熔融溫度T1 時，焊料皮膜44開始熔融。此時，由於接合工具28被控制為按壓載重為一定，因此，如圖6(c)所示，金凸塊33之突部35沈入熔融之焊料皮膜44中。亦即，在圖5所示之時間t5 、高度H3 ，接合工具28之高度自上升變為下降。接著，下降之突部35周圍被熔融之焊料45包圍。如此，當金凸塊33之突部35前端下沈至焊料皮膜44中，接合工具28之高度處於比基準高度H2 更低的位置，自基準高度H2 往下方向之移動量，亦即下沈量D成為正值。接著，如圖5之時間t6 所示，接合工具28之高度成為H4 ，下沈量D(=H2 -H4 )成為既定值時，如圖6(c)所示，金凸塊33之突部35前端與基板42之銅電極43間，焊料皮膜44成為以數μm厚度存在的狀態。接著，下沈量D超過既定之閾值時，如圖4之步驟S109所示，控制部50判斷焊料皮膜44已熱熔融並停止載重一定控制，接合工具28之高度在時間t6 之高度H4 開始保持為一定之接合工具位置保持動作。
該動作，舉一例而言，亦可使接合工具28之高度為H6 之狀態，檢測線性標尺讀頭62檢測出之上下方向的移動量，改變對音圈馬達20之線圈23之通電電流，使與基準高度H2 之差值在既定之閾值以下。由於焊料皮膜44之厚度為10~30μm，因此藉由線性標尺讀頭62以1nm程度測量、控制接合工具28之上下方向的位置，如圖6(c)所示，可於金凸塊33之突部35前端與基板42之銅電極43間維持厚度數μm之焊料皮膜44的狀態。
控制部50，於接合工具位置保持動作開始的同時，如圖4之步驟S110所示，開始冷卻動作。該冷卻動作，例如，將加熱接合工具28之陶瓷加熱器27停止的同時，供應冷卻空氣至陶瓷加熱器27進行冷卻，冷卻陶瓷加熱器27的同時，亦將接合工具28及吸附於其前之電子零件31冷卻。藉此，如圖6(c)所示，金凸塊33之突部35前端與基板42之銅電極43間，維持焊料皮膜44之厚度為數μm之狀態，焊料45持續被冷卻。接著，如圖5之時間t7 所示，焊料皮膜44之溫度下降至焊料之凝固溫度T3 時，焊料凝固，如圖6(d)所示，金凸塊33之突部35前端與基板42之銅電極43間，焊料皮膜44之厚度為數μm之狀態下，焊料45凝固成為接合金屬46。控制部50，如圖4之步驟S111所示，經過既定時間後，判斷已完成冷卻，解除接合工具28對電子零件31之吸附，如圖4之步驟S112所示，藉由馬達13使進給螺桿18旋轉，使接合工具28上升至初始高度H0 ，結束電子零件31之接合。
如上所述，本實施形態之電子零件構裝裝置100，係以接合工具28之下沈量D判斷焊料皮膜44之熔融，由於自載重一定控制轉移至接合位置保持控制，因此可將接合工具28之高度維持於因焊料熔融造成之微小下沈量D的位置。藉此，金凸塊33之突部35前端位於薄焊料皮膜44之厚度中，金凸塊33之突部35前端在未接觸基板42之銅電極43的狀態下，可使焊料凝固進行電子零件31之構裝。接著，可抑制金凸塊33之突部35與銅電極43接觸，可抑制金凸塊33變形並與相鄰之金凸塊33接觸而成為不良品，或因接觸造成之載重而損壞電子零件，可提升接合之品質。
在上述實施形態，雖已說明將金凸塊33之突部35前端抵接焊料皮膜44時之狀態的高度設定為接合工具28之基準高度H2 ，但亦可於如圖5所示之時間t5 ，金凸塊33之突部35前端抵接焊料皮膜44後，將接合工具28之高度自上升變為下降時之高度H3 作為第2基準高度(第2基準位置設定)。此時，與先前說明之實施形態相同，下沈量成為如圖5所示之D2 =H3 -H4 時，自載重一定控制切換為接合工具位置保持控制(第2接合工具位置保持動作)。此種情形亦可達到與先前所述之實施形態相同的效果。
10．．．基座
11．．．框架
12．．．上部凸緣
13．．．馬達
14．．．導件
15．．．升降塊
16．．．滑件
17．．．螺帽
18．．．進給螺桿
19．．．電源
20．．．音圈馬達
21．．．套管
22．．．固定件
23．．．線圈
24．．．前端
25．．．板簧
26．．．桿件
27．．．陶瓷加熱器
28．．．接合工具
31．．．電子零件
32．．．電極
33．．．金凸塊
34．．．基部
35．．．突部
41．．．接合載台
42．．．基板
43．．．銅電極
44．．．焊料皮膜
45．．．焊料
46．．．接合金屬
48．．．載台加熱器
50．．．控制部
51．．．CPU
52．．．記憶體
53．．．接合程式
54．．．基準位置設定程式
55．．．接合工具位置保持程式
56．．．第2基準位置設定程式
57．．．第2接合工具位置保持程式
58．．．控制用資料
59．．．抵接檢測程式
61．．．線性標尺
61a．．．線性標尺本體
61b．．．刻度
62．．．線性標尺讀頭
100．．．電子零件構裝裝置
圖1係表示本發明實施形態之電子零件構裝裝置之構成的系統圖。
圖2係表示安裝於本發明實施形態之電子零件構裝裝置之電子零件與基板的說明圖。
圖3係表示用於本發明實施形態之電子零件構裝裝置之線性標尺的示意圖。
圖4係表示本發明實施形態之電子零件構裝裝置之動作的流程圖。
圖5係表示本發明實施形態之電子零件構裝裝置在作動中，接合工具之位置、按壓載重、以及焊料層之溫度變化的說明圖。
圖6(a)~(d)係表示藉由本發明實施形態之電子零件構裝裝置將金凸塊與焊料皮膜進行金焊料熔融接合之步驟的說明圖。
10．．．基座
11．．．框架
12．．．上部凸緣
13．．．馬達
14．．．導件
15．．．升降塊
16．．．滑件
17．．．螺帽
18．．．進給螺桿
19．．．電源
20．．．音圈馬達
21．．．套管
22．．．固定件
23．．．線圈
24．．．前端
25．．．板簧
26．．．桿件
27．．．陶瓷加熱器
28．．．接合工具
31．．．電子零件
41．．．接合載台
42．．．基板
48．．．載台加熱器
50．．．控制部
51．．．CPU
52．．．記憶體
53．．．接合程式
54．．．基準位置設定程式
55．．．接合工具位置保持程式
56．．．第2基準位置設定程式
57．．．第2接合工具位置保持程式
58．．．控制用資料
59．．．抵接檢測程式
61．．．線性標尺
62．．．線性標尺讀頭
100．．．電子零件構裝裝置

Claims (6)

  1. 一種電子零件構裝裝置，係透過熱熔融之接合金屬將電子零件之電極與基板之電極接合，以將該電子零件構裝於該基板上，其特徵在於，具備：接合工具，被驅動於與該基板接近離開之方向，將該電子零件熱壓接於該基板；驅動部，於該接合工具之與該基板接近離開之方向進行驅動；位置檢測部，檢測該接合工具之與該基板接近離開之方向之位置；以及控制部，藉由該驅動部使該接合工具之與該基板接近離開之方向之位置變化；該控制部具有接合工具位置保持手段，該接合工具位置保持手段，在加熱該電子零件之同時該接合工具自基準位置接近該基板既定距離時，判斷該電子零件之電極與該基板之電極間之該接合金屬已熱熔融，保持此時該接合工具之相對於該基板接近離開之方向之位置。
  2. 如申請專利範圍第1項之電子零件構裝裝置，其中，該電子零件於電極上形成凸塊；該基板於電極形成接合金屬之皮膜；該控制部，進一步具有：抵接檢測手段，根據來自該位置檢測部之訊號判斷該凸塊與該皮膜之抵接；以及基準位置設定手段，藉由該抵接檢測手段判斷該凸塊與該皮膜已抵接時，將該接合工具之相對於該基板之位置設定為該基準位置。
  3. 如申請專利範圍第2項之電子零件構裝裝置，其中，該控制部，進一步具有：第2基準位置設定手段，藉由該基準位置設定手段設定該基準位置後，在該接合工具之與該基板接近離開之方向之距離從增加變化成減少時，將該接合工具之相對於該基板之位置設定為第2基準位置；以及第2接合工具位置保持手段，在加熱該電子零件之同時該接合工具自該第2基準位置接近該基板第2既定距離時，判斷該電子零件之電極與該基板之電極間之該接合金屬已熱熔融，保持此時該接合工具之相對於該基板接近離開之方向之位置。
  4. 一種電子零件構裝方法，係透過熱熔融之接合金屬將電子零件之電極與基板之電極接合，以將該電子零件構裝於該基板上，其特徵在於，具有：準備電子零件構裝裝置之步驟；以及接合工具位置保持步驟，在加熱該電子零件之同時該接合工具自基準位置接近該基板既定距離時，判斷該電子零件之電極與該基板之電極間之該接合金屬已熱熔融，保持此時該接合工具之相對於該基板接近離開之方向之位置；該電子零件構裝裝置，具備：接合工具，被驅動於與該基板接近離開之方向，將該電子零件熱壓接於該基板；驅動部，於該接合工具之與該基板接近離開之方向進行驅動；以及位置檢測部，檢測該接合工具之與該基板接近離開之方向之位置。
  5. 如申請專利範圍第4項之電子零件構裝方法，其中，該電子零件於電極上形成凸塊；該基板於電極形成接合金屬之皮膜；進一步具有：抵接檢測步驟，根據來自該位置檢測部之訊號判斷該凸塊與該皮膜之抵接；以及基準位置設定步驟，藉由該抵接檢測步驟判斷該凸塊與該皮膜已抵接時，將該接合工具之相對於該基板之位置設定為該基準位置。
  6. 如申請專利範圍第5項之電子零件構裝方法，其進一步具有：第2基準位置設定步驟，藉由該基準位置設定步驟設定該基準位置後，在該接合工具之與該基板接近離開之方向之距離從增加變化成減少時，將該接合工具之相對於該基板之位置設定為第2基準位置；以及第2接合工具位置保持步驟，在加熱該電子零件之同時該接合工具自該第2基準位置接近該基板第2既定距離時，判斷該電子零件之電極與該基板之電極間之該接合金屬已熱熔融，保持此時該接合工具之相對於該基板接近離開之方向之位置。
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