JP5847390B2 - 実装装置および実装方法 - Google Patents
実装装置および実装方法 Download PDFInfo
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- JP5847390B2 JP5847390B2 JP2010241606A JP2010241606A JP5847390B2 JP 5847390 B2 JP5847390 B2 JP 5847390B2 JP 2010241606 A JP2010241606 A JP 2010241606A JP 2010241606 A JP2010241606 A JP 2010241606A JP 5847390 B2 JP5847390 B2 JP 5847390B2
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- 238000000034 method Methods 0.000 title claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 104
- 239000000758 substrate Substances 0.000 claims description 73
- 238000003825 pressing Methods 0.000 claims description 27
- 238000002844 melting Methods 0.000 claims description 24
- 230000008018 melting Effects 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 23
- 238000001514 detection method Methods 0.000 claims description 22
- 238000001816 cooling Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 5
- 230000008602 contraction Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 208000013166 Abnormality of the head Diseases 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H01L2224/732—Location after the connecting process
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Description
チップに設けられた半田バンプを、基板に設けられた電極に、押圧しながら加熱し熱圧着する実装装置であって、
チップを保持して基板に押圧する熱圧着ツールと、
基板を保持する基板ステージと、
熱圧着ツールを加熱する加熱手段と、
熱圧着ツールの制御を行う制御部とを備え、
前記熱圧着ツールには熱圧着ツールの高さ位置を検出する高さ検出手段と、熱圧着ツールの押圧力を検出する圧力検出手段と、が備えられ、
前記制御部が、チップを保持した熱圧着ツールを下降し、チップの基板側に設けられている半田バンプが基板に設けられている電極に接触した後、熱圧着ツールを用いてチップを基板の電極に押し込み、圧力検出手段により検出された圧力に基づいて熱圧着ツールの押圧力を制御する荷重制御を行う機能と、
熱圧着ツールの温度が半田溶融温度になるように加熱手段を昇温する機能と、
半田バンプの温度が半田溶融温度に到達する前に、高さ検出手段により検出された熱圧着ツールの高さ位置に基づいて熱圧着ツールの高さ位置を制御する、位置制御に切り換える機能と、
熱圧着ツールの高さ位置を熱圧着ツールの伸びに応じて上昇させる機能を有している実装装置である。
前記加熱手段には、加熱手段の温度を検出する温度検出手段が備えられ、
前記制御部が、チップに設けられている半田バンプが基板に設けられている電極に接触した後、温度検出手段により検出された温度が所定の温度に到達するまで、圧力検出手段により検出された圧力に基づき熱圧着ツールの押圧力を制御する荷重制御を行う機能を有している実装装置である。
チップに設けられた半田バンプを基板に設けられた電極に、押圧しながら加熱し熱圧着する実装方法であって、
チップを熱圧着ツールで保持して基板側に下降させる工程と、
チップの半田バンプが基板の電極に接触した後、熱圧着ツールに設けられた圧力検出手段により検出された押圧力に基づき、熱圧着ツールを押し込む荷重制御を行う工程と、
熱圧着ツールの温度を半田溶融温度に加熱する工程と、
半田バンプの温度が半田溶融温度に到達する前に、熱圧着ツールの押し込み量が所定値を維持するように熱圧着ツールに設けられた高さ検出手段の検出値に基づいて熱圧着ツールの高さ位置を制御する、位置制御に切り換える工程と、
熱圧着ツールの加熱にともなう熱圧着ツールの伸びに応じて、予め設定されている伸び量だけ熱圧着ツールを引き上げる工程と、
熱圧着ツールによるチップの保持を解除し、熱圧着ツールを上昇させ半田バンプを冷却し固化する工程とを含む実装方法である。
2 チップ
3 バンプ
4 ピラー
5 半田
6 基板
7 電極
8 ヘッド
9 ツール
10 ロードセル
11 基板ステージ
13 2視野カメラ
14 サーボモータ
15 ボールねじ
16 ヒータ
17 接着剤
18 熱電対
19 エンコーダー
20 制御部
2b チップ裏面
7a メッキ
T1 予熱温度
T2 半田溶融温度
T3 半田固相温度
Claims (3)
- チップに設けられた半田バンプを、基板に設けられた電極に、押圧しながら加熱し熱圧着する実装装置であって、
チップを保持して基板に押圧する熱圧着ツールと、
基板を保持する基板ステージと、
熱圧着ツールを加熱する加熱手段と、
熱圧着ツールの制御を行う制御部とを備え、
前記熱圧着ツールには熱圧着ツールの高さ位置を検出する高さ検出手段と、熱圧着ツールの押圧力を検出する圧力検出手段と、が備えられ、
前記制御部が、チップを保持した熱圧着ツールを下降し、チップの基板側に設けられている半田バンプが基板に設けられている電極に接触した後、熱圧着ツールを用いてチップを基板の電極に押し込み、圧力検出手段により検出された圧力に基づき熱圧着ツールの押圧力を制御する荷重制御を行う機能と、
熱圧着ツールの温度が半田溶融温度になるように加熱手段を昇温する機能と、
半田バンプの温度が半田溶融温度に到達する前に、高さ検出手段により検出された熱圧着ツールの高さ位置に基づいて熱圧着ツールの高さ位置を制御する、位置制御に切り換える機能と、
熱圧着ツールの高さ位置を熱圧着ツールの伸びに応じて上昇させる機能を有している実装装置。 - 請求項1に記載の発明において、
前記加熱手段には、加熱手段の温度を検出する温度検出手段が備えられ、
前記制御部が、チップに設けられている半田バンプが基板に設けられている電極に接触した後、温度検出手段により検出された温度が所定の温度に到達するまで、圧力検出手段により検出された圧力に基づき熱圧着ツールの押圧力を制御する荷重制御を行う機能を有している実装装置。 - チップに設けられた半田バンプを基板に設けられた電極に、押圧しながら加熱し熱圧着する実装方法であって、
チップを熱圧着ツールで保持して基板側に下降させる工程と、
チップの半田バンプが基板の電極に接触した後、熱圧着ツールに設けられた圧力検出手段により検出された押圧力に基づき、熱圧着ツールを押し込む荷重制御を行う工程と、
熱圧着ツールの温度を半田溶融温度に加熱する工程と、
半田バンプの温度が半田溶融温度に到達する前に、熱圧着ツールの押し込み量が所定値を維持するように熱圧着ツールに設けられた高さ検出手段の検出値に基づいて熱圧着ツールの高さ位置を制御する、位置制御に切り換える工程と、
熱圧着ツールの加熱にともなう熱圧着ツールの伸びに応じて、予め設定されている伸び量だけ熱圧着ツールを引き上げる工程と、
熱圧着ツールによるチップの保持を解除し、熱圧着ツールを上昇させ半田バンプを冷却し固化する工程とを含む実装方法。
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