SG11201706844QA - Substrate holder and method for bonding two substrates - Google Patents
Substrate holder and method for bonding two substratesInfo
- Publication number
- SG11201706844QA SG11201706844QA SG11201706844QA SG11201706844QA SG11201706844QA SG 11201706844Q A SG11201706844Q A SG 11201706844QA SG 11201706844Q A SG11201706844Q A SG 11201706844QA SG 11201706844Q A SG11201706844Q A SG 11201706844QA SG 11201706844Q A SG11201706844Q A SG 11201706844QA
- Authority
- SG
- Singapore
- Prior art keywords
- substrates
- bonding
- substrate holder
- holder
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2015/057859 WO2016162088A1 (en) | 2015-04-10 | 2015-04-10 | Substrate holder and method for bonding two substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201706844QA true SG11201706844QA (en) | 2017-10-30 |
Family
ID=52988040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201706844QA SG11201706844QA (en) | 2015-04-10 | 2015-04-10 | Substrate holder and method for bonding two substrates |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11315813B2 (en) |
| EP (1) | EP3281220A1 (en) |
| JP (1) | JP2018515908A (en) |
| KR (2) | KR102298898B1 (en) |
| CN (1) | CN107533996B (en) |
| SG (1) | SG11201706844QA (en) |
| TW (2) | TWI647786B (en) |
| WO (1) | WO2016162088A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI828760B (en) * | 2018-10-25 | 2024-01-11 | 日商尼康股份有限公司 | Substrate bonding device, parameter calculation device, substrate bonding method and parameter calculation method |
| US20220146216A1 (en) * | 2019-12-12 | 2022-05-12 | Amulaire Thermal Technology, Inc. | Copper-alloy heat-dissipation structure with milled surface |
| CN116457916A (en) * | 2021-02-01 | 2023-07-18 | Ev 集团 E·索尔纳有限责任公司 | Substrate holder and method of manufacturing a substrate holder for bonding |
| JP1700777S (en) * | 2021-03-15 | 2021-11-29 | ||
| DE102021129657A1 (en) | 2021-11-15 | 2023-05-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Process for temperature control of a component and arrangement designed for this purpose |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4876221A (en) * | 1988-05-03 | 1989-10-24 | Matsushita Electric Industrial Co., Ltd. | Bonding method |
| JP3321882B2 (en) | 1993-02-28 | 2002-09-09 | ソニー株式会社 | Substrate bonding method |
| JPH1174164A (en) | 1997-08-27 | 1999-03-16 | Canon Inc | Wafer-processing device, wafer support device, wafer-processing method, and manufacture of wafer |
| JPH11163109A (en) | 1997-12-01 | 1999-06-18 | Kyocera Corp | Wafer holding device |
| US6140616A (en) * | 1998-09-25 | 2000-10-31 | Aehr Test Systems | Wafer level burn-in and test thermal chuck and method |
| JP3449604B2 (en) * | 1999-11-02 | 2003-09-22 | Ｔｄｋ株式会社 | Cooling fins |
| US7161121B1 (en) * | 2001-04-30 | 2007-01-09 | Lam Research Corporation | Electrostatic chuck having radial temperature control capability |
| US20030089457A1 (en) * | 2001-11-13 | 2003-05-15 | Applied Materials, Inc. | Apparatus for controlling a thermal conductivity profile for a pedestal in a semiconductor wafer processing chamber |
| JP3921234B2 (en) * | 2002-02-28 | 2007-05-30 | キヤノンアネルバ株式会社 | Surface treatment apparatus and manufacturing method thereof |
| US7347901B2 (en) | 2002-11-29 | 2008-03-25 | Tokyo Electron Limited | Thermally zoned substrate holder assembly |
| JP4821091B2 (en) * | 2004-04-08 | 2011-11-24 | 株式会社ニコン | Wafer bonding equipment |
| EP1796143B1 (en) | 2004-09-01 | 2011-11-23 | Nikon Corporation | Substrate holder, stage apparatus, and exposure apparatus |
| FR2912839B1 (en) | 2007-02-16 | 2009-05-15 | Soitec Silicon On Insulator | IMPROVING THE QUALITY OF COLD CLEANING INTERFACE BY COLD CLEANING AND HOT COLLAGE |
| JP5167779B2 (en) * | 2007-11-16 | 2013-03-21 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| EP2091071B1 (en) | 2008-02-15 | 2012-12-12 | Soitec | Process for bonding two substrates |
| JP2010114208A (en) * | 2008-11-05 | 2010-05-20 | Nikon Corp | Cooling apparatus and joining system |
| JP4801769B2 (en) * | 2009-11-30 | 2011-10-26 | 三菱重工業株式会社 | Joining method, joining device control device, joining device |
| JP5549343B2 (en) | 2010-03-18 | 2014-07-16 | 株式会社ニコン | Substrate bonding apparatus, substrate holder, substrate bonding method, device manufacturing method, and alignment apparatus |
| US20120196242A1 (en) | 2011-01-27 | 2012-08-02 | Applied Materials, Inc. | Substrate support with heater and rapid temperature change |
| JP2012160628A (en) | 2011-02-02 | 2012-08-23 | Sony Corp | Substrate bonding method and substrate bonding device |
| KR20230106735A (en) | 2011-08-12 | 2023-07-13 | 에베 그룹 에. 탈너 게엠베하 | Apparatus and method for bonding substrates |
| WO2013091714A1 (en) | 2011-12-22 | 2013-06-27 | Ev Group E. Thallner Gmbh | Flexible substrate holder, device and method for detaching a first substrate |
| WO2013133015A1 (en) * | 2012-03-07 | 2013-09-12 | 東レ株式会社 | Method and apparatus for manufacturing semiconductor device |
| JP5626736B2 (en) | 2012-03-15 | 2014-11-19 | 東京エレクトロン株式会社 | Joining apparatus, joining system, joining method, program, and computer storage medium |
| US9105485B2 (en) * | 2013-03-08 | 2015-08-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bonding structures and methods of forming the same |
| JP2014179542A (en) * | 2013-03-15 | 2014-09-25 | F Tech Inc | Heat sink and method for manufacturing the same |
| CN109591424B (en) * | 2013-05-29 | 2020-08-21 | Ev 集团 E·索尔纳有限责任公司 | Apparatus and method for bonding substrates |
| JP2015015269A (en) | 2013-07-03 | 2015-01-22 | 東京エレクトロン株式会社 | Bonding device, bonding system, bonding method, program, and computer storage medium |
| US9646860B2 (en) | 2013-08-09 | 2017-05-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Alignment systems and wafer bonding systems and methods |
| US20150332942A1 (en) | 2014-05-16 | 2015-11-19 | Eng Sheng Peh | Pedestal fluid-based thermal control |
| JP6418253B2 (en) | 2014-12-26 | 2018-11-07 | 富士電機株式会社 | Heating / cooling equipment |
-
2015
- 2015-04-10 WO PCT/EP2015/057859 patent/WO2016162088A1/en active Application Filing
- 2015-04-10 US US15/551,733 patent/US11315813B2/en active Active
- 2015-04-10 SG SG11201706844QA patent/SG11201706844QA/en unknown
- 2015-04-10 KR KR1020207014509A patent/KR102298898B1/en active IP Right Grant
- 2015-04-10 JP JP2017547970A patent/JP2018515908A/en active Pending
- 2015-04-10 KR KR1020177024926A patent/KR20170137050A/en active Application Filing
- 2015-04-10 EP EP15717136.4A patent/EP3281220A1/en active Pending
- 2015-04-10 CN CN201580077827.5A patent/CN107533996B/en active Active
-
2016
- 2016-03-23 TW TW105109074A patent/TWI647786B/en active
- 2016-03-23 TW TW107141955A patent/TWI683393B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102298898B1 (en) | 2021-09-07 |
| WO2016162088A1 (en) | 2016-10-13 |
| TW201923962A (en) | 2019-06-16 |
| KR20200059324A (en) | 2020-05-28 |
| CN107533996B (en) | 2021-02-23 |
| US20180040495A1 (en) | 2018-02-08 |
| TWI647786B (en) | 2019-01-11 |
| US11315813B2 (en) | 2022-04-26 |
| JP2018515908A (en) | 2018-06-14 |
| EP3281220A1 (en) | 2018-02-14 |
| KR20170137050A (en) | 2017-12-12 |
| TW201642386A (en) | 2016-12-01 |
| CN107533996A (en) | 2018-01-02 |
| TWI683393B (en) | 2020-01-21 |
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