TWI451999B - 探測器卡容器 - Google Patents

探測器卡容器 Download PDF

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Publication number
TWI451999B
TWI451999B TW100143151A TW100143151A TWI451999B TW I451999 B TWI451999 B TW I451999B TW 100143151 A TW100143151 A TW 100143151A TW 100143151 A TW100143151 A TW 100143151A TW I451999 B TWI451999 B TW I451999B
Authority
TW
Taiwan
Prior art keywords
container
main casing
main
test card
card container
Prior art date
Application number
TW100143151A
Other languages
English (en)
Chinese (zh)
Other versions
TW201311522A (zh
Inventor
齊藤守弘
Original Assignee
協同股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 協同股份有限公司 filed Critical 協同股份有限公司
Publication of TW201311522A publication Critical patent/TW201311522A/zh
Application granted granted Critical
Publication of TWI451999B publication Critical patent/TWI451999B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1908—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
TW100143151A 2011-09-01 2011-11-24 探測器卡容器 TWI451999B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011005135U JP3171687U (ja) 2011-09-01 2011-09-01 プローブカード収納ケース

Publications (2)

Publication Number Publication Date
TW201311522A TW201311522A (zh) 2013-03-16
TWI451999B true TWI451999B (zh) 2014-09-11

Family

ID=47756748

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100143151A TWI451999B (zh) 2011-09-01 2011-11-24 探測器卡容器

Country Status (4)

Country Link
US (1) US8490796B2 (https=)
JP (1) JP3171687U (https=)
KR (1) KR101438161B1 (https=)
TW (1) TWI451999B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3171687U (ja) 2011-09-01 2011-11-10 株式会社協同 プローブカード収納ケース
JP6054150B2 (ja) * 2012-11-22 2016-12-27 日本電子材料株式会社 プローブカードケース及びプローブカードの搬送方法
JP6185285B2 (ja) * 2013-05-14 2017-08-23 日本電子材料株式会社 係止機構及びその係止機構を備えた車輪付き収納ケース
KR101595940B1 (ko) * 2014-10-23 2016-02-19 주식회사 인아텍 반도체 관련 부품을 테스트하는 다양한 사이즈의 프루브카드를 운반하는 안전 케이스
KR102221110B1 (ko) 2015-03-13 2021-02-26 세메스 주식회사 캐리어 유닛 및 이를 저장하는 시스템
JP2019149435A (ja) * 2018-02-27 2019-09-05 株式会社協同 プローブカード収納ケース
JP6595025B2 (ja) * 2018-02-27 2019-10-23 株式会社協同 プローブカード収納ケース
JP2019197010A (ja) * 2018-05-11 2019-11-14 株式会社協同 プローブカード収納ケース
MX2019015279A (es) * 2018-12-27 2020-07-24 Big Time Products Llc Contenedor de almacenamiento de lados blandos con armazón de exosqueleto.
TWI862256B (zh) * 2023-05-02 2024-11-11 家登精密工業股份有限公司 探針卡之定位環及保護盒
KR102888617B1 (ko) * 2023-07-05 2025-11-20 가부시키가이샤 교도 포토마스크 수납 케이스
KR102655758B1 (ko) * 2023-07-14 2024-04-12 이동욱 프로브 카드 캐리어

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6561328B1 (en) * 2002-03-26 2003-05-13 Ming-Ter Huang Multifunctional container
TWI230133B (en) * 2002-03-19 2005-04-01 Nikko Materials Co Ltd Conveyance box for sputtering target

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2521840A1 (fr) 1982-02-24 1983-08-26 Delsey Soc Valise a roulettes
JPH03171687A (ja) 1989-11-29 1991-07-25 Matsushita Electric Ind Co Ltd レーザダイオード駆動装置
JPH0667366B2 (ja) 1990-07-31 1994-08-31 義夫 渡辺 真空掃除機用ノズル装置
JPH07285604A (ja) 1994-04-21 1995-10-31 Gifu Plast Ind Co Ltd 屋外ゴミ収集用容器
US5695068A (en) * 1994-09-09 1997-12-09 Digital Equipment Corporation Probe card shipping and handling system
JPH11127935A (ja) 1997-10-29 1999-05-18 Fuji Kowa Kogyo Kk 精密機器運搬用ケース
DE19748088A1 (de) 1997-10-30 1999-05-12 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Erkennen einer Fehllage einer Halbleiterscheibe
JP3035519B2 (ja) 1998-01-22 2000-04-24 株式会社山本製作所 穀粒貯蔵庫
JP2004170267A (ja) 2002-11-20 2004-06-17 Tokyo Seimitsu Co Ltd プローブカード搬送台車
KR200383169Y1 (ko) 2005-01-31 2005-05-03 구남호 보조 체인바퀴가 부설된 여행용 가방
JP2009107638A (ja) 2007-10-26 2009-05-21 Daiwa Seiko Inc 保冷箱
US8350191B2 (en) * 2008-05-21 2013-01-08 Formfactor, Inc. Probe card thermal conditioning system
KR20110007660U (ko) * 2010-01-27 2011-08-03 리노공업주식회사 프로브 카드용 캐리어
JP3171687U (ja) 2011-09-01 2011-11-10 株式会社協同 プローブカード収納ケース

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI230133B (en) * 2002-03-19 2005-04-01 Nikko Materials Co Ltd Conveyance box for sputtering target
US6561328B1 (en) * 2002-03-26 2003-05-13 Ming-Ter Huang Multifunctional container

Also Published As

Publication number Publication date
KR20130025316A (ko) 2013-03-11
KR101438161B1 (ko) 2014-09-04
US20130056390A1 (en) 2013-03-07
US8490796B2 (en) 2013-07-23
TW201311522A (zh) 2013-03-16
JP3171687U (ja) 2011-11-10

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