TWI451453B - Electromagnetic steel plate and manufacturing method thereof - Google Patents

Electromagnetic steel plate and manufacturing method thereof Download PDF

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Publication number
TWI451453B
TWI451453B TW100125634A TW100125634A TWI451453B TW I451453 B TWI451453 B TW I451453B TW 100125634 A TW100125634 A TW 100125634A TW 100125634 A TW100125634 A TW 100125634A TW I451453 B TWI451453 B TW I451453B
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Taiwan
Prior art keywords
mass
component
parts
resin
average particle
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TW100125634A
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English (en)
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TW201214473A (en
Inventor
Kazutoshi Takeda
Kenji Kosuge
Tatsuya Takase
Kohji Muneda
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Nippon Steel & Sumitomo Metal Corp
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    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
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    • H01—ELECTRIC ELEMENTS
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    • H01B7/02—Disposition of insulation
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    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
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Description

電磁鋼板及其製造方法 技術領域
本發明係有關於一種適合於電子儀器之鐵芯之材料等的電磁鋼板及其製造方法。
 背景技術
使用電磁鋼板而製造電動機或變壓器時，係將箍狀之電磁鋼板穿孔加工成預定形狀後，將複數電磁鋼板積層、固定而製作積層鐵芯。然後，將銅線纏繞在積層鐵芯之齒部等。其次，依照用途之不同，以耐久性及耐氣候性之提升等為目的，有時會進行樹脂鑄模。
在此，鑄模樹脂與積層鐵芯密接是重要的。此係由於若未與積層鐵芯密接，則無法達成耐久性及耐氣候性之提升等目的之故。又，於使用磁石之電動機中，磁石係使用鑄模樹脂而固定於電動機，然而，當密接性低時，磁石之固定會變得不足。
另一方面，當鑄模樹脂與積層鐵芯之密接性過高時，已清楚明白在電動機等之製造過程中會產生各種問題。舉例言之，於使用在汽車之電動機等中，壓縮應力係自鑄模樹脂作用於積層鐵芯，並有鐵損增加之情形。即，在將線圈等之通電部安裝於積層鐵芯後進行樹脂鑄模時，若鑄模樹脂與積層鐵芯之露出部接著，則來自鑄模樹脂之壓縮應力會作用於積層鐵芯，且鐵損劣化而有電動機之性能降低之情形。又，在使用鑄模樹脂而將磁石固定於電動機時，若鑄模樹脂與積層鐵芯之密接性過高，則會難以除去附著於不必要處之鑄模樹脂。
先行技術文獻 專利文獻
[專利文獻1]日本專利公開公報特公昭50-15013號公報
[專利文獻2]特開平03-36284號公報
[專利文獻3]特公昭49-19078號公報
[專利文獻4]特開平06-330338號公報
[專利文獻5]特開平09-323066號公報
[專利文獻6]特開2002-309379號公報
[專利文獻7]特開2002-164207號公報
本發明之目的係提供一種可提升鑄模樹脂之剝離性之電磁鋼板及其製造方法。
發明人針對使鑄模樹脂之剝離性降低之要因進行檢討之結果，發現設置於電磁鋼板表面之絕緣覆膜與鑄模樹脂之密接性會過度地提高。絕緣覆膜主要係設置用以確保所積層的電磁鋼板彼此之絕緣性。又，除了絕緣性之外，絕緣覆膜有時亦會要求耐蝕性、熔接性、密接性、耐熱性等各種特性。於絕緣覆膜之形成中，一般會塗佈將鉻酸鹽及磷酸鹽等之無機酸鹽及有機樹脂作為主成分之混合物。關於電磁鋼板之絕緣覆膜方面，各種技術是已知的。又，近年來，由於對環境問題之意識提高，因此，進行不使用含有6價鉻之鉻酸水溶液的絕緣覆膜之開發。
然而，於習知絕緣覆膜中，即使是絕緣性等之特性充足者，亦未著眼於鑄模樹脂之剝離性，且如前所述，會有各種伴隨著鑄模樹脂之剝離性低之問題。發明人為了解決此種問題進行銳意檢討之結果，想到下述諸態樣。
(1)一種電磁鋼板，包含有：基底鐵；及絕緣覆膜，係形成於前述基底鐵之表面上者。前述絕緣覆膜係含有第1成分：100質量份；及第2成分：0.5質量份至10質量份。前述第1成分係含有：磷酸金屬鹽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物：1質量份至50質量份。又，前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
(2)一種電磁鋼板，包含有：基底鐵；及絕緣覆膜，係形成於前述基底鐵之表面上者。前述絕緣覆膜係含有第1成分：100質量份；及第2成分：0.5質量份至10質量份。前述第1成分係含有：膠體氧化矽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物：40質量份至400質量份。又，前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
(3)如第(1)或(2)項之電磁鋼板，其中前述第1成分及前述第2成分佔前述絕緣覆膜之90%以上。
(4)一種電磁鋼板之製造方法，包含有以下步驟：於基底鐵之表面塗佈處理液者；及進行前述處理液之焙燒乾燥者。前述處理液係使用含有第1成分：以固形物計為100質量份；及第2成分：以樹脂固形物計為0.5質量份至10質量份者。前述第1成分係含有：磷酸金屬鹽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物之乳劑：以樹脂固形物計為1質量份至50質量份。又，前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
(5)一種電磁鋼板之製造方法，包含有以下步驟：於基底鐵之表面塗佈處理液者；及進行前述處理液之焙燒乾燥者。前述處理液係使用含有第1成分：以固形物計為100質量份；及第2成分：以樹脂固形物計為0.5質量份至10質量份者。前述第1成分係含有：膠體氧化矽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物之乳劑：以樹脂固形物計為40質量份至400質量份。又，前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
(6)如第(4)或(5)項之電磁鋼板之製造方法，其係將前述焙燒乾燥之到達溫度作成150℃至350℃，並將時間作成5秒鐘至60秒鐘。
(7)如第(4)或(5)項之電磁鋼板之製造方法，其中前述第1成分及前述第2成分係以固形物換算計佔前述處理液之90%以上。
若藉由本發明，則由於設置適當之絕緣覆膜，因此，可高度地維持絕緣性等，並取得鑄模樹脂之高剝離性。
圖式簡單說明
第1圖係顯示有關本發明之實施形態的電磁鋼板之製造方法流程圖。
第2圖係顯示有關本發明之實施形態的電磁鋼板之構造截面圖。
 用以實施發明之形態
以下，參照附圖，說明本發明之實施形態。第1圖係顯示有關本發明之實施形態的電磁鋼板之製造方法流程圖，第2圖係顯示有關本發明之實施形態的電磁鋼板之構造截面圖。
於本實施形態中，首先，製作基底鐵1(步驟S1)。於基底鐵1之製作中，舉例言之，首先，以1050℃至1250℃將預定組成之扁胚加熱，並進行熱壓延而製作熱軋板，且將熱軋板捲繞成線圈狀。其次，將熱軋板開卷，並進行冷壓延而製作厚度為0.15mm至0.5mm之冷軋板，且將冷軋板捲繞成線圈狀。然後，以750℃至1100℃退火(完工退火)。依此作成而取得基底鐵1。另，於冷壓延前，亦可依需要於800℃至1050℃之範圍內退火。
基底鐵1之組成係例如適合於無方向性電磁鋼板之組成。即，基底鐵1係例如含有Si：0.1質量%以上；及Al：0.05質量%以上，且剩餘部分係由Fe及不可避免之雜質所構成。另，除了Si及Al外，亦可含有Mn：0.01質量%以上、1.0質量%以下。又，亦可含有Sn：0.01質量%以上、1.0質量%以下。又，S、N及C等之典型元素之含有量宜小於100ppm，更為理想的是小於20ppm。Si含有越多，電阻會越大且磁特性會提升，然而，若Si之含有量大於4.0質量%，則會有脆性變得顯著之情形。故，Si含有量宜為4.0質量%以下。又，Al含有越多，磁特性越會提升，然而，若Al之含有量大於3.0質量%，則會有製作基底鐵1時之冷壓延變得困難之情形。故，Al含有量宜為3.0質量%以下。
另，基底鐵1之組成亦可為適合於方向性電磁鋼板之組成。
又，基底鐵1之表面粗度越低，於積層鐵芯中的電磁鋼板彼此之密接性會越高，因此，基底鐵1之壓延方向及與壓延方向正交之方向(板寬方向)的中心線平均粗度(Ra)宜為1.0μm以下，且更宜為0.5μm以下。若中心線平均粗度(Ra)大於1.0μm，則電磁鋼板彼此之密接性低，且不易取得積層方向之高熱傳導性。另，為了將中心線平均粗度(Ra)作成小於0.1μm，必須嚴密地進行冷壓延之控制，且成本容易提高，因此，中心線平均粗度(Ra)宜為0.1μm以上。
其次，如第2圖所示，於基底鐵1之表面上形成絕緣覆膜2(步驟S2)。於絕緣覆膜2之形成中，將預定之處理液塗佈於基底鐵1之表面上(步驟S2a)，然後，藉由加熱，使處理液乾燥(步驟S2b)。其結果，處理液中的成分係焙燒於基底鐵1之表面上。塗佈處理液之方法並無特殊之限制，舉例言之，亦可使用輥塗機或噴霧器來塗佈處理液，且亦可將基底鐵1浸漬於處理液中。又，使處理液乾燥之方法亦無特殊之限制，舉例言之，亦可使用一般的輻射爐或熱風爐而使處理液乾燥，且亦可藉由感應加熱、高頻加熱等使用電能之加熱，使處理液乾燥。又，關於處理液之乾燥及焙燒(步驟S2b)之條件方面，該處理之溫度(焙燒溫度)宜作成150℃至350℃，特別是在如後述般於處理液中含有磷酸金屬鹽時，焙燒溫度宜作成230℃至300℃。又，該處理之時間在處理液中含有磷酸金屬鹽時，宜作成5秒鐘至60秒鐘，且在含有膠體氧化矽時，宜作成3秒鐘至60秒鐘。
另，於處理液之塗佈前，亦可於基底鐵1之表面施行前處理。舉例言之，前處理可列舉如：使用鹼性藥劑等之脫脂處理；及使用鹽酸、硫酸或磷酸等之酸洗處理等。
在此，說明使用在絕緣覆膜2之形成的處理液。該處理液可大致區別而使用以下2種((a)、(b))。
(a)處理液係含有第1成分：以固形物計為100質量份；及第2成分：以樹脂固形物計為0.5質量份至10質量份。前述第1成分係含有：磷酸金屬鹽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物之乳劑：以樹脂固形物計為1質量份至50質量份。又，前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
(b)處理液係含有第1成分：以固形物計為100質量份；及第2成分：以樹脂固形物計為0.5質量份至10質量份。前述第1成分係含有：膠體氧化矽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物之乳劑：以樹脂固形物計為40質量份至400質量份；又，前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
另，第1成分及第2成分之總量宜以固形物換算計為處理液全體之90%以上。此係用以確保絕緣覆膜之良好之絕緣性、熱傳導性、耐熱性等。
關於第1成分方面，磷酸金屬鹽係使將磷酸及金屬離子作為主成分之水溶液乾燥時構成固形物者。構成磷酸金屬鹽之磷酸種類並無特殊之限制，舉例言之，可使用正磷酸、偏磷酸、多磷酸等。又，構成磷酸金屬鹽之金屬離子之種類亦無特殊之限制，然而，宜為Li、Al、Mg、Ca、Sr、Ti、Ni、Mn及Co等，特別是宜為Al、Ca、Mn及Ni。又，舉例言之，磷酸金屬鹽溶液宜藉由於正磷酸中混合金屬離子之氧化物、碳酸鹽及/或氫氧化物來調製。
磷酸金屬鹽亦可僅使用1種，且亦可混合、使用2種以上。第1成分亦可僅由磷酸金屬鹽所構成，且亦可於第1成分中含有膦酸及/或硼酸等之添加劑。
同樣地，關於第1成分方面，膠體氧化矽宜使用例如平均粒徑為5nm至40nm且Na含有量為0.5質量%以下者。又，膠體氧化矽之Na含有量更宜為0.01質量%至0.3質量%。
於本實施形態中，在第1成分中含有丙烯酸樹脂、環氧樹脂及/或聚酯樹脂之乳劑。丙烯酸樹脂、環氧樹脂及/或聚酯樹脂之乳劑亦可使用市售之樹脂乳劑。丙烯酸樹脂、環氧樹脂及/或聚酯樹脂之熔點並無特殊之限制，然而，宜為50℃以下。若該等之熔點大於50℃，則會變得容易起粉之故。又，若考慮成本，則該等之熔點宜為0℃以上。
丙烯酸樹脂宜為一般單體的甲基丙烯酸酯、乙基丙烯酸酯、正丁基丙烯酸酯、異丁基丙烯酸酯、正辛基丙烯酸酯、異辛基丙烯酸酯、2-乙基己基丙烯酸酯、正壬基丙烯酸酯、正癸基丙烯酸酯及正十二基丙烯酸酯等。又，丙烯酸樹脂亦宜為使具有官能基之單體的丙烯酸、甲基丙烯酸、馬來酸、馬來酸酐、延胡索酸、巴豆酸及伊康酸，以及具有羥基之單體的2-羥乙基(甲基)丙烯酸酯、2-羥丙基(甲基)丙烯酸酯、3-羥丁基(甲基)丙烯酸酯及2-羥乙基(甲基)烯丙醚等共聚合者。
舉例言之，環氧樹脂可列舉如：使羧酸酐於胺改質環氧樹脂中反應者。具體而言，可列舉如：雙酚A-二環氧丙基醚、雙酚A-二環氧丙基醚之己內酯開環加成物、雙酚F-二環氧丙基醚、雙酚S-二環氧丙基醚、酚醛環氧丙基醚、二聚物酸環氧丙基醚等。改質之胺可列舉如：異丙醇胺、單丙醇胺、單丁醇胺、單乙醇胺、二伸乙三胺、伸乙二胺、布他拉胺、丙胺、異佛耳酮二胺、四氫糠胺、茬二胺、己胺、壬胺、三伸乙四胺、四亞甲五胺、二胺二苯碸等。羧酸酐宜為使琥珀酸酐、伊康酸酐、馬來酸酐、檸康酸酐、苯二甲酸酐、苯偏三酸酐等反應者。
舉例言之，聚酯樹脂宜為使二羧酸與二醇反應而得者。二羧酸可列舉如：對苯二甲酸、間苯二甲酸、鄰苯二甲酸、萘二甲酸、聯苯二甲酸、琥珀酸、己二酸、癸二酸、延胡索酸、馬來酸、馬來酸酐、伊康酸及檸康酸等。二醇可列舉如：乙二醇、1,2-丙二醇、1,3-丙二醇、1,4-丁二醇、1,5-戊二醇、新戊二醇、1,6-己二醇、三乙二醇、二丙二醇及聚乙二醇等。又，亦可使用使丙烯酸、甲基丙烯酸、馬來酸、延胡索酸、伊康酸、檸康酸或甲基丙烯酸酐等於該等之聚酯樹脂中接枝聚合而得者。
又，丙烯酸樹脂、環氧樹脂及聚酯樹脂亦可僅使用1種，且亦可混合、使用2種以上。另，該等有機樹脂係使用平均粒徑為0.05μm至0.50μm者。若平均粒徑小於0.05μm，則容易於處理液中聚集，並有絕緣覆膜2之均一性降低之可能性。另一方面，若平均粒徑大於0.50μm，則有處理液之安定性降低之可能性。若處理液之安定性降低，則於處理液中產生聚集物，並有配管及/或泵堵塞，或者聚集物進入絕緣覆膜2中而於絕緣覆膜2產生缺陷之可能性。又，該等有機樹脂之平均粒徑宜為0.1μm以上，且宜為0.3μm以下。另，舉例言之，平均粒徑可使用針對粒徑為1μm以下之粒子的個數平均粒徑。
關於磷酸金屬鹽與丙烯酸樹脂、環氧樹脂及聚酯樹脂之混合比率方面，相對於磷酸金屬鹽100質量份之丙烯酸樹脂、環氧樹脂及聚酯樹脂之總量係1質量份至50質量份。若丙烯酸樹脂、環氧樹脂及聚酯樹脂之總量小於1質量份，則容易產生丙烯酸樹脂、環氧樹脂及聚酯樹脂之聚集，並容易降低絕緣覆膜2之均一性。另一方面。若丙烯酸樹脂、環氧樹脂及聚酯樹脂之總量大於50質量份，則耐熱性會降低。
又，關於膠體氧化矽與丙烯酸樹脂、環氧樹脂及聚酯樹脂之混合比率方面，相對於膠體氧化矽100質量份之丙烯酸樹脂、環氧樹脂及聚酯樹脂之總量係40質量份至400質量份。若丙烯酸樹脂、環氧樹脂及聚酯樹脂之總量小於40質量份，則難以適當地形成絕緣覆膜2，並有絕緣覆膜2起粉之可能性。另一方面。若環氧樹脂及聚酯樹脂之總量大於400質量份，則耐熱性會降低。
關於第2成分方面，舉例言之，氟樹脂可使用：聚四氟乙烯、四氟乙烯全氟烷基乙烯醚共聚物、四氟乙烯六氟丙烯共聚物、四氟乙烯乙烯共聚物、聚三氟氯乙烯、聚偏氟乙烯、四氟乙烯六氟丙烯全氟烷基乙烯醚共聚物、三氟氯乙烯乙烯共聚物及聚氟乙烯等。
另，若使用業經羥基賦予或環氧改質等之氟樹脂，則會有鑄模樹脂之剝離性降低之傾向。故，宜使用除了業經羥基賦予或環氧改質等之氟樹脂以外之氟樹脂。
氟樹脂之分散體或粉體係使用平均粒徑為0.05μm至0.35μm者。若氟樹脂之分散體或粉體之平均粒徑小於0.05μm，則無法取得充分之分散性，且容易於處理液中聚集，並容易降低絕緣覆膜2之均一性。其結果，會有無法取得充分之絕緣性等特性之情形。又，若平均粒徑大於0.35μm，則有處理液之安定性降低之可能性。又，氟樹脂之分散體或粉體之平均粒徑宜為0.15μm以上，且宜為0.25μm以下。
另，氟樹脂之分散體或粉體亦可單獨使用，且亦可混合、使用2種以上。舉例言之，亦可混合、使用複數種平均粒徑相異之分散體或粉體，且亦可混合、使用複數種分子量相異之分散體或粉體。又，亦可混合、使用氟樹脂之分散體與氟樹脂之粉體。
無論第1成分之主成分為磷酸金屬鹽、膠體氧化矽中之任一者，關於第1成分及第2成分之摻合比率方面，相對於第1成分之固形物100質量份計，第2成分量皆作成0.5質量份至10質量份。若第2成分量小於0.5質量份，則有提升鑄模樹脂之剝離性之效果不足之可能性。另一方面，若第2成分量大於10質量份，則有處理液之安定性降低之可能性。如前所述，若處理液之安定性降低，則於處理液中產生聚集物，並有配管及/或泵堵塞，或者聚集物進入絕緣覆膜2中而於絕緣覆膜2產生缺陷之可能性。又，氟樹脂係與其他有機樹脂不同，特別是具有於界面聚集之傾向，因此，若第2成分量大於10質量份，則有與基底鐵1之密接性不足之可能性。
另，於前述處理液中，亦可加入界面活性劑等之添加劑。界面活性劑宜為非離子系界面活性劑，除此之外，亦可添加光澤劑、防腐劑、抗氧化劑等。
又，於前述處理液中，亦可添加其他成分。舉例言之，亦可添加碳酸鹽、氫氧化物、氧化物、鈦酸鹽及鎢酸鹽等之無機化合物，且亦可添加多元醇、賽路蘇、羧酸類、醚類及酯類等之有機低分子化合物。再者，亦可添加無機化合物及有機低分子化合物兩者。
於藉由此種方法所製造的電磁鋼板10中，在使用處理液(a)時，絕緣覆膜2係含有：第1成分：100質量份；及第2成分：0.5質量份至10質量份。前述第1成分係含有：磷酸金屬鹽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物：1質量份至50質量份。又，前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
又，在使用處理液(b)時，絕緣覆膜2係含有：第1成分：以固形物計為100質量份；及第2成分：5質量份至40質量份。前述第1成分係含有：膠體氧化矽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物：40質量份至400質量份。又，前述第2成分係由平均粒徑為2.0μm至15.0μm且熔點為60℃至140℃，並選自於由聚烯烴蠟、環氧樹脂及丙烯酸樹脂所構成群組中之1種以上之粒子所構成。
又，絕緣覆膜2可取得於內部分散有氟樹脂者。當氟樹脂之分散體或粉體之平均粒徑為0.05μm至0.35μm時，由於該等在處理液中的分散性極為良好，因此，於絕緣覆膜2中的氟樹脂之分散性亦極為良好，且遍及絕緣覆膜2之全體，實質之表面張力係適度地降低。其結果，可提升鑄模樹脂之剝離性。即，於具有此種絕緣覆膜2之電磁鋼板10中，可高度地維持絕緣覆膜2相對於基底鐵1之密接性，並將與鑄模樹脂之密接性作成適當者。舉例言之，可確保磁石之固定所必須之密接性等，並實現壓縮應力之緩和，以及剝離多餘之鑄模樹脂時的作業性之提升等。另，當氟樹脂之平均粒徑不恰當時，氟樹脂係不均一地分散於絕緣覆膜2中，並有絕緣覆膜2之特性產生誤差之可能性。
另，當處理液中添加有界面活性劑、無機化合物、有機低分子化合物等時，該等係直接包含於絕緣覆膜2中。
又，絕緣覆膜2之厚度宜作成0.3μm至3.0μm，更宜作成0.5μm以上、1.5μm以下。
另，前述膠體氧化矽之平均粒徑、丙烯酸樹脂、環氧樹脂及聚酯樹脂之平均粒徑以及氟樹脂之平均粒徑係個數平均粒徑。膠體氧化矽之個數平均粒徑係例如使用藉由氮吸附法(JIS Z8830)所測定者。又，丙烯酸樹脂、環氧樹脂及聚酯樹脂之個數平均粒徑以及氟樹脂之個數平均粒徑係例如使用藉由雷射繞射法所測定者。
又，由於對環境之顧慮，因此，處理液宜使用不含Cr者。
又，第1成分及第2成分宜佔絕緣覆膜2之90%以上。此係用以確保良好之絕緣性、熱傳導性、耐熱性等。
實施例
其次，說明發明人所進行的實驗。於該等實驗中的條件等係用以確認本發明之可實施性及效果所採用的例子，本發明並不限於該等例子。
製作具有以下無方向性電磁鋼板用之組成之基底鐵，即：依質量%，含有Si：2.5%；Al：0.5%；及Mn：0.05%者。基底鐵之厚度係作成0.35mm，其中心線平均粗度(Ra)係作成0.46μm。
又，製作各種第1成分用之液體。表1係顯示該液體之成分。
[表1]
於含有磷酸金屬鹽之液體之製作中，混合攪拌正磷酸與Mg(OH)2 、Al(OH)3 等之各金屬氫氧化物、氧化物、碳酸鹽而調製40質量%之水溶液。
於含有膠體氧化矽之液體之製作中，製作含有市售之平均粒徑為15nm且藉由鋁將表面改質之膠體氧化矽30質量%者。
表1中的6種有機樹脂之詳情如下。
「丙烯酸樹脂1」
使甲基丙烯酸甲酯：40質量%；2-羥乙基甲基丙烯酸酯：10質量%；正丁基丙烯酸酯：30質量%；及苯乙烯單體：20質量%共聚合而得之丙烯酸樹脂。
「丙烯酸樹脂2」
使甲基丙烯酸酯：40質量%；苯乙烯單體：30質量%；異丁基丙烯酸酯：20質量%；及延胡索酸：10質量%共聚合而得之丙烯酸樹脂。
「環氧樹脂1」
在藉由三乙醇胺將雙酚A改質後，使琥珀酸酐反應而得之羧基改質環氧樹脂。
「環氧樹脂2」
於酚醛型環氧樹脂中摻合乙烯丙烯嵌段聚合物而加成壬基苯基醚環氧乙烷，並作成自乳化型之環氧樹脂。
「聚酯樹脂」
在使對苯二甲酸二甲酯：35質量%及新戊二醇：35質量%共聚合後，使延胡索酸：15質量%及苯偏三酸酐：15質量%接枝聚合而得之含有羧基之聚酯樹脂。
「水性聚胺基甲酸酯」
藉由已知之方法自六亞甲基二異氰酸酯及聚乙二醇合成之水性聚胺基甲酸酯。
將該等之有機樹脂分別作成30%乳劑溶液，並將該等混合於含有磷酸金屬鹽或膠體氧化矽之液體中。再者，依需要，加入適量黏度調整劑、界面活性劑而調製表1所示之液體。
另，丙烯酸樹脂1、丙烯酸樹脂2之平均粒徑分別為0.25μm、0.64μm、0.6μm。又，環氧樹脂1、環氧樹脂2之平均粒徑分別為0.33μm、0.76μm。又，聚酯樹脂之平均粒徑為0.35μm，水性聚胺基甲酸酯之平均粒徑為0.12μm。於該等之平均粒徑之測定中，在藉由蒸餾水將樹脂乳劑稀釋後，藉由依據JIS法(JIS Z8826)之市售利用雷射繞射法之粒徑測定裝置，測定個數平均粒徑。另，表1中的樹脂質量份係換算成固形物之值。
其次，於表1所示之液體中，添加預定量之表2所示之氟樹脂之分散體或粉體而製作27種處理液。
[表2]
表2中的6種氟樹脂之詳情如下。
「氟樹脂1」
聚四氟乙烯(PTFE)形式，且平均粒徑為0.25μm、濃度為48質量%之氟樹脂之分散體。
「氟樹脂2」
氟化乙烯丙烯(FEP)形式，且平均粒徑為0.34μm、濃度為50質量%之氟樹脂之分散體。
「氟樹脂3」
藉由強制乳化而作成水分散形式，且平均粒徑為0.12μm、濃度為60質量%之氟樹脂之分散體。
「氟樹脂4」
氟橡膠形式，且平均粒徑為2.5μm之氟樹脂之粉體。
「氟樹脂5」
羥基賦予形式，且平均粒徑為0.06μm、濃度為48質量%之氟樹脂之分散體5。
「氟樹脂6」
複合有平均粒徑為0.33μm之PTFE及平均粒徑為0.25μm之偏氟乙烯之氟樹脂之粉體。
另，於有機樹脂之乳劑之平均粒徑之測定中，在藉由蒸餾水稀釋後，藉由依據JIS法(JIS Z8826)之市售利用雷射繞射法之粒徑測定裝置，測定個數平均粒徑。又，於氟樹脂之粉體之平均粒徑之測定中，在藉由超音波洗淨機使其於蒸餾水中分散約1分鐘後，藉由依據JIS法(JIS Z8826)之市售利用雷射繞射法之粒徑測定裝置，測定個數平均粒徑。又，針對表面粗度，使用依據JIS法(JIS B0601)之市售表面粗度測定裝置，測定中心線平均粗度(Ra)。
又，將處理液塗佈於基底鐵，並藉由表2所示之條件來焙燒。處理液係使用輥塗機來塗佈。此時，調整軋輥壓下量等，以使絕緣覆膜之厚度構成約0.8μm。焙燒(乾燥)係使用輻射爐來進行，並調整爐溫之設定，以取得表2中所揭示之預定加熱條件。調整為到達板溫構成160℃至400℃，且焙燒時間構成5秒鐘至55秒鐘。
又，針對焙燒結束後所取得之電磁鋼板，評價各種特性。即，進行鑄模樹脂之剝離性、絕緣性、密接性、耐蝕性、外觀及耐熱性之評價。
於鑄模樹脂之剝離性之評價中，將業已夾入0.05g之鑄模樹脂粉末的2片電磁鋼板之試樣加熱至150℃，並以10kgf/cm2 之加壓力保持1分鐘，且進行空冷，並測定剪切拉伸強度。剪切拉伸強度之測定係依據JIS法(JIS K6850)來進行，並將剪切拉伸強度作成鑄模樹脂接著力。另，1kgf/cm2 約為9.8N/cm2 。若剪切拉伸強度為10kgf/cm2 以下，則鑄模樹脂之剝離性可謂良好。另一方面，當剪切拉伸強度大於10kgf/cm2 時，會有磁性因鑄模樹脂而劣化之可能性，又，若使用在磁石之固定，則會有在除去附著物時等之作業性差之可能性。
於絕緣性之評價中，依據JIS法(JIS C2550)來測定層間電阻。又，將層間電阻小於5Ω‧cm2 /片者作成×，將5Ω‧cm2 /片至10Ω‧cm2 /片者作成△，將10Ω‧cm2 /片至50Ω‧cm2 /片者作成○，將50Ω‧cm2 /片以上者作成◎。
於密接性之評價中，在將黏著膠帶黏貼於電磁鋼板之試樣後，將其纏繞在10mm、20mm、30mm之直徑之金屬棒。其次，撕下黏著膠帶，並自剝落之痕跡評價密接性。將即使纏繞在直徑為10mm之金屬棒亦無剝落者作成10mmΦOK，且將即使纏繞在直徑為20mm之金屬棒亦無剝落者作成20mmΦOK。又，將即使纏繞在直徑為30mm之金屬棒亦無剝落者作成30mmΦOK，且將纏繞在直徑為30mm之金屬棒時有剝落者作成30mmΦOUT。
耐蝕性係依據JIS法之鹽水噴霧試驗(JIS Z2371)來進行，並使用經過7小時後之試樣而以10分評價來進行。評價基準如下。
10：無生鏽
9：極少量生鏽(面積率0.1%以下)
8：業已生鏽之面積率=大於0.1%、0.25%以下
7：業已生鏽之面積率=大於0.25%、0.50%以下
6：業已生鏽之面積率=大於0.50%、1%以下
5：業已生鏽之面積率=大於1%、2.5%以下
4：業已生鏽之面積率=大於2.5%、5%以下
3：業已生鏽之面積率=大於5%、10%以下
2：業已生鏽之面積率=大於10%、25%以下
1：業已生鏽之面積率=大於25%、50%以下
於外觀之評價中，將具有光澤且平滑而均一者作成5，以下，將具有光澤但均一性略差者作成4，將稍有光澤且平滑但均一性差者作成3，將光澤少而平滑性稍差且均一性差者作成2，將光澤、均一性、平滑性差者作成1。
耐熱性係於電磁鋼板之表面以100gf(約0.98N)之負載摩擦2mm×30mm之紗布，並根據絕緣覆膜之剝離狀況來評價。將未剝離者作成5，將稍微剝離者作成4，將明顯剝離者作成3，將剝離狀況嚴重者作成2，將即使未以紗布摩擦亦剝離者作成1。
表3係顯示該等之評價結果。
[表3]
如表3所示，藉由該實驗，可明白本發明之效果。即，如表3所示，於符合本發明之實施例之試樣中，鑄模樹脂之接著力係構成10kgf/cm2 以下，可謂是具有優異之鑄模樹脂之剝離性。又，亦可明白除了鑄模樹脂之剝離性外，符合本發明之實施例之試樣係絕緣性、密接性、耐蝕性、外觀及耐熱性優異。又，於符合比較例之試樣中，大多是鑄模樹脂之接著力構成大於10kgf/cm2 之較大值者，又，並不存在有絕緣性、密接性、耐蝕性、外觀及耐熱性皆優異者。
如以上所說明，於有關本發明之實施形態的電磁鋼板中，舉例言之，積層鐵芯於鑄模等中，鑄模樹脂之剝離性亦良好，並可提升積層鐵芯之鐵損特性，且電磁鋼板之絕緣覆膜特性良好。
以上，詳細地說明本發明之較佳實施形態，然而，本發明並不限於前述例子。應明白若為本發明所屬技術領域中具有通常知識者，則可於申請專利範圍所揭示之技術思想之範疇內想到各種變更例或修正例，並了解該等當然亦屬於本發明之技術範圍。
產業之可利用性
本發明可利用在例如電磁鋼板製造產業及電磁鋼板利用產業。
1．．．基底鐵
10．．．電磁鋼板
2．．．絕緣覆膜
S1，S2，S2a，S2b．．．步驟
第1圖係顯示有關本發明之實施形態的電磁鋼板之製造方法流程圖。
第2圖係顯示有關本發明之實施形態的電磁鋼板之構造截面圖。
1．．．基底鐵
10．．．電磁鋼板
2．．．絕緣覆膜

Claims (10)

  1. 一種使用在樹脂鑄模之積層鐵芯的電磁鋼板，包含有：基底鐵；及絕緣覆膜，係形成於前述基底鐵之表面上者；前述絕緣覆膜係含有第1成分：100質量份；及第2成分：0.5質量份至10質量份；且不含有Cr，前述第1成分係含有：磷酸金屬鹽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物：1質量份至50質量份；又，前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
  2. 一種使用在樹脂鑄模之積層鐵芯的電磁鋼板，包含有：基底鐵；及絕緣覆膜，係形成於前述基底鐵之表面上者；前述絕緣覆膜係含有第1成分：100質量份；及第2成分：0.5質量份至10質量份；且不含有Cr，前述第1成分係含有：膠體氧化矽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物：40質量份至400質量 份；前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
  3. 如申請專利範圍第1項之使用在樹脂鑄模之積層鐵芯的電磁鋼板，其中前述第1成分及前述第2成分佔前述絕緣覆膜之90%以上。
  4. 如申請專利範圍第2項之使用在樹脂鑄模之積層鐵芯的電磁鋼板，其中前述第1成分及前述第2成分佔前述絕緣覆膜之90%以上。
  5. 一種使用在樹脂鑄模之積層鐵芯的電磁鋼板之製造方法，包含有以下步驟：於基底鐵之表面塗佈處理液者；及進行前述處理液之焙燒乾燥者；前述處理液係使用含有第1成分：以固形物計為100質量份；及第2成分：以樹脂固形物計為0.5質量份至10質量份；且不含有Cr者，前述第1成分係含有：磷酸金屬鹽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物之乳劑：以樹脂固形物計為1質量份至50質量份；前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
  6. 一種使用在樹脂鑄模之積層鐵芯的電磁鋼板之製造方法，包含有以下步驟：於基底鐵之表面塗佈處理液者；及進行前述處理液之焙燒乾燥者；前述處理液係使用含有第1成分：以固形物計為100質量份；及第2成分：以樹脂固形物計為0.5質量份至10質量份；且不含有Cr者，前述第1成分係含有：膠體氧化矽：100質量份；及選自於由平均粒徑為0.05μm至0.50μm之丙烯酸樹脂、環氧樹脂及聚酯樹脂所構成群組中之1種或2種以上之混合物或共聚物之乳劑：以樹脂固形物計為40質量份至400質量份；前述第2成分係由平均粒徑為0.05μm至0.35μm之氟樹脂之分散體或粉體所構成。
  7. 如申請專利範圍第5項之使用在樹脂鑄模之積層鐵芯的電磁鋼板之製造方法，其係將前述焙燒乾燥之到達溫度作成150℃至350℃，並將時間作成5秒鐘至60秒鐘。
  8. 如申請專利範圍第6項之使用在樹脂鑄模之積層鐵芯的電磁鋼板之製造方法，其係將前述焙燒乾燥之到達溫度作成150℃至350℃，並將時間作成3秒鐘至60秒鐘。
  9. 如申請專利範圍第5項之使用在樹脂鑄模之積層鐵芯的電磁鋼板之製造方法，其中前述第1成分及前述第2成分係以固形物換算計佔前述處理液之90%以上。
  10. 如申請專利範圍第6項之使用在樹脂鑄模之積層鐵芯的電磁鋼板之製造方法，其中前述第1成分及前述第2成分係以固形物換算計佔前述處理液之90%以上。
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