JP5129573B2 - 粘着性コーティング組成物 - Google Patents
粘着性コーティング組成物 Download PDFInfo
- Publication number
- JP5129573B2 JP5129573B2 JP2007539025A JP2007539025A JP5129573B2 JP 5129573 B2 JP5129573 B2 JP 5129573B2 JP 2007539025 A JP2007539025 A JP 2007539025A JP 2007539025 A JP2007539025 A JP 2007539025A JP 5129573 B2 JP5129573 B2 JP 5129573B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- coating
- bisphenol
- steel sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000008199 coating composition Substances 0.000 title claims abstract description 29
- 239000000853 adhesive Substances 0.000 title description 16
- 230000001070 adhesive effect Effects 0.000 title description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 28
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 28
- 239000007787 solid Substances 0.000 claims abstract description 27
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000002105 nanoparticle Substances 0.000 claims abstract description 14
- 239000002841 Lewis acid Substances 0.000 claims abstract description 12
- 150000007517 lewis acids Chemical class 0.000 claims abstract description 12
- 239000005011 phenolic resin Substances 0.000 claims abstract description 12
- 150000008064 anhydrides Chemical class 0.000 claims abstract description 10
- 239000012948 isocyanate Substances 0.000 claims abstract description 10
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 10
- 239000003960 organic solvent Substances 0.000 claims abstract description 10
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 6
- 239000000654 additive Substances 0.000 claims abstract description 5
- 229910000976 Electrical steel Inorganic materials 0.000 claims abstract description 4
- 230000000996 additive effect Effects 0.000 claims abstract description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 57
- 239000010959 steel Substances 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 56
- 239000002245 particle Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 10
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 31
- 239000011248 coating agent Substances 0.000 abstract description 29
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000005260 corrosion Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000010292 electrical insulation Methods 0.000 abstract description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 18
- 239000004593 Epoxy Substances 0.000 description 16
- -1 carbon acid anhydride Chemical class 0.000 description 15
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- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
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- 125000000524 functional group Chemical group 0.000 description 6
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- 229910052782 aluminium Inorganic materials 0.000 description 5
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- 229940106691 bisphenol a Drugs 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 210000003298 dental enamel Anatomy 0.000 description 5
- 229910002012 Aerosil® Inorganic materials 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 229910052768 actinide Inorganic materials 0.000 description 4
- 150000001255 actinides Chemical class 0.000 description 4
- 150000001491 aromatic compounds Chemical class 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 150000002170 ethers Chemical class 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052747 lanthanoid Inorganic materials 0.000 description 4
- 150000002602 lanthanoids Chemical class 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
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- 239000010703 silicon Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 150000007824 aliphatic compounds Chemical class 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000013522 chelant Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
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- 238000004132 cross linking Methods 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 3
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- 239000000047 product Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
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- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- IXBCQHIGYJKJFL-UHFFFAOYSA-N C=C.C=C.C=C.OCC(O)=O Chemical compound C=C.C=C.C=C.OCC(O)=O IXBCQHIGYJKJFL-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 229960000583 acetic acid Drugs 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 2
- 238000010382 chemical cross-linking Methods 0.000 description 2
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- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 2
- LDNHFZMAFBIHTC-UHFFFAOYSA-N ethene;2-hydroxyacetic acid Chemical compound C=C.C=C.OCC(O)=O LDNHFZMAFBIHTC-UHFFFAOYSA-N 0.000 description 2
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
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- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
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- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000000887 hydrating effect Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000013461 intermediate chemical Substances 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- HRRDCWDFRIJIQZ-UHFFFAOYSA-N naphthalene-1,8-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=CC2=C1 HRRDCWDFRIJIQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
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- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
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- 239000004094 surface-active agent Substances 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Description
A)ビスフェノール−A−型および/またはビスフェノール−F−型をベースとする少なくとも1種のエポキシ樹脂100重量部(固形分100%)と、
B)2〜600nmの範囲の平均半径を有するナノ粒子0.1〜200重量部と、
C)ジシアンジアミドおよび/または少なくとも1種のブロックトイソシアネートまたは少なくとも1種のフェノール樹脂、カルボン酸および/または無水物および/またはルイス酸0〜25重量部(固形分100%)と、
D)少なくとも1種の添加剤0.1〜10重量部と、
E)水または少なくとも1種の有機溶剤50〜200重量部と
を含む。
水性組成物をベースとする本発明によるコーティングの製造
結合剤として、固形分含有量51〜55%のビスフェノール−A−型エポキシ樹脂、および7%の1−メトキシ−2−プロパノールおよび3%未満のベンジルアルコールならびに水から構成される水性分散体が用いられる。微粉化ジシアンジアミドが、表1に示される量(100%固体エポキシ樹脂の100部で算出される)で用いられる。従って、2重量部の流動化剤BYK(登録商標)−341および12重量部のジエチレングリコールモノブチルエーテルの添加が処理される。混合物は均一になるまで攪拌される。最後の工程において、ナノ粒子としてのAerosil(登録商標)R7200が表1に示される量で添加される。
溶剤型組成物をベースとする本発明によるコーティングの製造
結合剤として、ビスフェノールAをベースとする固体、高分子量エポキシ樹脂の溶剤溶液が用いられる。40〜50%の固形分含有量は、1−メトキシプロピルアセテート−2の適用で達成される。架橋剤として、160〜170g/equのエポキシ換算重量および2.0のエポキシ官能価を備える、レゾール−型のフェノール樹脂および変性フェノールノボラックが、表2に示されるように用いられる(各々が100%固体エポキシ樹脂の100部で算出される)。従って、1重量部の流動化剤BYK(登録商標)−310の添加が処理される。最後の工程において、ナノ粒子としてのAerosil(登録商標)R7200が処方に表2に示される量で添加される。混合物は均一になるまで攪拌される。
従来技術と比較した電磁鋼鋼板のコーティング
特開平11−193475号公報による組成物No.7は、100重量部(固形分)の水分散性ビスフェノール−A−型エポキシ樹脂と、15重量部(固形分)の、1molビスフェノールAおよび7molホルムアルデヒドの反応生成物をベースとするフェノール樹脂(ジメチロレート化成分より高いメチロレート化成分の含有量が98.3重量%である)とを含み、水と共に混合されおよび攪拌されて、20重量%の組成物の固形分含有量を有するコーティング組成物が得られる。
次に、本発明の好ましい態様を示す。
1. A)ビスフェノール−A−型、ビスフェノール−F−型またはこれらの混合物をベースとする少なくとも1種のエポキシ樹脂100重量部(固形分100%)と、
B)2〜600nmの範囲の平均半径を有するナノ粒子0.1〜200重量部と、
C)ジシアンジアミド、ブロックイソシアネートおよびルイス酸からなる群から選択されるか、またはフェノール樹脂、カルボン酸、無水物およびルイス酸からなる群から選択される、少なくとも1種の硬化剤0〜25重量部(固形分100%)と、
D)少なくとも1種の添加剤0.1〜10重量部と、
E)水または少なくとも1種の有機溶剤50〜200重量部と
を含む電磁鋼板コア製造用粘着性コーティング組成物。
2. 水性組成物に関して、成分A)〜E)に追加して、成分F)として、少なくとも1種の流動化剤が0.1〜120重量部(固形分100%)の量で用いられる、上記1に記載の粘着性コーティング組成物。
3. 溶剤型組成物に関して、成分A)〜E)に追加して、成分G)として、少なくとも1種の変性フェノールノボラック樹脂が1〜20重量部(固形分100%)の量で用いられる、上記1に記載の粘着性コーティング組成物。
4. ナノ粒子が2〜100nmの範囲の平均半径を有する、上記1に記載の粘着性コーティング組成物。
5. ナノ粒子がエレメント−酸素ネットワークをベースとする反応性粒子であり、エレメントが、シリコン、アルミニウム、亜鉛、錫、ホウ素、ゲルマニウム、ガリウム、鉛、遷移金属、ランタニドおよびアクチニドからなる群から選択され、表面反応性官能基R1および非反応性または部分反応性官能基R2およびR3が酸素ネットワークによって結合され、ここで、反応性粒子の表面上において、R1は98重量%以下の量であり、R2およびR3は0〜97重量%の量であり、ここでR1は、R4含有金属酸エステル;NCO;ウレタン基、エポキシ、炭素酸無水物;C=C−二重結合系;OH;酸素が結合された、アルコール、エステル、エーテル;キレートビルダー;COOH;NH2;NHR4および反応性バインダからなる群から選択されるラジカルを含み、
R2は、芳香族化合物、脂肪族化合物、脂肪酸誘導体;エステルおよびエーテルからなる群から選択されるラジカルを含み、
R3は樹脂ラジカルを含み、
R4は、アクリレート、フェノール、メラミン、ポリウレタン、ポリエステル、ポリエステルイミド、ポリスルフィド、エポキシ、ポリアミド、ポリビニルホルマール樹脂、芳香族化合物、脂肪族化合物、エステル、エーテル、アルコラート、脂肪およびキレートビルダーからなる群から選択されるラジカルを含む、上記1に記載の粘着性コーティング組成物。
6. ナノ粒子がエレメント−酸素ネットワークをベースとする非反応性粒子であり、エレメントが、シリコン、アルミニウム、亜鉛、錫、ホウ素、ゲルマニウム、ガリウム、鉛、遷移金属、ランタニドおよびアクチニドからなる群から選択される、上記1に記載の粘着性コーティング組成物。
7. ナノ粒子として、シリカ、酸化アルミニウムおよび/または酸化チタンが、コロイド状溶液または分散体において用いられる、上記6に記載の粘着性コーティング組成物。
8. ジシアンジアミド、ブロックトイソシアネートおよびルイス酸からなる群から選択される少なくとも1種の硬化剤(固形分100%)が用いられる、上記2に記載の粘着性コーティング組成物。
9. フェノール樹脂、カルボン酸、無水物およびルイス酸からなる群から選択される少なくとも1種の硬化剤(固形分100%)が用いられる、上記3に記載の粘着性コーティング組成物。
10. オルト−チタン酸エステル、オルト−ジルコニウム酸エステル、シラン、ケイ酸エチルおよびチタネートからなる群から選択される1種以上の有機金属化合物が追加で用いられる、上記1に記載の粘着性コーティング組成物。
11.a)上記1に記載の組成物の少なくとも1つのコーティング層を電磁鋼板の表面に塗布する工程と、
b)塗布した層を高温下で乾燥する工程と、
c)コートされた鋼板を組み立てて鋼板コアを形成し且つ鋼板を熱硬化により相互に結合する工程と
を含む、電磁鋼板コアの製造方法。
12.a)上記2に記載の組成物の少なくとも1つのコーティング層を電磁鋼板の表面に塗布する工程と、
b)塗布した層を高温下で乾燥する工程と、
c)コートされた鋼板を組み立てて鋼板コアを形成し且つ鋼板を熱硬化により相互に結合する工程と
を含む、電磁鋼板コアの製造方法。
13.a)上記3に記載の組成物の少なくとも1つのコーティング層を電磁鋼板の表面に塗布する工程と、
b)塗布した層を高温下で乾燥する工程と、
c)コートされた鋼板を組み立てて鋼板コアを形成し且つ鋼板を熱硬化により相互に結合する工程と
を含む、電磁鋼板コアの製造方法。
14. 組成物が、エポキシ樹脂を水と混合することによってエポキシ分散体を製造し、または少なくとも1種の有機溶剤を有するエポキシ混合物を製造し、次いで、カレント剤(current agent)ならびに組成物のさらなる成分を追加することによって製造される、上記11に記載の方法。
15. 組成物が、3〜8μmの乾燥層厚さを有する単層コーティングとして鋼板上に塗布される、上記11に記載の方法。
16. 上記11に記載の方法により製造される、電気機器において用いられる電磁鋼板コア。
Claims (3)
- A)ビスフェノール−A−型、ビスフェノール−F−型またはこれらの混合物をベースとする少なくとも1種のエポキシ樹脂100重量部(固形分100%)と、
B)2〜600nmの範囲の平均半径を有するナノ粒子であって、シリコン−酸素ネットワークをベースとする反応性粒子0.1〜200重量部と、
C)ジシアンジアミド、ブロックイソシアネートおよびルイス酸からなる群から選択されるか、またはフェノール樹脂、カルボン酸、無水物およびルイス酸からなる群から選択される、少なくとも1種の硬化剤0〜25重量部(固形分100%)と、
D)少なくとも1種の添加剤0.1〜10重量部と、
E)水または少なくとも1種の有機溶剤50〜200重量部と
を含む電磁鋼板コア製造用粘着性コーティング組成物。 - a)請求項1に記載の組成物の少なくとも1つのコーティング層を電磁鋼板の表面に塗布する工程と、
b)塗布した層を高温下で乾燥する工程と、
c)コートされた鋼板を組み立てて鋼板コアを形成し且つ鋼板を熱硬化により相互に結合する工程と
を含む、電磁鋼板コアの製造方法。 - 請求項2に記載の方法により製造される、電気機器において用いられる電磁鋼板コア。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62237304P | 2004-10-27 | 2004-10-27 | |
| US60/622,373 | 2004-10-27 | ||
| PCT/US2005/038210 WO2006049935A1 (en) | 2004-10-27 | 2005-10-25 | Self-bonding coating composition |
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|---|---|
| JP2008518087A JP2008518087A (ja) | 2008-05-29 |
| JP2008518087A5 JP2008518087A5 (ja) | 2012-03-29 |
| JP5129573B2 true JP5129573B2 (ja) | 2013-01-30 |
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| EP (1) | EP1805260B1 (ja) |
| JP (1) | JP5129573B2 (ja) |
| KR (1) | KR101128156B1 (ja) |
| CN (1) | CN101048461A (ja) |
| AT (1) | ATE445671T1 (ja) |
| CA (1) | CA2578530C (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11186076B2 (en) | 2016-12-22 | 2021-11-30 | Jfe Steel Corporation | Method of manufacturing electrical steel sheet with adhesive insulating coating and method of manufacturing stacked electrical steel sheet |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| KR102223865B1 (ko) | 2018-09-27 | 2021-03-04 | 주식회사 포스코 | 전기강판 적층체 |
| KR102156189B1 (ko) | 2018-11-30 | 2020-09-16 | 주식회사 포스코 | 전기강판 및 그 제조 방법 |
| TWI788883B (zh) | 2020-06-17 | 2023-01-01 | 日商日本製鐵股份有限公司 | 電磁鋼板用塗覆組成物、接著用表面被覆電磁鋼板及積層鐵心 |
| JP7415198B2 (ja) | 2020-06-17 | 2024-01-17 | 日本製鉄株式会社 | 電磁鋼板用コーティング組成物、接着用表面被覆電磁鋼板及び積層鉄心 |
| KR102560656B1 (ko) * | 2020-12-21 | 2023-07-26 | 주식회사 포스코 | 전기강판 접착 코팅 조성물, 전기강판 적층체 및 이의 제조 방법 |
| EP4029895A1 (de) | 2021-01-15 | 2022-07-20 | Rembrandtin Coatings GmbH | Zusammensetzung |
| CA3211090A1 (en) | 2021-04-27 | 2022-11-03 | Armin Temel | Aqueous coating composition for corrosion protection |
| CN116144240B (zh) * | 2021-11-22 | 2024-04-05 | 宝山钢铁股份有限公司 | 一种轻粘性硅钢环保绝缘涂料、硅钢板及其制造方法 |
| CN116837642B (zh) * | 2023-06-20 | 2025-08-01 | 佛山市石金科技有限公司 | 硬毡涂料及其制备方法以及碳纤维硬毡及其制备方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59108072A (ja) * | 1982-12-11 | 1984-06-22 | Nitto Electric Ind Co Ltd | 常温粘着性を有する熱硬化性接着シ−ト |
| JPS6268868A (ja) * | 1985-09-20 | 1987-03-28 | Nitto Electric Ind Co Ltd | 水分散型ゴム系粘着剤 |
| JPS62148585A (ja) * | 1985-12-24 | 1987-07-02 | Kawasaki Steel Corp | 耐塩水性に優れた接着剤 |
| JPH03215582A (ja) * | 1990-01-20 | 1991-09-20 | Aisin Chem Co Ltd | スポット溶接可能な接着剤組成物 |
| JPH0669257A (ja) * | 1992-08-21 | 1994-03-11 | Hitachi Chem Co Ltd | 半導体素子用接着剤および半導体装置 |
| JPH07126585A (ja) * | 1993-10-28 | 1995-05-16 | Shin Etsu Chem Co Ltd | カバーレイフィルム |
| US5554670A (en) * | 1994-09-12 | 1996-09-10 | Cornell Research Foundation, Inc. | Method of preparing layered silicate-epoxy nanocomposites |
| CA2224667C (en) * | 1997-12-12 | 2007-07-03 | Kawasaki Steel Corporation | Solvent-resistant electrical steel sheet capable of stress relief annealing and process |
| JP3312589B2 (ja) * | 1997-12-26 | 2002-08-12 | 日本鋼管株式会社 | 接着強度、耐食性及び耐ブロッキング性に優れた接着鉄芯用電磁鋼板の製造方法 |
| JP2000345360A (ja) * | 1999-06-04 | 2000-12-12 | Kawasaki Steel Corp | 歪み取り焼鈍後の特性に優れたクロムフリー絶縁被膜付き電磁鋼板 |
| JP2001139774A (ja) * | 1999-11-11 | 2001-05-22 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JP2003189519A (ja) * | 2001-12-14 | 2003-07-04 | Toshiba Corp | 電動機の回転子 |
| JP2003347323A (ja) * | 2002-05-27 | 2003-12-05 | Hitachi Chem Co Ltd | 接着部材及び半導体装置 |
| JP2004043602A (ja) * | 2002-07-10 | 2004-02-12 | Bridgestone Corp | 異方性導電フィルム |
| DE10241510A1 (de) * | 2002-09-07 | 2004-03-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Nanokomposite, Verfahren zu ihrer Herstellung und ihre Verwendung |
| EP1457509B1 (de) * | 2003-03-11 | 2006-06-28 | hanse chemie AG | Polymere Epoxidharz-Zusammensetzung |
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- 2005-10-25 CN CNA2005800370046A patent/CN101048461A/zh active Pending
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11186076B2 (en) | 2016-12-22 | 2021-11-30 | Jfe Steel Corporation | Method of manufacturing electrical steel sheet with adhesive insulating coating and method of manufacturing stacked electrical steel sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101048461A (zh) | 2007-10-03 |
| CA2578530A1 (en) | 2006-05-11 |
| CA2578530C (en) | 2014-04-22 |
| DE602005017174D1 (de) | 2009-11-26 |
| KR101128156B1 (ko) | 2012-03-28 |
| WO2006049935A1 (en) | 2006-05-11 |
| ATE445671T1 (de) | 2009-10-15 |
| EP1805260A1 (en) | 2007-07-11 |
| KR20070085443A (ko) | 2007-08-27 |
| EP1805260B1 (en) | 2009-10-14 |
| JP2008518087A (ja) | 2008-05-29 |
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