TWI449485B - 印刷電路板及其製造方法 - Google Patents

印刷電路板及其製造方法 Download PDF

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Publication number
TWI449485B
TWI449485B TW100148570A TW100148570A TWI449485B TW I449485 B TWI449485 B TW I449485B TW 100148570 A TW100148570 A TW 100148570A TW 100148570 A TW100148570 A TW 100148570A TW I449485 B TWI449485 B TW I449485B
Authority
TW
Taiwan
Prior art keywords
bump
printed circuit
circuit board
width
solder resist
Prior art date
Application number
TW100148570A
Other languages
English (en)
Chinese (zh)
Other versions
TW201236530A (en
Inventor
Sung Wuk Ryu
Seong Bo Shim
Seung Yul Shin
Original Assignee
Lg Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100134543A external-priority patent/KR101189337B1/ko
Priority claimed from KR1020110052487A external-priority patent/KR101231263B1/ko
Application filed by Lg Innotek Co Ltd filed Critical Lg Innotek Co Ltd
Publication of TW201236530A publication Critical patent/TW201236530A/zh
Application granted granted Critical
Publication of TWI449485B publication Critical patent/TWI449485B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW100148570A 2010-12-24 2011-12-26 印刷電路板及其製造方法 TWI449485B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100134543A KR101189337B1 (ko) 2010-12-24 2010-12-24 인쇄회로기판 및 그의 제조 방법
KR1020110052487A KR101231263B1 (ko) 2011-05-31 2011-05-31 인쇄회로기판 및 그의 제조 방법

Publications (2)

Publication Number Publication Date
TW201236530A TW201236530A (en) 2012-09-01
TWI449485B true TWI449485B (zh) 2014-08-11

Family

ID=46314671

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100148570A TWI449485B (zh) 2010-12-24 2011-12-26 印刷電路板及其製造方法

Country Status (6)

Country Link
US (1) US9363883B2 (enExample)
EP (1) EP2645828B1 (enExample)
JP (1) JP6092117B2 (enExample)
CN (1) CN103416108B (enExample)
TW (1) TWI449485B (enExample)
WO (1) WO2012087073A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
KR102152865B1 (ko) * 2014-02-06 2020-09-07 엘지이노텍 주식회사 인쇄회로기판, 이를 포함하는 패키지 기판 및 이의 제조 방법
JP2016076534A (ja) * 2014-10-03 2016-05-12 イビデン株式会社 金属ポスト付きプリント配線板およびその製造方法
CN107509319A (zh) * 2016-06-14 2017-12-22 华为终端（东莞）有限公司 一种底部有焊端的模块
US10057989B1 (en) * 2017-04-10 2018-08-21 Tactotek Oy Multilayer structure and related method of manufacture for electronics
TWI711133B (zh) * 2019-07-26 2020-11-21 大陸商上海兆芯集成電路有限公司 電子結構及其製造方法
WO2021019675A1 (ja) * 2019-07-30 2021-02-04 株式会社Ｆｕｊｉ ３次元積層造形による電子回路製造方法
JP2022167591A (ja) * 2021-04-23 2022-11-04 イビデン株式会社 配線基板の製造方法
CN114571021B (zh) * 2021-10-12 2024-06-21 祥博传热科技股份有限公司 一种高导热覆铜陶瓷基板制作方法
WO2026154605A1 (ja) * 2025-01-16 2026-07-23 株式会社レゾナック 導電ピラー付基板の製造方法及びはんだバンプ付基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200803660A (en) * 2006-06-14 2008-01-01 Phoenix Prec Technology Corp A method of manufacturing a substrate having metal bumps
TW200938022A (en) * 2008-02-27 2009-09-01 Phoenix Prec Technology Corp Circuit board having conductive bumps and fabrication method thereof

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JPH02310941A (ja) * 1989-05-26 1990-12-26 Mitsui Mining & Smelting Co Ltd バンプを有するプリント回路基板およびバンプの形成方法
JP2002134545A (ja) * 2000-10-26 2002-05-10 Oki Electric Ind Co Ltd 半導体集積回路チップ及び基板、並びにその製造方法
JP2002261111A (ja) * 2001-03-06 2002-09-13 Texas Instr Japan Ltd 半導体装置及びバンプ形成方法
JP2003142811A (ja) 2001-11-06 2003-05-16 Ngk Spark Plug Co Ltd 配線基板及び配線基板の製造方法
JP2003152320A (ja) * 2001-11-09 2003-05-23 Ngk Spark Plug Co Ltd 配線基板及び配線基板の製造方法
JP2003198085A (ja) * 2001-12-25 2003-07-11 Shinko Electric Ind Co Ltd 回路基板およびその製造方法
JP2005108941A (ja) * 2003-09-29 2005-04-21 Toppan Printing Co Ltd 多層配線板及びその製造方法
JP4665531B2 (ja) * 2005-01-27 2011-04-06 日立電線株式会社 配線板の製造方法
TWI286454B (en) * 2005-03-09 2007-09-01 Phoenix Prec Technology Corp Electrical connector structure of circuit board and method for fabricating the same
TWI281840B (en) * 2005-05-09 2007-05-21 Phoenix Prec Technology Corp Electrically connecting structure of circuit board and method for fabricating same
KR100743233B1 (ko) 2005-07-18 2007-07-27 엘지전자 주식회사 인쇄회로기판의 패드 및 그 제조방법
KR100703663B1 (ko) 2005-07-26 2007-04-06 엘지전자 주식회사 인쇄회로기판 및 그 제조방법
TWI292684B (en) * 2006-02-09 2008-01-11 Phoenix Prec Technology Corp Method for fabricating circuit board with conductive structure
KR100832651B1 (ko) * 2007-06-20 2008-05-27 삼성전기주식회사 인쇄회로기판
JP5114130B2 (ja) 2007-08-24 2013-01-09 新光電気工業株式会社 配線基板及びその製造方法、及び半導体装置
KR100959856B1 (ko) * 2008-03-17 2010-05-27 삼성전기주식회사 인쇄회로기판 제조방법
JP2010003793A (ja) * 2008-06-19 2010-01-07 Fujitsu Ltd 配線基板、ポスト電極の転写用基板及び電子機器
KR100986294B1 (ko) * 2008-07-28 2010-10-07 삼성전기주식회사 인쇄회로기판의 제조방법
JP2012506628A (ja) * 2008-10-21 2012-03-15 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 基板上にはんだ堆積物を形成する方法
CN101754592A (zh) * 2008-11-28 2010-06-23 欣兴电子股份有限公司 导电凸块的制造方法及具有导电凸块的电路板结构
KR101140882B1 (ko) 2009-08-31 2012-05-03 삼성전기주식회사 범프를 구비한 인쇄회로기판 및 그 제조방법
KR101156917B1 (ko) 2010-05-24 2012-06-21 삼성전기주식회사 반도체 패키지 기판 및 그 제조방법
JP2012054295A (ja) 2010-08-31 2012-03-15 Kyocer Slc Technologies Corp 配線基板およびその製造方法
KR101199174B1 (ko) 2010-09-27 2012-11-07 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200803660A (en) * 2006-06-14 2008-01-01 Phoenix Prec Technology Corp A method of manufacturing a substrate having metal bumps
TW200938022A (en) * 2008-02-27 2009-09-01 Phoenix Prec Technology Corp Circuit board having conductive bumps and fabrication method thereof

Also Published As

Publication number Publication date
US20140000951A1 (en) 2014-01-02
EP2645828B1 (en) 2019-11-13
WO2012087073A3 (ko) 2012-09-27
CN103416108B (zh) 2016-11-02
US9363883B2 (en) 2016-06-07
JP2014501451A (ja) 2014-01-20
TW201236530A (en) 2012-09-01
WO2012087073A2 (ko) 2012-06-28
CN103416108A (zh) 2013-11-27
JP6092117B2 (ja) 2017-03-08
EP2645828A2 (en) 2013-10-02
EP2645828A4 (en) 2018-01-17

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