TWI446429B - 半導體裝置及其製造方法 - Google Patents
半導體裝置及其製造方法 Download PDFInfo
- Publication number
- TWI446429B TWI446429B TW100111754A TW100111754A TWI446429B TW I446429 B TWI446429 B TW I446429B TW 100111754 A TW100111754 A TW 100111754A TW 100111754 A TW100111754 A TW 100111754A TW I446429 B TWI446429 B TW I446429B
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- Taiwan
- Prior art keywords
- wafer
- main surface
- metal film
- circuit pattern
- forming
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims description 90
- 238000004519 manufacturing process Methods 0.000 title claims description 53
- 238000000034 method Methods 0.000 title description 5
- 229910052751 metal Inorganic materials 0.000 claims description 104
- 239000002184 metal Substances 0.000 claims description 104
- 238000005520 cutting process Methods 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 238
- 230000000694 effects Effects 0.000 description 10
- 230000010355 oscillation Effects 0.000 description 8
- 230000003071 parasitic effect Effects 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000001994 activation Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
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- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
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- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
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- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010170570A JP5521862B2 (ja) | 2010-07-29 | 2010-07-29 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201205656A TW201205656A (en) | 2012-02-01 |
TWI446429B true TWI446429B (zh) | 2014-07-21 |
Family
ID=45525895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100111754A TWI446429B (zh) | 2010-07-29 | 2011-04-06 | 半導體裝置及其製造方法 |
Country Status (5)
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105428255B (zh) * | 2013-03-29 | 2019-02-15 | 日月光半导体制造股份有限公司 | 透光壳体及其制造方法与应用其的光学组件 |
JP2015115446A (ja) | 2013-12-11 | 2015-06-22 | 株式会社東芝 | 半導体装置の製造方法 |
JP6221736B2 (ja) * | 2013-12-25 | 2017-11-01 | 三菱電機株式会社 | 半導体装置 |
JP6215755B2 (ja) | 2014-04-14 | 2017-10-18 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
TWI566288B (zh) * | 2014-07-14 | 2017-01-11 | 矽品精密工業股份有限公司 | 切割用載具及切割方法 |
JP6314731B2 (ja) * | 2014-08-01 | 2018-04-25 | 株式会社ソシオネクスト | 半導体装置及び半導体装置の製造方法 |
US10277271B2 (en) | 2015-07-28 | 2019-04-30 | Nippon Telegraph And Telephone Corporation | Optical module |
KR102049724B1 (ko) | 2015-08-18 | 2019-11-28 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 |
US10393532B2 (en) * | 2015-10-20 | 2019-08-27 | International Business Machines Corporation | Emergency responsive navigation |
KR102494902B1 (ko) * | 2017-02-02 | 2023-02-01 | 쇼와덴코머티리얼즈가부시끼가이샤 | 전자 부품의 제조 방법, 가보호용 수지 조성물 및 가보호용 수지 필름 |
JP2019192729A (ja) * | 2018-04-23 | 2019-10-31 | 株式会社村田製作所 | 半導体装置 |
DE112018007677B4 (de) * | 2018-05-28 | 2023-10-12 | Mitsubishi Electric Corporation | Verfahren zur Herstellung eines Halbleitergerätes |
JP7034105B2 (ja) | 2019-01-18 | 2022-03-11 | 三菱電機株式会社 | 電力用半導体装置の製造方法、電力用半導体装置および電力変換装置 |
KR20210076292A (ko) | 2019-12-13 | 2021-06-24 | 삼성전자주식회사 | 반도체 패키지 |
US11948893B2 (en) * | 2021-12-21 | 2024-04-02 | Qorvo Us, Inc. | Electronic component with lid to manage radiation feedback |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0544329A3 (en) | 1991-11-28 | 1993-09-01 | Kabushiki Kaisha Toshiba | Semiconductor package |
JP2501279B2 (ja) | 1991-11-29 | 1996-05-29 | 株式会社東芝 | 半導体パッケ―ジ |
JP2001024079A (ja) | 1999-07-05 | 2001-01-26 | Seiko Epson Corp | 電子部品の封止構造 |
US7026223B2 (en) | 2002-03-28 | 2006-04-11 | M/A-Com, Inc | Hermetic electric component package |
JP4342174B2 (ja) | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
JP2005057136A (ja) | 2003-08-06 | 2005-03-03 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP4312631B2 (ja) | 2004-03-03 | 2009-08-12 | 三菱電機株式会社 | ウエハレベルパッケージ構造体とその製造方法、及びそのウエハレベルパッケージ構造体から分割された素子 |
JP4993848B2 (ja) * | 2004-05-28 | 2012-08-08 | 三洋電機株式会社 | 配線基材 |
KR100594716B1 (ko) | 2004-07-27 | 2006-06-30 | 삼성전자주식회사 | 공동부를 구비한 캡 웨이퍼, 이를 이용한 반도체 칩, 및그 제조방법 |
FR2879889B1 (fr) | 2004-12-20 | 2007-01-26 | United Monolithic Semiconduct | Boitier miniature hyperfrequence et procede de fabrication du boitier |
JP2008532307A (ja) * | 2005-03-02 | 2008-08-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 半導体パッケージ及び作成パッケージを製造する方法 |
US7495462B2 (en) | 2005-03-24 | 2009-02-24 | Memsic, Inc. | Method of wafer-level packaging using low-aspect ratio through-wafer holes |
JP2007005948A (ja) * | 2005-06-22 | 2007-01-11 | Alps Electric Co Ltd | 電子部品及びその製造方法 |
US20070004079A1 (en) | 2005-06-30 | 2007-01-04 | Geefay Frank S | Method for making contact through via contact to an offset contactor inside a cap for the wafer level packaging of FBAR chips |
JP2007019107A (ja) * | 2005-07-05 | 2007-01-25 | Shinko Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法 |
KR100752713B1 (ko) * | 2005-10-10 | 2007-08-29 | 삼성전기주식회사 | 이미지센서의 웨이퍼 레벨 칩 스케일 패키지 및 그제조방법 |
US7393758B2 (en) * | 2005-11-03 | 2008-07-01 | Maxim Integrated Products, Inc. | Wafer level packaging process |
KR100831405B1 (ko) | 2006-10-02 | 2008-05-21 | (주) 파이오닉스 | 웨이퍼 본딩 패키징 방법 |
JP4860552B2 (ja) | 2007-06-08 | 2012-01-25 | 日本オプネクスト株式会社 | 半導体装置 |
JP5344336B2 (ja) * | 2008-02-27 | 2013-11-20 | 株式会社ザイキューブ | 半導体装置 |
-
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- 2010-07-29 JP JP2010170570A patent/JP5521862B2/ja not_active Expired - Fee Related
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2011
- 2011-04-04 US US13/079,055 patent/US8728866B2/en active Active
- 2011-04-06 TW TW100111754A patent/TWI446429B/zh not_active IP Right Cessation
- 2011-07-13 DE DE102011079105A patent/DE102011079105A1/de not_active Withdrawn
- 2011-07-13 DE DE102011122918.7A patent/DE102011122918B3/de not_active Expired - Fee Related
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Also Published As
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US20120025366A1 (en) | 2012-02-02 |
CN102347243A (zh) | 2012-02-08 |
JP2012033615A (ja) | 2012-02-16 |
TW201205656A (en) | 2012-02-01 |
CN102347243B (zh) | 2014-08-20 |
US8728866B2 (en) | 2014-05-20 |
DE102011079105A1 (de) | 2012-04-12 |
JP5521862B2 (ja) | 2014-06-18 |
DE102011122918B3 (de) | 2016-05-19 |
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