TWI426553B - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TWI426553B
TWI426553B TW099104993A TW99104993A TWI426553B TW I426553 B TWI426553 B TW I426553B TW 099104993 A TW099104993 A TW 099104993A TW 99104993 A TW99104993 A TW 99104993A TW I426553 B TWI426553 B TW I426553B
Authority
TW
Taiwan
Prior art keywords
substrate
processing liquid
liquid
transport
processed
Prior art date
Application number
TW099104993A
Other languages
English (en)
Chinese (zh)
Other versions
TW201032267A (en
Inventor
Masaki Fujiwara
Atsushi Nagata
Tetsuya Sada
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201032267A publication Critical patent/TW201032267A/zh
Application granted granted Critical
Publication of TWI426553B publication Critical patent/TWI426553B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
    • B05D1/38—Successively applying liquids or other fluent materials, e.g. without intermediate treatment with intermediate treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099104993A 2009-02-23 2010-02-22 基板處理裝置及基板處理方法 TWI426553B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009039683A JP4812847B2 (ja) 2009-02-23 2009-02-23 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW201032267A TW201032267A (en) 2010-09-01
TWI426553B true TWI426553B (zh) 2014-02-11

Family

ID=42621637

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099104993A TWI426553B (zh) 2009-02-23 2010-02-22 基板處理裝置及基板處理方法

Country Status (4)

Country Link
JP (1) JP4812847B2 (ko)
KR (1) KR101677288B1 (ko)
CN (1) CN101814424B (ko)
TW (1) TWI426553B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012124309A (ja) * 2010-12-08 2012-06-28 Tokyo Electron Ltd 現像方法、現像装置、およびこれを備える塗布現像処理システム
IT1405986B1 (it) * 2011-02-03 2014-02-06 Perini Fabio Spa "polmone per accumulare rotoli di carta o altri prodotti allungati e relativo metodo"
JP2013080808A (ja) 2011-10-04 2013-05-02 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2013191779A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 処理装置および処理方法
JP6310752B2 (ja) * 2014-04-11 2018-04-11 株式会社ディスコ 洗浄装置
EP3035375B1 (en) * 2014-12-19 2017-05-03 ATOTECH Deutschland GmbH Treating module of an apparatus for horizontal wet-chemical treatment of large-scale substrates
CN110349856B (zh) * 2019-06-28 2021-04-27 Tcl华星光电技术有限公司 湿式蚀刻方法及装置
CN117839974B (zh) * 2024-03-04 2024-06-14 江苏兴虹科技有限公司 一种铜箔表面涂层胶加工处理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200403798A (en) * 2002-08-19 2004-03-01 Dainippon Screen Mfg Substrate processing apparatus and substrate cleaning unit
JP2007250592A (ja) * 2006-03-13 2007-09-27 Tokyo Electron Ltd 基板処理装置、基板処理方法、コンピュータ読取可能な記憶媒体
JP2007300129A (ja) * 2001-11-12 2007-11-15 Tokyo Electron Ltd 基板処理装置
TW200807186A (en) * 2006-07-31 2008-02-01 Semes Co Ltd A processing apparatus for performing in-shower, suction and drying processes

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1739730B1 (en) * 2004-04-23 2012-10-17 Tokyo Electron Limited Substrate cleaning method and substrate cleaning equipment
JP4343031B2 (ja) * 2004-05-31 2009-10-14 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP4523498B2 (ja) 2005-06-27 2010-08-11 東京エレクトロン株式会社 現像処理装置及び現像処理方法
JP4762098B2 (ja) * 2006-09-28 2011-08-31 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
KR101020778B1 (ko) * 2008-08-08 2011-03-09 주식회사 디엠에스 에어나이프 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007300129A (ja) * 2001-11-12 2007-11-15 Tokyo Electron Ltd 基板処理装置
TW200403798A (en) * 2002-08-19 2004-03-01 Dainippon Screen Mfg Substrate processing apparatus and substrate cleaning unit
JP2007250592A (ja) * 2006-03-13 2007-09-27 Tokyo Electron Ltd 基板処理装置、基板処理方法、コンピュータ読取可能な記憶媒体
TW200807186A (en) * 2006-07-31 2008-02-01 Semes Co Ltd A processing apparatus for performing in-shower, suction and drying processes

Also Published As

Publication number Publication date
JP2010199150A (ja) 2010-09-09
KR20100096023A (ko) 2010-09-01
JP4812847B2 (ja) 2011-11-09
TW201032267A (en) 2010-09-01
CN101814424B (zh) 2012-01-25
KR101677288B1 (ko) 2016-11-17
CN101814424A (zh) 2010-08-25

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