TW200807186A - A processing apparatus for performing in-shower, suction and drying processes - Google Patents

A processing apparatus for performing in-shower, suction and drying processes Download PDF

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Publication number
TW200807186A
TW200807186A TW096127096A TW96127096A TW200807186A TW 200807186 A TW200807186 A TW 200807186A TW 096127096 A TW096127096 A TW 096127096A TW 96127096 A TW96127096 A TW 96127096A TW 200807186 A TW200807186 A TW 200807186A
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Taiwan
Prior art keywords
knife
substrate
suction
shower
spray
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TW096127096A
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Chinese (zh)
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TWI363254B (en
Inventor
Jae-Hyun Choi
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Semes Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Abstract

A processing apparatus for performing in-shower, suction and drying processes is provided in order to increase spatial and temporal efficiency by having a single processing apparatus performs in-shower, suction, and drying processes when a substrate is coated, exfoliated, or rinsed off. The apparatus includes a knife unit that includes an in-shower knife and an air knife; and a frame, attached to the knife unit, which transfers the knife unit on a substrate.

Description

200807186 ' ... ' ; . . 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種執行噴淋、吸入及吹乾製程的製程裝 ' .' ....... - 置，更進一；步而言，該製程裴置能在單一製程裝備内執行嘴 淋、吸入及吹乾製程，以提高對基板進行塗覆或剝離、洗淨製 程時之時間及空間上的效率。200807186 ' ... ' . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Further, in the step, the process device can perform a nozzle showering, inhaling, and drying process in a single process equipment to improve the time and space efficiency of coating, peeling, and cleaning processes on the substrate.

在半導體製程中，為了形成微細圖案，一般採用照相蝕 刻技術。照相姓刻技術的步驟，可包含:形成一製作圖案的層; 將如光阻等感光膜塗覆在該受蝕刻的層上;對部分該感光膜進 行曝光；對部份已曝光的感光膜加以顯影以形成感光膜圖案； 以及，以該感光膜圖案作為光罩而對受姓刻的層加以韻刻，形 成最後的圖案。In the semiconductor process, in order to form a fine pattern, a photoetching technique is generally employed. The step of photographing the engraving technique may include: forming a patterned layer; coating a photosensitive film such as a photoresist on the etched layer; exposing a portion of the photosensitive film; and partially exposing the exposed photosensitive film Developing to form a photosensitive film pattern; and, using the photosensitive film pattern as a mask, the layer engraved by the surname is rhymed to form a final pattern.

作為上述各種步驟的照相蝕刻技術之顳影方式，一直使 用喷琳、浸潰、喷灑方式等。 • - .· · · · · · · 在喷淋方式中，將基板安裝於輸送平台上，並在利甩輸 送平台移動基板之同時以喷琳機吹灑顯影液，藉此形成在基板 表面上所形成的感光膜。結束感光膜之形成後，使用去離子水 清洗基板後再進行乾燥，以形成感光膜圖案。 - ... .... . ' · .. ' 在蝕刻製程中，亦利用喷淋機噴射蝕刻藥水，對受餘刻 的層進行蝕刻，以形成最後的圖案。其後，使用去離子水清洗 基板後再進行乾燥，以形成最後的圖案。 如上所述，在該等製程中，在各製程後需追加使用去離 200807186 預留空間之困 子水^洗並乾燥基板的步驟，因而產生必須為此 擾p 、,、、：匕 【發明内容】 可執行嘴淋、吸入及吹乾的各組件，在單—一4於，女衣 或兩個製程，以提高時間上及空間^#至内進行三個 術^目触不册以提_的，萬縣該項技 術者由.下述内容中可理解之未提及或其他目去。 及^土述目的，本發明之一形態之執行嘴淋、進行吸入 =乾^的製程裝置，包含有：包含魏刀、風刀之刀組件「 乂及’女瓜有刀組件並使施件在基板上移動之組件架。 根據本發明’喷淋、吸入及風刀安裝於單—組件牟卜拍 行製程處理，可提高空間上的效率I … ’執行喷琳、吸入及吹乾 理亚依序進行，可提高時間上的使用效率。 ^發明的效果並不限於上述提及之目的，而為熟悉該項技 術者由申睛補細之記載巾可理解之未提及或其他效果者。 1 ' . . - ..... 【實施方式】 其他’貫施形態的具體内容包含於本說明書及圖式中。 本發明的優點及特徵，以及甩以達成之方法，只要參照 圖式並參照後述說明的實施形態即可明瞭。然而，本發明並 不限於以下揭露之實施形態，也可透過採用相互不同的各種 形恶來實施’而本貫施形態僅為能使本發明之揭露更為完整 200807186 ，並使熟悉該項技術者瞭解翻所屬的領域而提供者，从 明係僅:評請專利顧之_岭義者。在整篇說明書中: 以相同符號表示相同元件。 。以下參_掘針對本發_較佳f__詳細說明 :-〇： " · ；..；'；"； - ：' . ：;；'···；· ； ： ：.';：；：； 別圖1係表示本發明之-實施形態之執行噴淋、吸入及吹 ，衣程的製程裝置中執行喷淋、吸入及吹乾製程的各刀之立 體圖。圖2絲林刺之—餘形 吹乾製程的製程裝置之立體圖。 _發=^卿態讀行翁、狀及吹絲程的製 表衣置，可包含刀組件、組件架、基板安裝單元及驅動單元 ’可包含魏刀11G、吸人刀播域刀13〇。 貝淋(In-showerh U〇，擔任將藥水或去離子水提供至 基板任^以便使製喊置進行該製程處理。嗔。Γ 10 :错，供應藥水或去離子水的供應單元(未圖示)並透過喷 口二樂水或去離子水。可對噴淋刀喷口形態做種， 以符合製程之需求。 ;9^m l9 110 a 口计日y-峰 jl、 子Jc 。另外也^以封蘭刀 喷口亚且㈣崎倾錢數觀，贿藥核去離子水透 過該孔供應。啊，也可以使噴淋刀成為不於wi所示的As a method of photographing the photolithography technique of the above various steps, spray, dipping, spraying, and the like have been used. • - In the spray mode, the substrate is mounted on the transport platform, and the developer is blown by the sprayer while the substrate is being moved by the transfer platform, thereby forming on the surface of the substrate. The formed photosensitive film. After the formation of the photosensitive film is completed, the substrate is washed with deionized water and then dried to form a photosensitive film pattern. - .... . . ' . . . ' In the etching process, the etchant is also sprayed with a sprayer to etch the remaining layer to form the final pattern. Thereafter, the substrate was washed with deionized water and then dried to form a final pattern. As described above, in the processes, after each process, the step of washing and drying the substrate from the trapped water of the reserved space of 200807186 is additionally used, so that it is necessary to disturb the p, ,,,, Contents] The components of the mouth can be drenched, inhaled and blown dry, in the single-to-four, women's clothing or two processes, to improve the time and space ^ # to the inside of the three operations _, the county of Wanxian this technology by. The following content can be understood without mention or other purposes. And the object of the present invention, the apparatus for performing the nozzle dripping and the inhalation = dry ^ according to one aspect of the present invention, comprising: a knife assembly including a Wei knife and an air knife, and a female melon knife assembly and a delivery device The assembly frame that moves on the substrate. According to the invention, the spray, suction and air knife are installed in the single-component 牟 行 行 process, which can improve the space efficiency I ... 'Perform the spray, inhale and blow dry In order to improve the efficiency of use in time. The effect of the invention is not limited to the above-mentioned purpose, but is not mentioned or otherwise effected by those who are familiar with the technology. 1 ' . . - . . . [Embodiment] The details of other embodiments are included in the present specification and drawings. Advantages and features of the present invention, and methods for achieving the same, as long as reference is made to the drawings. The present invention will be described with reference to the embodiments described below. However, the present invention is not limited to the embodiments disclosed below, and may be implemented by using various forms of dissimilarity, and the present embodiment is merely illustrative of the present invention. More complete 200807186, and to provide a familiarity with the technology to understand the domain of the provider, from the Ming system only: the evaluation of the patent Gu Zhi _ Ling Yi. In the entire specification: the same symbol to represent the same component. Digging for this hair _ better f__ Detailed description: -〇: "·;..;';"; - :' . :;;'···;· ; : :.';:;:; 1 is a perspective view showing each of the knives performing the spraying, suction, and drying processes in the process apparatus for performing the spraying, suction, and blowing, and the dressing process of the present invention. A perspective view of the process unit of the blow-drying process. _ hair = ^ Qing state reading line, shape and blow molding process, can include knife assembly, component frame, substrate mounting unit and drive unit ' can include Weidao 11G Injecting a knife to the field knife 13 〇. In-showerh U〇, served as a syrup or deionized water to the substrate to make the process of the process. 嗔. Γ 10: wrong, supply syrup Or deionized water supply unit (not shown) and through the nozzle Erle water or deionized water. Can be used to spray nozzle shape Kind, in order to meet the needs of the process.; 9^m l9 110 a mouth date y-peak jl, sub-Jc. In addition, ^ 封 刀 刀 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿The hole is supplied. Ah, the spray knife can also be made not shown by wi.

形狀5有if鄉頭，藥水或絲子水得H 林加IV/tf個^刀係可安裝在用來安裝複數個刀的紙 木 ”1如’當要透過噴淋刀進行顯影製程或蚀刻製 200807186 . ' - -. .- . -.. ——. .-. · .... .. . ； .... .- . . 心接^應去離子水進行洗淨製程時’安裝兩個喷淋刀讣 亚f第一噴淋刀供應藥水喷射至基板，而去離子水則透過 =-贺淋刀喷射至基板。但是，也可以利用單一喷淋刀在掃 土板的同¥噴射樂水，再度在掃描基板的過程中透過 刀供應去離子水。： ^ : ^Λ 、吸入刀120，可吸入因藥水而吸附在基板上的雜質，或無 法在基板上執行製程以致飛藏的藥水。因此，如果藥水充分 也顧植基板上不會飛_時，也可以*包含吸人刀不使吸 »入刀執行吸入製程。 ' -- . \ - - - . . · . . . ' - - ’ . V . . . : 吸入刀120其通孔的截面較大，以便有效地吸入飛藏的 藥水等。 風刀（Air kn^ 去離f水進行吹乾的任務。近年來，基板趨向大型化，為了 ^有放地Π人乾噴射在半導體上的藥水或去離子水，因而有嘗 姐k助娜狀或細駿。村找將基減置—輸送 1 角度使之傾斜移動，同時進行吹氣，從基板上方高速嗔氣， 以13人乾樂水或去離子水。 因而，如圖1所示，風刀可維持傾斜狀態喷氣，給予其 方，性可使藥水或去離子水朝基板上的某—方命吹走。並且 ’可在縱向設有一定的角度，整體地藉由風刀喷射的空氣沿 傾斜方向吹乾基板。 ^方可以安裝複數個刀11G、12^、13()。例如，可以依序 安襄噴淋刀110、吸入刀⑽及風刀懦。但是，為了使風刀 200807186 - . . · > - - . . . ' · . * 在平面上具有一定的角度，可使組件架的頂部面具有一定的 面積。此外，在考慮製程上的速度及各刀間之相互干擾，亦 有設置一定間隔安裝各刀而較佳之情況ό 如圖2所示，可使基板處於停止狀態，-移動組件架幻〇 噴射藥水時，可使製程從基板最左側邊或右邊侧開始進行， 並利用驅動單元（未圖示）向某一方向移動組件架以執行製， .處理。“ :V . '.. 心 在滑動潜220或導執上移動，並利用電動馬達或流壓起動的 活塞來移動組件架。為了實現更精準的定位控制，可以利用 鏈條，或更包含位置傳感器。 、同時，若組件架為固定之架構，則可使基板向左右移動 ^為此，可在基板上形成具有轉軸(Sh_及滾筒之基板輪送 單元’更包含轉轴驅動單元用以帶動轉轴。由此，將噴淋、、 吸入及風刀固定在各組件架上或固定在基板上，可在向某一 _ 方向移送基板的同時，進行製程處理。但是，為了達成對基 :v 板之整體進 的情況，需要更大的空間^ ^ ^ 八 ^基板安裝單元230係位於製程室下面，可具有機械式或 電子式固定單元將基板固定於製程過程之間的基板安裝單元 上。基板安裝單元，較佳由靜電式夾頭(Electr〇sta& (^uck)所構成，該夾頭係藉由控制介電質極化產生的靜電能 I，而執打使基板吸附或脫離介電質體表面的功能。但是， 200807186 . * * - ^可以使用與此相同功能的機械式夾具(Mechanical a〇lp)或真空式吸盤(Vacuum Chuck)等。 省述7成之本發明之執行喷棘、吸入及愤 衣私衣置，'其作用說明如下。 喷在顯影製程中從喷淋刀110噴射出顧影液。一邊 的ί·:邊她上執行顯影製程時，未吸附在輸 風刀130向外侧吹出而乾燥基板。如此，在利用：個 =執製程的同時也將組件架由基板的一側移動至0 猎此可對基板整體進行顯影製程。 噴射他^"例’在侧餘㈣從魏刀110 120來吸入上上二二且在先前已蝕刻的部分處利用吸入刀 移純件㈣_ ^上且縣在空中的_液。在再度 3^絲_。域，__之^_ 德執恤__，輪 舉其他實施例，本發明亦可適甩於洗淨勢 ^ 〇嘴射出去離子水，以除去基板上的雜質。—7淋刀η 2°吸入去離子水，但是去離子水飛賤^ 此可令略_吸人刀來吸人的步驟。利心^干見’因 向一定的方向，可向外吹走仍留在基板上3去f將空氣吹 爾留在基板上的去離子水· 10 200807186 風刀安裝在組件架210上並移動組件架·，可對基板進杆 洗淨製程。 :入 ν τ 口口執打讀製程ϋ不需要按各刀分別使用製程室，而是使 將基板或各刀依序移動之缺點，一邊移動複數個刀4 製程處理’可縮短製程時間。 、以上錢圖式說明本發明的實施形態，熟悉本發明技術領 域之知識者應瞭解在未脫离隹本發明的技術思及必的特^ 範圍内可⑽各餘代、變觀暖，侧魏具M3 有限疋性負。 圖式簡單說明】 ^製繼Shape 5 has if the head, potion or silk water to get H Linga IV / tf ^ knife system can be installed in the paper used to install a number of knives" 1 such as "through the spray knife for development process or etching System 200807186 . ' - -. .- . -.. ——. .-. · .... . . . . . . . . . . . . . . Two spray knives, the first spray knives, supply the syrup to the substrate, and the deionized water is sprayed to the substrate through the =- Helu knife. However, it is also possible to use a single spray knives on the sweeping board. Jet water, once again in the process of scanning the substrate through the knife to supply deionized water.: ^ : ^ Λ, suction knife 120, can absorb impurities caused by the drug on the substrate, or can not perform the process on the substrate to fly Therefore, if the syrup is sufficient, the substrate will not fly _, you can also * include the suction knife does not make the suction into the knife to perform the inhalation process. ' -- . \ - - - . . . . '- - ' . V . . . : The suction knife 120 has a large cross section of the through hole to effectively inhale the medicine and the like. The air knife (Air kn^ is blown away from the f water) In recent years, the substrate has become larger, in order to have the medicinal or deionized water sprayed on the semiconductor, so there is a taste of the helper or the fine. The angle makes it move obliquely, and at the same time, the air is blown, and the air is blown from above the substrate to 13 people for dry water or deionized water. Thus, as shown in Fig. 1, the air knife can maintain the inclined state jet, giving it squareness, sex The syrup or deionized water can be blown away toward a certain life on the substrate, and 'the angle can be set in the longitudinal direction, and the air sprayed by the air knife as a whole is blown dry in the oblique direction. Each of the blades 11G, 12^, 13(). For example, the spray knife 110, the suction knife (10), and the air knife can be installed in order. However, in order to make the air knife 200807186 - . . . > - - . . . · * The angle of the plane has a certain angle, so that the top surface of the frame has a certain area. In addition, considering the speed of the process and the mutual interference between the knives, it is better to install the knives at a certain interval. Situation ό As shown in Figure 2, the substrate can be stopped. State, when moving the phantom jet syrup, the process can be started from the leftmost side or the right side of the substrate, and the drive unit (not shown) is used to move the assembly frame in a certain direction to perform the system processing. :V . '.. The heart moves on the sliding dive 220 or the guide and uses an electric motor or a piston that is started by the flow to move the frame. For more precise positioning control, a chain or a position sensor can be used. At the same time, if the component frame is a fixed structure, the substrate can be moved to the left and right. For this purpose, a rotating shaft can be formed on the substrate (the substrate transfer unit of the Sh_ and the roller) further includes a rotating shaft driving unit for driving the rotation. axis. Thereby, the shower, the suction, and the air knife are fixed to the respective frame holders or fixed to the substrate, and the substrate can be transferred while being transported in a certain direction. However, in order to achieve the overall entry of the base: v board, more space is required. ^ ^ ^ The substrate mounting unit 230 is located below the process chamber, and may have a mechanical or electronic fixing unit to fix the substrate to the process. Between the mounting units on the substrate. The substrate mounting unit is preferably composed of an electrostatic chuck (Electr〇sta & (^uck), which is used to control the electrostatic energy I generated by the polarization of the dielectric, and the substrate is adsorbed or detached. The function of the surface of the electroless body. However, 200807186. * * - ^ A mechanical clamp (Mechanical a〇lp) or a vacuum chuck (Vacuum Chuck), etc., which can perform the same function as above, can be used. Spraying the spines, inhaling, and irritating clothes, 'The function is as follows. Spraying in the developing process, spraying the shadow liquid from the spray knife 110. One side of the ί·: while she is performing the development process, it is not adsorbed The air knife 130 is blown out to the outside to dry the substrate. Thus, the assembly frame is moved from one side of the substrate to 0 while using the == execution process. This can be used to develop the entire substrate. Spray it ^" In the side (4) from the Wei knife 110 120 to inhale the upper and lower two and use the suction knife to move the pure piece (4) _ ^ on the previously etched part and the county in the air _ liquid. In the re- 3 ^ silk _. domain, _ _之^_德执__, other embodiments of the wheel, the invention can also be suitable for washing ^ 〇 射 射 射 离子 射 射 射 射 射 射 射 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子 离子^See 'Because in a certain direction, you can blow away the remaining deionized water left on the substrate 3 to f leave the air on the substrate. 10 200807186 The air knife is mounted on the component frame 210 and moves the component frame ·It can be used to clean the substrate into the rod. :Into the ν τ mouth to read the process ϋDo not need to use the process chamber separately for each knife, but to make the substrate or each knife move in sequence, while moving a plurality of The knives 4 process can be used to shorten the process time. The above figures illustrate the embodiments of the present invention, and those skilled in the art of the present invention should understand that it is not within the scope of the technical scope of the present invention. (10) Each generation, change to warm, side Wei M3 limited 疋 negative. Simple description of the schema] ^ system succession

圖2係表示本發明之一實施形態之執行噴淋 製輕的製程裝置之立體圖… .、 、吸入及吹乾 【主要元件符號說明】 110喷淋刀 120吸入刀 130 風刀 230 基板安裝單元 210組件架 112 is a perspective view showing a process apparatus for performing a showering light according to an embodiment of the present invention. . . , , suction and drying [Description of main components] 110 spray knife 120 suction knife 130 air knife 230 substrate mounting unit 210 Component frame 11

Claims (1)

200807186 十、申請專利範園·· . ·. 1· 一種執行喷淋、吸入及吹乾製程的製程裝置，該裝置包含: 刀組件，該刀耝件包含將藥水或去離子水喷射至基板的喷淋 . . ' . ... ... ... _ · 刀，及喷射氣體以吹乾基板的風刀;以及， ....... .. ' . _ _ 七件架，該組件架安裝有刀組件並使刀組件在基板上移動。 2.如申請專利範圍第1項所述之執行喷淋、吸入及吹乾製程的製 私I置’其中上述刀組件更包含執行吸人功能的吸入刀。 3·如申睛專利範圍第1項所述之執行喷淋、吸入及吹乾製程的製 程裝置，其中更包含用以固定基板的基板安裝單元。 4. ，請專利範圍第】項所述之執行、吸入及吹乾製程· 私衣置’其中更包令用以帶動上述組件架的驅元。 5. 如申請專利細第1項所述之執行噴淋、吸人及吹乾製程的# ，置’其中上述刀組件，包含，上的噴以 的吸入刀以及一個以上的風刀。200807186 X. Applying for a patent garden ························································································ Spraying . . . . ... ... _ · knife, and air knife that sprays gas to dry the substrate; and, ....... .. _ _ seven-piece rack, the The component holder is mounted with a knife assembly and moves the knife assembly over the substrate. 2. The process of performing the spraying, inhaling and drying processes as described in claim 1 wherein the above-mentioned knife assembly further comprises a suction knife for performing a suction function. 3. The apparatus for performing a shower, suction, and blow-dry process according to the first aspect of the invention, further comprising a substrate mounting unit for fixing the substrate. 4. Please refer to the implementation, inhalation and drying process described in the scope of patents], and the private clothing set, which is used to drive the above-mentioned component frame. 5. As described in the patent application, the spray, suction and blow-drying process described in item 1, the above-mentioned knife assembly, including the upper suction knife and more than one air knife.
TW096127096A 2006-07-31 2007-07-25 A processing apparatus for performing in-shower, suction and drying processes TWI363254B (en)

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KR100973963B1 (en) * 2010-01-21 2010-08-05 프리시스 주식회사 Untouchable type etching apparatus of wafer
KR101205834B1 (en) * 2010-08-24 2012-11-29 세메스 주식회사 Cleaning unit, Apparatus of discharging treating fluid with the unit and Method for cleaing head
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KR20080011591A (en) 2008-02-05
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CN101118837B (en) 2011-09-21
JP2008030019A (en) 2008-02-14

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