TWI420686B - 半導體發光裝置、發光模組及照明裝置 - Google Patents

半導體發光裝置、發光模組及照明裝置 Download PDF

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Publication number
TWI420686B
TWI420686B TW094142928A TW94142928A TWI420686B TW I420686 B TWI420686 B TW I420686B TW 094142928 A TW094142928 A TW 094142928A TW 94142928 A TW94142928 A TW 94142928A TW I420686 B TWI420686 B TW I420686B
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Taiwan
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light
substrate
layer
semiconductor
emitting
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TW094142928A
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English (en)
Chinese (zh)
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TW200633269A (en
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永井秀男
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松下電器產業股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW094142928A 2004-12-10 2005-12-06 半導體發光裝置、發光模組及照明裝置 TWI420686B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004358455 2004-12-10

Publications (2)

Publication Number Publication Date
TW200633269A TW200633269A (en) 2006-09-16
TWI420686B true TWI420686B (zh) 2013-12-21

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TW094142928A TWI420686B (zh) 2004-12-10 2005-12-06 半導體發光裝置、發光模組及照明裝置

Country Status (4)

Country Link
US (1) US7791091B2 (enExample)
JP (1) JP2008523578A (enExample)
TW (1) TWI420686B (enExample)
WO (1) WO2006062239A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
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CN103165800A (zh) * 2011-12-08 2013-06-19 新世纪光电股份有限公司 电子元件
US9306141B2 (en) 2009-08-03 2016-04-05 Kabushiki Kaisha Toshiba Method for manufacturing semiconductor light emitting device

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JP4871694B2 (ja) * 2006-10-06 2012-02-08 日立アプライアンス株式会社 発光ダイオードパッケージ
JP4899931B2 (ja) * 2007-02-28 2012-03-21 日亜化学工業株式会社 照明装置
JP5407116B2 (ja) * 2007-06-22 2014-02-05 豊田合成株式会社 発光装置
JP5405731B2 (ja) * 2007-10-23 2014-02-05 日立コンシューマエレクトロニクス株式会社 光源モジュール
DE112008004058T5 (de) * 2008-10-31 2013-02-28 Denki Kagaku Kogyo K.K. Substrat für Baugruppe mit lichtemittierendem Element und Baugruppe mit lichtemittierendem Element
JP4686643B2 (ja) * 2009-07-03 2011-05-25 シャープ株式会社 半導体発光素子搭載用基板、バックライトシャーシ、表示装置、及び、テレビ受信装置
JP5882910B2 (ja) * 2010-01-19 2016-03-09 エルジー イノテック カンパニー リミテッド パッケージおよびその製造方法
KR100969100B1 (ko) * 2010-02-12 2010-07-09 엘지이노텍 주식회사 발광소자, 발광소자의 제조방법 및 발광소자 패키지
US9710294B2 (en) 2010-03-17 2017-07-18 Zerto Ltd. Methods and apparatus for providing hypervisor level data services for server virtualization
US9442748B2 (en) 2010-03-17 2016-09-13 Zerto, Ltd. Multi-RPO data protection
US9389892B2 (en) 2010-03-17 2016-07-12 Zerto Ltd. Multiple points in time disk images for disaster recovery
US11256529B2 (en) 2010-03-17 2022-02-22 Zerto Ltd. Methods and apparatus for providing hypervisor level data services for server virtualization
US10649799B2 (en) 2010-03-17 2020-05-12 Zerto Ltd. Hypervisor virtual server system, and method for providing data services within a hypervisor virtual server system
JP5209075B2 (ja) * 2010-05-21 2013-06-12 有限会社 ナプラ 電子デバイス及びその製造方法
JP5426481B2 (ja) * 2010-05-26 2014-02-26 株式会社東芝 発光装置
US8901586B2 (en) * 2010-07-12 2014-12-02 Samsung Electronics Co., Ltd. Light emitting device and method of manufacturing the same
KR101194844B1 (ko) * 2010-11-15 2012-10-25 삼성전자주식회사 발광소자 및 그 제조방법
US8502255B2 (en) * 2011-11-21 2013-08-06 Foxsemicon Integrated Technology, Inc. Light emitting diode
KR101891257B1 (ko) * 2012-04-02 2018-08-24 삼성전자주식회사 반도체 발광장치 및 그 제조방법
TWI481082B (zh) * 2012-06-15 2015-04-11 茂邦電子有限公司 A light emitting diode package and use of the heat dissipation module
CN103515508A (zh) * 2012-06-19 2014-01-15 茂邦电子有限公司 发光二极管封装及其所使用的散热模块
JP6085459B2 (ja) * 2012-12-05 2017-02-22 星和電機株式会社 照明装置
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JP6623508B2 (ja) * 2014-09-30 2019-12-25 日亜化学工業株式会社 光源及びその製造方法、実装方法
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