TWI415532B - 長可撓性電路及其製造方法 - Google Patents

長可撓性電路及其製造方法 Download PDF

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Publication number
TWI415532B
TWI415532B TW096128435A TW96128435A TWI415532B TW I415532 B TWI415532 B TW I415532B TW 096128435 A TW096128435 A TW 096128435A TW 96128435 A TW96128435 A TW 96128435A TW I415532 B TWI415532 B TW I415532B
Authority
TW
Taiwan
Prior art keywords
circuit
photoresist
light
mask
segments
Prior art date
Application number
TW096128435A
Other languages
English (en)
Chinese (zh)
Other versions
TW200814879A (en
Inventor
Ronald Lann Imken
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200814879A publication Critical patent/TW200814879A/zh
Application granted granted Critical
Publication of TWI415532B publication Critical patent/TWI415532B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70125—Use of illumination settings tailored to particular mask patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW096128435A 2006-08-03 2007-08-02 長可撓性電路及其製造方法 TWI415532B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82136606P 2006-08-03 2006-08-03

Publications (2)

Publication Number Publication Date
TW200814879A TW200814879A (en) 2008-03-16
TWI415532B true TWI415532B (zh) 2013-11-11

Family

ID=39033321

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096128435A TWI415532B (zh) 2006-08-03 2007-08-02 長可撓性電路及其製造方法

Country Status (7)

Country Link
US (1) US7947429B2 (enExample)
EP (1) EP2052294A4 (enExample)
JP (1) JP2009545774A (enExample)
KR (1) KR20090035569A (enExample)
CN (1) CN101501574B (enExample)
TW (1) TWI415532B (enExample)
WO (1) WO2008019249A1 (enExample)

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JP2010016313A (ja) * 2008-07-07 2010-01-21 Hitachi Cable Ltd 配線基板の製造方法および配線基板
US8339573B2 (en) * 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
JP2011205042A (ja) * 2010-03-26 2011-10-13 Panasonic Electric Works Co Ltd プリント配線板の製造方法
JP5598239B2 (ja) * 2010-10-08 2014-10-01 ウシオ電機株式会社 光照射装置
EP2950144B1 (en) * 2014-05-31 2016-12-14 Rohm and Haas Electronic Materials LLC Imaging process on substrates with aqueous alkaline soluble uv blocking compositions and aqueous soluble uv transparent films
US9622353B2 (en) * 2014-05-31 2017-04-11 Rohm And Haas Electronic Materials Llc Imaging on substrates with alkaline strippable UV blocking compositions and aqueous soluble UV transparent films
US12459200B2 (en) * 2017-05-11 2025-11-04 Seurat Technologies, Inc. Solid state routing of patterned light for additive manufacturing optimization
KR20170051695A (ko) * 2015-10-30 2017-05-12 주식회사 잉크테크 연성인쇄회로기판 제조방법 및 그 제조장치
CN105870319B (zh) * 2016-04-26 2019-03-05 贝骨新材料科技（上海）有限公司 一种长条状压电薄膜传感器卷对卷制造方法
JP6745712B2 (ja) * 2016-11-30 2020-08-26 日東電工株式会社 配線回路基板およびその製造方法
CN106711085B (zh) * 2016-12-12 2019-02-19 东莞市广信知识产权服务有限公司 一种柔性互连金属的制备方法
CN106990600B (zh) * 2017-06-07 2019-12-06 京东方科技集团股份有限公司 彩膜基板及其制造方法、显示面板、显示装置
CN110595512B (zh) * 2019-09-24 2023-10-27 湖南科技大学 一种柔性压电传感器的制作方法
JP7441031B2 (ja) * 2019-11-11 2024-02-29 日東電工株式会社 配線回路基板の製造方法および配線回路基板集合体シート
JP7612327B2 (ja) * 2019-12-24 2025-01-14 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板シート
CN111122712A (zh) * 2020-01-15 2020-05-08 深圳市中科传感技术有限公司 一种兰姆波传感器
CN113013295A (zh) * 2021-03-02 2021-06-22 苏州太阳井新能源有限公司 一种防止光伏电池边缘短路的电极制作方法及通过该方法形成的光伏电池

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US5437946A (en) * 1994-03-03 1995-08-01 Nikon Precision Inc. Multiple reticle stitching for scanning exposure system
US5652645A (en) * 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
US20020187406A1 (en) * 1997-12-25 2002-12-12 Nikon Corporation Photomask producing method and apparatus and device manufacturing method

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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437946A (en) * 1994-03-03 1995-08-01 Nikon Precision Inc. Multiple reticle stitching for scanning exposure system
US5652645A (en) * 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
US20020187406A1 (en) * 1997-12-25 2002-12-12 Nikon Corporation Photomask producing method and apparatus and device manufacturing method

Also Published As

Publication number Publication date
CN101501574B (zh) 2012-01-11
US20080032209A1 (en) 2008-02-07
EP2052294A1 (en) 2009-04-29
WO2008019249A1 (en) 2008-02-14
CN101501574A (zh) 2009-08-05
KR20090035569A (ko) 2009-04-09
EP2052294A4 (en) 2012-08-22
US7947429B2 (en) 2011-05-24
JP2009545774A (ja) 2009-12-24
TW200814879A (en) 2008-03-16

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