CN106711085B - 一种柔性互连金属的制备方法 - Google Patents
一种柔性互连金属的制备方法 Download PDFInfo
- Publication number
- CN106711085B CN106711085B CN201611141945.0A CN201611141945A CN106711085B CN 106711085 B CN106711085 B CN 106711085B CN 201611141945 A CN201611141945 A CN 201611141945A CN 106711085 B CN106711085 B CN 106711085B
- Authority
- CN
- China
- Prior art keywords
- metal
- manufacturing
- interconnection metal
- flexible
- flexible interconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 56
- 239000002184 metal Substances 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 20
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000010936 titanium Substances 0.000 claims abstract description 16
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 16
- 239000010931 gold Substances 0.000 claims abstract description 15
- 229910052737 gold Inorganic materials 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000001259 photo etching Methods 0.000 claims abstract description 10
- 230000008020 evaporation Effects 0.000 claims abstract description 6
- 238000001704 evaporation Methods 0.000 claims abstract description 6
- 238000004544 sputter deposition Methods 0.000 claims abstract description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000001020 plasma etching Methods 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 238000001459 lithography Methods 0.000 abstract description 3
- 238000001465 metallisation Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 238000004377 microelectronic Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000009832 plasma treatment Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611141945.0A CN106711085B (zh) | 2016-12-12 | 2016-12-12 | 一种柔性互连金属的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611141945.0A CN106711085B (zh) | 2016-12-12 | 2016-12-12 | 一种柔性互连金属的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106711085A CN106711085A (zh) | 2017-05-24 |
CN106711085B true CN106711085B (zh) | 2019-02-19 |
Family
ID=58937302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611141945.0A Active CN106711085B (zh) | 2016-12-12 | 2016-12-12 | 一种柔性互连金属的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106711085B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101088156A (zh) * | 2004-12-22 | 2007-12-12 | 3M创新有限公司 | 柔性电子电路制品及其制造方法 |
EP1993333A2 (en) * | 2007-05-18 | 2008-11-19 | Augux Co., Ltd. | Method for manufacturing tag integrated circuit flexible board and structure of the same |
CN102045939A (zh) * | 2009-10-19 | 2011-05-04 | 巨擘科技股份有限公司 | 柔性多层基板的金属层结构及其制造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7947429B2 (en) * | 2006-08-03 | 2011-05-24 | 3M Innovative Properties Company | Long length flexible circuits and method of making same |
-
2016
- 2016-12-12 CN CN201611141945.0A patent/CN106711085B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101088156A (zh) * | 2004-12-22 | 2007-12-12 | 3M创新有限公司 | 柔性电子电路制品及其制造方法 |
EP1993333A2 (en) * | 2007-05-18 | 2008-11-19 | Augux Co., Ltd. | Method for manufacturing tag integrated circuit flexible board and structure of the same |
CN102045939A (zh) * | 2009-10-19 | 2011-05-04 | 巨擘科技股份有限公司 | 柔性多层基板的金属层结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106711085A (zh) | 2017-05-24 |
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Effective date of registration: 20200909 Address after: Room 211, second floor, scientific research building, Dongtinghu Road, Gaoyou Economic Development Zone, Yangzhou City, Jiangsu Province Patentee after: YANGZHOU HANXUN TECHNOLOGY Co.,Ltd. Address before: Hsinchu Songshan Lake high tech Industrial Development Zone of Dongguan City, Guangdong province 523000 New Building No. 13 6 4 Zhuyuan building room 607 Co-patentee before: DONGGUAN SOUTH CHINA DESIGN INNOVATION INSTITUTE Patentee before: DONGGUAN GUANGXIN INTELLECTUAL PROPERTY SERVICES Co.,Ltd. |
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Effective date of registration: 20220106 Address after: 225600 No.82 Qinyou Road, Gaoyou Economic Development Zone, Yangzhou City, Jiangsu Province Patentee after: GAOYOU HENGLI HYDRAULIC WHOLE SET EQUIPMENT Co.,Ltd. Address before: Room 211, 2nd floor, scientific research building, Dongtinghu Road, Gaoyou Economic Development Zone, Yangzhou City, Jiangsu Province 225600 Patentee before: YANGZHOU HANXUN TECHNOLOGY CO.,LTD. |
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Effective date of registration: 20221230 Address after: 225600 second and third floors, building B8, science and technology entrepreneurship center, Dongtinghu Road, Gaoyou City, Yangzhou City, Jiangsu Province Patentee after: Jiangsu Shanghe Dental Technology Co.,Ltd. Address before: 225600 No.82 Qinyou Road, Gaoyou Economic Development Zone, Yangzhou City, Jiangsu Province Patentee before: GAOYOU HENGLI HYDRAULIC WHOLE SET EQUIPMENT Co.,Ltd. |
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Effective date of registration: 20240705 Address after: No. 3, South Side of Bosideng Avenue, Gaoyou Economic Development Zone (Mapeng Street), Yangzhou City, Jiangsu Province, China 225600. Yangzhou Seno Gaode Electronic Technology Co., Ltd., 1st Floor 101, 2nd Floor 201 Patentee after: Yangzhou Strapdown Special Surface Treatment Technology Co.,Ltd. Country or region after: China Address before: 225600 second and third floors, building B8, science and technology entrepreneurship center, Dongtinghu Road, Gaoyou City, Yangzhou City, Jiangsu Province Patentee before: Jiangsu Shanghe Dental Technology Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right |