JP2009545774A - 長い全長のフレキシブル回路及びそれらの作製方法 - Google Patents

長い全長のフレキシブル回路及びそれらの作製方法 Download PDF

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Publication number
JP2009545774A
JP2009545774A JP2009522994A JP2009522994A JP2009545774A JP 2009545774 A JP2009545774 A JP 2009545774A JP 2009522994 A JP2009522994 A JP 2009522994A JP 2009522994 A JP2009522994 A JP 2009522994A JP 2009545774 A JP2009545774 A JP 2009545774A
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JP
Japan
Prior art keywords
photoresist
circuit
pattern
areas
article
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Pending
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JP2009522994A
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English (en)
Japanese (ja)
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JP2009545774A5 (enExample
Inventor
ロナルド・エル・イムケン
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3M Innovative Properties Co
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3M Innovative Properties Co
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Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009545774A publication Critical patent/JP2009545774A/ja
Publication of JP2009545774A5 publication Critical patent/JP2009545774A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70125—Use of illumination settings tailored to particular mask patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2009522994A 2006-08-03 2007-07-30 長い全長のフレキシブル回路及びそれらの作製方法 Pending JP2009545774A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82136606P 2006-08-03 2006-08-03
PCT/US2007/074757 WO2008019249A1 (en) 2006-08-03 2007-07-30 Long length flexible circuits and method of making same

Publications (2)

Publication Number Publication Date
JP2009545774A true JP2009545774A (ja) 2009-12-24
JP2009545774A5 JP2009545774A5 (enExample) 2010-09-09

Family

ID=39033321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009522994A Pending JP2009545774A (ja) 2006-08-03 2007-07-30 長い全長のフレキシブル回路及びそれらの作製方法

Country Status (7)

Country Link
US (1) US7947429B2 (enExample)
EP (1) EP2052294A4 (enExample)
JP (1) JP2009545774A (enExample)
KR (1) KR20090035569A (enExample)
CN (1) CN101501574B (enExample)
TW (1) TWI415532B (enExample)
WO (1) WO2008019249A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011205042A (ja) * 2010-03-26 2011-10-13 Panasonic Electric Works Co Ltd プリント配線板の製造方法
CN105870319A (zh) * 2016-04-26 2016-08-17 贝骨新材料科技（上海）有限公司 一种长条状压电薄膜传感器卷对卷制造方法
KR20170051695A (ko) * 2015-10-30 2017-05-12 주식회사 잉크테크 연성인쇄회로기판 제조방법 및 그 제조장치
JP2018092966A (ja) * 2016-11-30 2018-06-14 日東電工株式会社 配線回路基板およびその製造方法
JP2021077778A (ja) * 2019-11-11 2021-05-20 日東電工株式会社 配線回路基板の製造方法および配線回路基板集合体シート
JP2021101448A (ja) * 2019-12-24 2021-07-08 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板シート

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JP2010016313A (ja) * 2008-07-07 2010-01-21 Hitachi Cable Ltd 配線基板の製造方法および配線基板
US8339573B2 (en) * 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
JP5598239B2 (ja) * 2010-10-08 2014-10-01 ウシオ電機株式会社 光照射装置
EP2950144B1 (en) * 2014-05-31 2016-12-14 Rohm and Haas Electronic Materials LLC Imaging process on substrates with aqueous alkaline soluble uv blocking compositions and aqueous soluble uv transparent films
US9622353B2 (en) * 2014-05-31 2017-04-11 Rohm And Haas Electronic Materials Llc Imaging on substrates with alkaline strippable UV blocking compositions and aqueous soluble UV transparent films
US12459200B2 (en) * 2017-05-11 2025-11-04 Seurat Technologies, Inc. Solid state routing of patterned light for additive manufacturing optimization
CN106711085B (zh) * 2016-12-12 2019-02-19 东莞市广信知识产权服务有限公司 一种柔性互连金属的制备方法
CN106990600B (zh) * 2017-06-07 2019-12-06 京东方科技集团股份有限公司 彩膜基板及其制造方法、显示面板、显示装置
CN110595512B (zh) * 2019-09-24 2023-10-27 湖南科技大学 一种柔性压电传感器的制作方法
CN111122712A (zh) * 2020-01-15 2020-05-08 深圳市中科传感技术有限公司 一种兰姆波传感器
CN113013295A (zh) * 2021-03-02 2021-06-22 苏州太阳井新能源有限公司 一种防止光伏电池边缘短路的电极制作方法及通过该方法形成的光伏电池

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JPH07283132A (ja) * 1994-03-03 1995-10-27 Nikon Corp レティクルパターンをターゲット基板上でつなぎ合わせる方法及び装置
US5652645A (en) * 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
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JP2006098718A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 描画装置
JP2007310209A (ja) * 2006-05-19 2007-11-29 Nsk Ltd 露光装置

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KR100459813B1 (ko) 1997-01-29 2004-12-04 마이크로닉 레이저 시스템즈 에이비 집속된 레이저 광선에 의해 감광 물질로 코팅된 기판상에 구조체를 형성시키는 방법 및 장치
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JPH07283132A (ja) * 1994-03-03 1995-10-27 Nikon Corp レティクルパターンをターゲット基板上でつなぎ合わせる方法及び装置
US5652645A (en) * 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
JP2000056481A (ja) * 1998-08-11 2000-02-25 Nippon Seiko Kk 露光装置の位置合せ方法
JP2006098718A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 描画装置
JP2007310209A (ja) * 2006-05-19 2007-11-29 Nsk Ltd 露光装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011205042A (ja) * 2010-03-26 2011-10-13 Panasonic Electric Works Co Ltd プリント配線板の製造方法
JP2018195848A (ja) * 2015-10-30 2018-12-06 インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． フレキシブルプリント回路基板の製造方法およびその製造装置
US10887997B2 (en) 2015-10-30 2021-01-05 Inktec Co., Ltd. Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCB
KR20170051695A (ko) * 2015-10-30 2017-05-12 주식회사 잉크테크 연성인쇄회로기판 제조방법 및 그 제조장치
JP2017085109A (ja) * 2015-10-30 2017-05-18 インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． フレキシブルプリント回路基板の製造方法およびその製造装置
CN105870319B (zh) * 2016-04-26 2019-03-05 贝骨新材料科技（上海）有限公司 一种长条状压电薄膜传感器卷对卷制造方法
CN105870319A (zh) * 2016-04-26 2016-08-17 贝骨新材料科技（上海）有限公司 一种长条状压电薄膜传感器卷对卷制造方法
JP2018092966A (ja) * 2016-11-30 2018-06-14 日東電工株式会社 配線回路基板およびその製造方法
US11032913B2 (en) 2016-11-30 2021-06-08 Nitto Denko Corporation Wired circuit board and production method thereof
US11266024B2 (en) 2016-11-30 2022-03-01 Nitto Denko Corporation Wired circuit board and production method thereof
JP2021077778A (ja) * 2019-11-11 2021-05-20 日東電工株式会社 配線回路基板の製造方法および配線回路基板集合体シート
JP7441031B2 (ja) 2019-11-11 2024-02-29 日東電工株式会社 配線回路基板の製造方法および配線回路基板集合体シート
JP2021101448A (ja) * 2019-12-24 2021-07-08 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板シート
JP7612327B2 (ja) 2019-12-24 2025-01-14 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板シート

Also Published As

Publication number Publication date
CN101501574B (zh) 2012-01-11
US20080032209A1 (en) 2008-02-07
EP2052294A1 (en) 2009-04-29
WO2008019249A1 (en) 2008-02-14
CN101501574A (zh) 2009-08-05
KR20090035569A (ko) 2009-04-09
EP2052294A4 (en) 2012-08-22
US7947429B2 (en) 2011-05-24
TWI415532B (zh) 2013-11-11
TW200814879A (en) 2008-03-16

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