JP2009545774A5 - - Google Patents

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Publication number
JP2009545774A5
JP2009545774A5 JP2009522994A JP2009522994A JP2009545774A5 JP 2009545774 A5 JP2009545774 A5 JP 2009545774A5 JP 2009522994 A JP2009522994 A JP 2009522994A JP 2009522994 A JP2009522994 A JP 2009522994A JP 2009545774 A5 JP2009545774 A5 JP 2009545774A5
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JP
Japan
Prior art keywords
photoresist
mask
exposing
photoimaging
ultraviolet light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009522994A
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English (en)
Japanese (ja)
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JP2009545774A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2007/074757 external-priority patent/WO2008019249A1/en
Publication of JP2009545774A publication Critical patent/JP2009545774A/ja
Publication of JP2009545774A5 publication Critical patent/JP2009545774A5/ja
Pending legal-status Critical Current

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JP2009522994A 2006-08-03 2007-07-30 長い全長のフレキシブル回路及びそれらの作製方法 Pending JP2009545774A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82136606P 2006-08-03 2006-08-03
PCT/US2007/074757 WO2008019249A1 (en) 2006-08-03 2007-07-30 Long length flexible circuits and method of making same

Publications (2)

Publication Number Publication Date
JP2009545774A JP2009545774A (ja) 2009-12-24
JP2009545774A5 true JP2009545774A5 (enExample) 2010-09-09

Family

ID=39033321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009522994A Pending JP2009545774A (ja) 2006-08-03 2007-07-30 長い全長のフレキシブル回路及びそれらの作製方法

Country Status (7)

Country Link
US (1) US7947429B2 (enExample)
EP (1) EP2052294A4 (enExample)
JP (1) JP2009545774A (enExample)
KR (1) KR20090035569A (enExample)
CN (1) CN101501574B (enExample)
TW (1) TWI415532B (enExample)
WO (1) WO2008019249A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016313A (ja) * 2008-07-07 2010-01-21 Hitachi Cable Ltd 配線基板の製造方法および配線基板
US8339573B2 (en) * 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
JP2011205042A (ja) * 2010-03-26 2011-10-13 Panasonic Electric Works Co Ltd プリント配線板の製造方法
JP5598239B2 (ja) * 2010-10-08 2014-10-01 ウシオ電機株式会社 光照射装置
US9622353B2 (en) * 2014-05-31 2017-04-11 Rohm And Haas Electronic Materials Llc Imaging on substrates with alkaline strippable UV blocking compositions and aqueous soluble UV transparent films
EP2950144B1 (en) * 2014-05-31 2016-12-14 Rohm and Haas Electronic Materials LLC Imaging process on substrates with aqueous alkaline soluble uv blocking compositions and aqueous soluble uv transparent films
US12459200B2 (en) * 2017-05-11 2025-11-04 Seurat Technologies, Inc. Solid state routing of patterned light for additive manufacturing optimization
KR20170051695A (ko) * 2015-10-30 2017-05-12 주식회사 잉크테크 연성인쇄회로기판 제조방법 및 그 제조장치
CN105870319B (zh) * 2016-04-26 2019-03-05 贝骨新材料科技（上海）有限公司 一种长条状压电薄膜传感器卷对卷制造方法
JP6745712B2 (ja) 2016-11-30 2020-08-26 日東電工株式会社 配線回路基板およびその製造方法
CN106711085B (zh) * 2016-12-12 2019-02-19 东莞市广信知识产权服务有限公司 一种柔性互连金属的制备方法
CN106990600B (zh) * 2017-06-07 2019-12-06 京东方科技集团股份有限公司 彩膜基板及其制造方法、显示面板、显示装置
CN110595512B (zh) * 2019-09-24 2023-10-27 湖南科技大学 一种柔性压电传感器的制作方法
JP7441031B2 (ja) * 2019-11-11 2024-02-29 日東電工株式会社 配線回路基板の製造方法および配線回路基板集合体シート
JP7612327B2 (ja) * 2019-12-24 2025-01-14 日東電工株式会社 配線回路基板の製造方法、および、配線回路基板シート
CN111122712A (zh) * 2020-01-15 2020-05-08 深圳市中科传感技术有限公司 一种兰姆波传感器
CN117352585A (zh) * 2021-03-02 2024-01-05 苏州太阳井新能源有限公司 一种防止光伏电池边缘短路的电极制作方法及通过该方法形成的光伏电池

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54121971A (en) 1978-03-15 1979-09-21 Tokyo Shibaura Electric Co Continuous exposure apparatus for longgsized flexible substrate
JPH067817B2 (ja) 1986-02-27 1994-02-02 株式会社町田製作所 固体撮像素子を内蔵した内視鏡
JPH069228B2 (ja) 1986-02-27 1994-02-02 株式会社町田製作所 固体撮像素子を内蔵した内視鏡
US5437946A (en) 1994-03-03 1995-08-01 Nikon Precision Inc. Multiple reticle stitching for scanning exposure system
JPH07295231A (ja) 1994-04-27 1995-11-10 Asahi Optical Co Ltd ステップアンドリピート露光方法及びそのマスク
US5652645A (en) * 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
US5914205A (en) 1996-12-27 1999-06-22 U.S. Philips Corporation Method of manufacturing a semiconductor device whereby photomasks comprising partial patterns are projected onto a photoresist layer so as to merge into one another
KR100459813B1 (ko) * 1997-01-29 2004-12-04 마이크로닉 레이저 시스템즈 에이비 집속된 레이저 광선에 의해 감광 물질로 코팅된 기판상에 구조체를 형성시키는 방법 및 장치
TW449672B (en) * 1997-12-25 2001-08-11 Nippon Kogaku Kk Process and apparatus for manufacturing photomask and method of manufacturing the same
JP2000056481A (ja) * 1998-08-11 2000-02-25 Nippon Seiko Kk 露光装置の位置合せ方法
US6210339B1 (en) 1999-03-03 2001-04-03 Endosonics Corporation Flexible elongate member having one or more electrical contacts
JP2001154371A (ja) 1999-11-30 2001-06-08 Nikon Corp 回路デバイスや表示デバイスの製造方法、及び大型ディスプレー装置
US6559389B1 (en) 2000-08-25 2003-05-06 General Electric Company High-density cable and method therefor
KR100381855B1 (ko) 2001-01-26 2003-05-01 아이티에스테크놀러지 주식회사 플렉시블 회로기판용 노광장치
JP2004094142A (ja) 2002-09-04 2004-03-25 Toray Eng Co Ltd 幅広露光機
KR100575230B1 (ko) * 2002-12-28 2006-05-02 엘지.필립스 엘시디 주식회사 노광 장치를 이용한 노광 방법
US6876440B1 (en) 2003-09-30 2005-04-05 Asml Holding N.V. Methods and systems to compensate for a stitching disturbance of a printed pattern in a maskless lithography system utilizing overlap of exposure zones with attenuation of the aerial image in the overlap region
KR100550560B1 (ko) 2003-12-16 2006-02-10 전자부품연구원 패턴 제작 장치 및 그 방법
KR20050092848A (ko) 2004-03-17 2005-09-23 주식회사 코오롱 포토마스크 이동방식 연속 노광 시스템 및 이 노광시스템을 이용한 프리즘 필름 제조방법
JP2006098718A (ja) 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 描画装置
US7547936B2 (en) 2004-10-08 2009-06-16 Samsung Electronics Co., Ltd. Semiconductor memory devices including offset active regions
KR100706233B1 (ko) * 2004-10-08 2007-04-11 삼성전자주식회사 반도체 기억 소자 및 그 제조방법
KR100653991B1 (ko) 2004-12-29 2006-12-05 주식회사 하이닉스반도체 노광 장치 및 이를 이용한 반도체 메모리 소자의 활성영역 제조 방법
JP2007310209A (ja) * 2006-05-19 2007-11-29 Nsk Ltd 露光装置

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