TWI413256B - 薄膜電晶體,其製造方法,具有該薄膜電晶體之液晶顯示器面板及具有該薄膜電晶體之電激發光顯示器面板 - Google Patents

薄膜電晶體,其製造方法,具有該薄膜電晶體之液晶顯示器面板及具有該薄膜電晶體之電激發光顯示器面板 Download PDF

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Publication number
TWI413256B
TWI413256B TW095134088A TW95134088A TWI413256B TW I413256 B TWI413256 B TW I413256B TW 095134088 A TW095134088 A TW 095134088A TW 95134088 A TW95134088 A TW 95134088A TW I413256 B TWI413256 B TW I413256B
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TW
Taiwan
Prior art keywords
layer
driving
gate
film transistor
buffer layer
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Application number
TW095134088A
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English (en)
Chinese (zh)
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TW200717818A (en
Inventor
金秉濬
梁成勳
吳旼錫
崔在鎬
崔龍模
Original Assignee
三星顯示器有限公司
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Application filed by 三星顯示器有限公司 filed Critical 三星顯示器有限公司
Publication of TW200717818A publication Critical patent/TW200717818A/zh
Application granted granted Critical
Publication of TWI413256B publication Critical patent/TWI413256B/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6732—Bottom-gate only TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743—Silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743—Silicon
    • H10D30/6746—Amorphous silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrodes Of Semiconductors (AREA)
TW095134088A 2005-10-28 2006-09-14 薄膜電晶體,其製造方法,具有該薄膜電晶體之液晶顯示器面板及具有該薄膜電晶體之電激發光顯示器面板 TWI413256B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050102429A KR101158896B1 (ko) 2005-10-28 2005-10-28 박막트랜지스터 기판 및 이의 제조방법과,박막트랜지스터를 갖는 액정표시패널 및 전계발광 표시패널

Publications (2)

Publication Number Publication Date
TW200717818A TW200717818A (en) 2007-05-01
TWI413256B true TWI413256B (zh) 2013-10-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134088A TWI413256B (zh) 2005-10-28 2006-09-14 薄膜電晶體,其製造方法,具有該薄膜電晶體之液晶顯示器面板及具有該薄膜電晶體之電激發光顯示器面板

Country Status (5)

Country Link
US (2) US7615867B2 (enExample)
JP (1) JP5352912B2 (enExample)
KR (1) KR101158896B1 (enExample)
CN (1) CN1956225B (enExample)
TW (1) TWI413256B (enExample)

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US8334537B2 (en) * 2007-07-06 2012-12-18 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US7897971B2 (en) * 2007-07-26 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Display device
JP2009105390A (ja) * 2007-10-05 2009-05-14 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP2009103732A (ja) * 2007-10-19 2009-05-14 Sony Corp 表示装置およびその製造方法
KR101432109B1 (ko) * 2007-10-31 2014-08-22 삼성디스플레이 주식회사 박막 트랜지스터의 제조 방법
KR101485585B1 (ko) 2008-02-14 2015-01-23 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR101392162B1 (ko) * 2008-02-15 2014-05-08 삼성디스플레이 주식회사 표시 기판 및 이의 제조 방법
TWI467663B (zh) 2008-11-07 2015-01-01 半導體能源研究所股份有限公司 半導體裝置和該半導體裝置的製造方法
JP2010249935A (ja) 2009-04-13 2010-11-04 Sony Corp 表示装置
USD633450S1 (en) * 2009-07-28 2011-03-01 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD633054S1 (en) * 2009-07-28 2011-02-22 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD632657S1 (en) * 2009-07-28 2011-02-15 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD633451S1 (en) * 2009-09-25 2011-03-01 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD633057S1 (en) * 2009-09-25 2011-02-22 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD633056S1 (en) * 2009-09-25 2011-02-22 Panasonic Electric Works Co., Ltd. Electro luminescence module
USD633055S1 (en) * 2009-09-25 2011-02-22 Panasonic Electric Works Co., Ltd. Electro luminescence module
KR101638977B1 (ko) * 2009-11-13 2016-07-12 삼성전자주식회사 트랜지스터와 그 제조방법 및 트랜지스터를 포함하는 전자소자
KR101635212B1 (ko) * 2009-12-14 2016-06-30 엘지디스플레이 주식회사 플렉서블 유기발광다이오드 표시장치와 그 제조방법
USD638383S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
JP1437719S (enExample) * 2010-04-09 2015-03-30
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD643820S1 (en) * 2010-04-09 2011-08-23 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD637166S1 (en) * 2010-04-09 2011-05-03 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638382S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638379S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD637165S1 (en) * 2010-04-09 2011-05-03 Panasonic Electric Works Co., Ltd. Electroluminescence module
USD638381S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module
US9178071B2 (en) * 2010-09-13 2015-11-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2013026345A (ja) * 2011-07-19 2013-02-04 Toshiba Corp 半導体装置の製造方法
WO2013080247A1 (ja) 2011-11-29 2013-06-06 パナソニック株式会社 薄膜トランジスタおよび薄膜トランジスタの製造方法
USD742841S1 (en) * 2013-03-26 2015-11-10 Sony Corporation Touch sensitive device
KR102197854B1 (ko) 2014-05-13 2021-01-05 삼성디스플레이 주식회사 박막 트랜지스터, 이를 포함하는 표시기판 및 이의 제조방법
KR102279884B1 (ko) * 2014-12-05 2021-07-22 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 그 제조 방법
KR20190070380A (ko) 2017-12-12 2019-06-21 삼성디스플레이 주식회사 표시 장치
CN111490161A (zh) * 2020-04-24 2020-08-04 电子科技大学 一种有机薄场效应晶体管及其制备方法
CN113327935B (zh) * 2021-05-21 2022-07-12 Tcl华星光电技术有限公司 显示面板及其制备方法

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JPH0548106A (ja) * 1991-02-20 1993-02-26 Alps Electric Co Ltd 薄膜トランジスタ及びその製造方法
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Publication number Priority date Publication date Assignee Title
JPH0548106A (ja) * 1991-02-20 1993-02-26 Alps Electric Co Ltd 薄膜トランジスタ及びその製造方法
US5942767A (en) * 1995-11-21 1999-08-24 Samsung Electronics Co., Ltd. Thin film transistors including silicide layer and multilayer conductive electrodes
US6747288B2 (en) * 2000-03-08 2004-06-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
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US20050161740A1 (en) * 2003-12-15 2005-07-28 Lg.Philips Lcd Co., Ltd. Dual panel-type organic electroluminescent device and method for fabricating the same

Also Published As

Publication number Publication date
JP5352912B2 (ja) 2013-11-27
US20100062574A1 (en) 2010-03-11
US7615867B2 (en) 2009-11-10
KR20070045770A (ko) 2007-05-02
CN1956225B (zh) 2010-08-18
US20070096097A1 (en) 2007-05-03
CN1956225A (zh) 2007-05-02
TW200717818A (en) 2007-05-01
JP2007123906A (ja) 2007-05-17
US8088653B2 (en) 2012-01-03
KR101158896B1 (ko) 2012-06-25

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