TWI405623B - 基板之旋轉處理裝置 - Google Patents

基板之旋轉處理裝置 Download PDF

Info

Publication number
TWI405623B
TWI405623B TW095124312A TW95124312A TWI405623B TW I405623 B TWI405623 B TW I405623B TW 095124312 A TW095124312 A TW 095124312A TW 95124312 A TW95124312 A TW 95124312A TW I405623 B TWI405623 B TW I405623B
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
treatment liquid
processing
lid body
Prior art date
Application number
TW095124312A
Other languages
English (en)
Chinese (zh)
Other versions
TW200702075A (en
Inventor
Yukinobu Nishibe
Hisaaki Miyasako
Yuichi Imaoka
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200702075A publication Critical patent/TW200702075A/zh
Application granted granted Critical
Publication of TWI405623B publication Critical patent/TWI405623B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
TW095124312A 2005-07-11 2006-07-04 基板之旋轉處理裝置 TWI405623B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005202028 2005-07-11
JP2006176729A JP4796902B2 (ja) 2005-07-11 2006-06-27 基板のスピン処理装置

Publications (2)

Publication Number Publication Date
TW200702075A TW200702075A (en) 2007-01-16
TWI405623B true TWI405623B (zh) 2013-08-21

Family

ID=37847983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124312A TWI405623B (zh) 2005-07-11 2006-07-04 基板之旋轉處理裝置

Country Status (4)

Country Link
JP (1) JP4796902B2 (ja)
KR (1) KR101231749B1 (ja)
CN (1) CN1912697B (ja)
TW (1) TWI405623B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI547318B (zh) * 2013-09-25 2016-09-01 Shibaura Mechatronics Corp Rotation processing device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100912702B1 (ko) * 2007-09-18 2009-08-19 세메스 주식회사 기판 처리 장치 및 방법
KR100890615B1 (ko) * 2007-10-08 2009-03-27 세메스 주식회사 기판 세정 장치 및 기판 세정 장치의 세정 방법
KR101055601B1 (ko) * 2011-01-25 2011-08-09 주식회사 쓰리디플러스 기판 제조용 스핀 척
KR101807322B1 (ko) 2011-09-02 2017-12-08 도오꾜오까고오교 가부시끼가이샤 기판 처리 장치
JP6077769B2 (ja) * 2011-09-02 2017-02-08 東京応化工業株式会社 基板処理装置
KR102223763B1 (ko) * 2013-12-27 2021-03-05 세메스 주식회사 기판처리장치 및 방법
KR101776017B1 (ko) * 2015-10-27 2017-09-07 세메스 주식회사 용존 오존 제거 유닛 및 이를 포함하는 기판 처리 장치, 용존 오존 제거 방법, 기판 세정 방법
JP6784546B2 (ja) * 2016-09-08 2020-11-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW564474B (en) * 2001-10-16 2003-12-01 Ebara Corp Substrate processing apparatus
WO2004059709A1 (ja) * 2002-12-26 2004-07-15 Tokyo Electron Limited 塗布処理装置および塗布膜形成方法
JP2004228467A (ja) * 2003-01-27 2004-08-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US20040226655A1 (en) * 2003-03-26 2004-11-18 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
TWI255498B (en) * 2004-03-30 2006-05-21 Dainippon Screen Mfg Substrate treating apparatus
TWI269364B (en) * 2004-09-14 2006-12-21 Dainippon Screen Mfg Substrate holding and rotating apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260338A (ja) * 1996-03-19 1997-10-03 Nippon Steel Corp 回転塗布装置
JP3559228B2 (ja) * 2000-08-07 2004-08-25 住友精密工業株式会社 回転式基板処理装置
JP4759183B2 (ja) * 2000-12-27 2011-08-31 芝浦メカトロニクス株式会社 スピン処理装置
JP2002307005A (ja) * 2001-04-12 2002-10-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3973196B2 (ja) * 2001-12-17 2007-09-12 東京エレクトロン株式会社 液処理方法及び液処理装置
JP2004031400A (ja) * 2002-06-21 2004-01-29 Sipec Corp 基板処理装置及びその処理方法
JP4223293B2 (ja) * 2003-01-20 2009-02-12 大日本スクリーン製造株式会社 基板処理装置
JP4293830B2 (ja) * 2003-05-12 2009-07-08 葵精機株式会社 基板処理装置およびその処理方法
JP2004207755A (ja) * 2004-03-08 2004-07-22 Dainippon Screen Mfg Co Ltd 基板処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW564474B (en) * 2001-10-16 2003-12-01 Ebara Corp Substrate processing apparatus
WO2004059709A1 (ja) * 2002-12-26 2004-07-15 Tokyo Electron Limited 塗布処理装置および塗布膜形成方法
JP2004228467A (ja) * 2003-01-27 2004-08-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US20040226655A1 (en) * 2003-03-26 2004-11-18 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
TWI255498B (en) * 2004-03-30 2006-05-21 Dainippon Screen Mfg Substrate treating apparatus
TWI269364B (en) * 2004-09-14 2006-12-21 Dainippon Screen Mfg Substrate holding and rotating apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI547318B (zh) * 2013-09-25 2016-09-01 Shibaura Mechatronics Corp Rotation processing device

Also Published As

Publication number Publication date
JP2007044686A (ja) 2007-02-22
TW200702075A (en) 2007-01-16
CN1912697B (zh) 2010-09-08
KR20070007725A (ko) 2007-01-16
KR101231749B1 (ko) 2013-02-08
CN1912697A (zh) 2007-02-14
JP4796902B2 (ja) 2011-10-19

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