TWI398459B - 以多環聚合物為主的光敏感性組成物（一） - Google Patents
以多環聚合物為主的光敏感性組成物（一） Download PDFInfo
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- TWI398459B TWI398459B TW097115706A TW97115706A TWI398459B TW I398459 B TWI398459 B TW I398459B TW 097115706 A TW097115706 A TW 097115706A TW 97115706 A TW97115706 A TW 97115706A TW I398459 B TWI398459 B TW I398459B
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- branched
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- cyclic alkyl
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- VGZKCAUAQHHGDK-UHFFFAOYSA-M bis(4-tert-butylphenyl)iodanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 VGZKCAUAQHHGDK-UHFFFAOYSA-M 0.000 description 1
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- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
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- AAWSDNAGOTWUPV-UHFFFAOYSA-N sulfanyloxyethene Chemical compound SOC=C AAWSDNAGOTWUPV-UHFFFAOYSA-N 0.000 description 1
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- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
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- SWLICCIRFBHLJN-UHFFFAOYSA-N tricyclohexylphosphanium;2,2,2-trifluoroacetate Chemical compound [O-]C(=O)C(F)(F)F.C1CCCCC1[PH+](C1CCCCC1)C1CCCCC1 SWLICCIRFBHLJN-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
- C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Materials For Photolithography (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Silicon Polymers (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (2)
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| US39372602P | 2002-07-03 | 2002-07-03 | |
| US10/465,511 US7022790B2 (en) | 2002-07-03 | 2003-06-19 | Photosensitive compositions based on polycyclic polymers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200835710A TW200835710A (en) | 2008-09-01 |
| TWI398459B true TWI398459B (zh) | 2013-06-11 |
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| TW097115706A TWI398459B (zh) | 2002-07-03 | 2003-07-02 | 以多環聚合物為主的光敏感性組成物（一） |
| TW092118096A TWI300167B (en) | 2002-07-03 | 2003-07-02 | Photosensitive compositions based on polycyclic polymers |
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| Application Number | Title | Priority Date | Filing Date |
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| TW092118096A TWI300167B (en) | 2002-07-03 | 2003-07-02 | Photosensitive compositions based on polycyclic polymers |
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|---|---|
| US (2) | US7022790B2 (enExample) |
| EP (1) | EP1532486B1 (enExample) |
| JP (1) | JP4623419B2 (enExample) |
| KR (1) | KR100688632B1 (enExample) |
| CN (2) | CN102298265B (enExample) |
| AT (1) | ATE453135T1 (enExample) |
| AU (1) | AU2003243013A1 (enExample) |
| DE (1) | DE60330672D1 (enExample) |
| MY (1) | MY142759A (enExample) |
| TW (2) | TWI398459B (enExample) |
| WO (1) | WO2004006020A1 (enExample) |
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| US7022790B2 (en) * | 2002-07-03 | 2006-04-04 | Sumitomo Bakelite Company, Ltd. | Photosensitive compositions based on polycyclic polymers |
| US20060020068A1 (en) * | 2004-07-07 | 2006-01-26 | Edmund Elce | Photosensitive compositions based on polycyclic polymers for low stress, high temperature films |
| US7501230B2 (en) * | 2002-11-04 | 2009-03-10 | Meagley Robert P | Photoactive adhesion promoter |
| US6893985B2 (en) * | 2003-03-31 | 2005-05-17 | Intel Corporation | UV-activated dielectric layer |
| JP4759311B2 (ja) * | 2004-05-17 | 2011-08-31 | 富士フイルム株式会社 | パターン形成方法 |
| ATE450813T1 (de) * | 2004-05-17 | 2009-12-15 | Fujifilm Corp | Verfahren zur erzeugung eines musters |
| JP2006096812A (ja) * | 2004-09-28 | 2006-04-13 | Sumitomo Bakelite Co Ltd | 半導体表面保護膜用樹脂組成物、及びそれを用いた半導体装置 |
| JP2006100562A (ja) * | 2004-09-29 | 2006-04-13 | Sumitomo Bakelite Co Ltd | 半導体装置 |
| TW200628981A (en) * | 2004-09-29 | 2006-08-16 | Sumitomo Bakelite Co | Semiconductor device |
| JP2006098949A (ja) * | 2004-09-30 | 2006-04-13 | Sumitomo Bakelite Co Ltd | 半導体装置 |
| JP4556598B2 (ja) * | 2004-09-30 | 2010-10-06 | 住友ベークライト株式会社 | 半導体装置 |
| JP4170277B2 (ja) * | 2004-09-30 | 2008-10-22 | 住友ベークライト株式会社 | 感光性樹脂組成物および半導体装置 |
| JP2006124648A (ja) * | 2004-10-01 | 2006-05-18 | Sumitomo Bakelite Co Ltd | 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板 |
| EP1804296B1 (en) * | 2004-10-13 | 2008-10-01 | Sumitomo Bakelite Co., Ltd. | Light-receiving device |
| TW200619843A (en) * | 2004-10-20 | 2006-06-16 | Sumitomo Bakelite Co | Semiconductor wafer and semiconductor device |
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- 2003-06-24 MY MYPI20032361A patent/MY142759A/en unknown
- 2003-07-02 TW TW097115706A patent/TWI398459B/zh not_active IP Right Cessation
- 2003-07-02 JP JP2004519232A patent/JP4623419B2/ja not_active Expired - Fee Related
- 2003-07-02 KR KR1020047021566A patent/KR100688632B1/ko not_active Expired - Fee Related
- 2003-07-02 CN CN201110146567.6A patent/CN102298265B/zh not_active Expired - Fee Related
- 2003-07-02 TW TW092118096A patent/TWI300167B/zh not_active IP Right Cessation
- 2003-07-02 DE DE60330672T patent/DE60330672D1/de not_active Expired - Lifetime
- 2003-07-02 EP EP03762871A patent/EP1532486B1/en not_active Expired - Lifetime
- 2003-07-02 WO PCT/JP2003/008407 patent/WO2004006020A1/en not_active Ceased
- 2003-07-02 CN CN038158094A patent/CN1666150A/zh active Pending
- 2003-07-02 AU AU2003243013A patent/AU2003243013A1/en not_active Abandoned
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| WO1997033198A1 (en) * | 1996-03-07 | 1997-09-12 | The B.F. Goodrich Company | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
| US6136499A (en) * | 1996-03-07 | 2000-10-24 | The B. F. Goodrich Company | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
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Also Published As
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| WO2004006020A1 (en) | 2004-01-15 |
| TWI300167B (en) | 2008-08-21 |
| AU2003243013A1 (en) | 2004-01-23 |
| TW200412472A (en) | 2004-07-16 |
| MY142759A (en) | 2010-12-31 |
| JP4623419B2 (ja) | 2011-02-02 |
| US20060167197A1 (en) | 2006-07-27 |
| US7022790B2 (en) | 2006-04-04 |
| TW200835710A (en) | 2008-09-01 |
| EP1532486A1 (en) | 2005-05-25 |
| CN102298265B (zh) | 2014-04-16 |
| CN102298265A (zh) | 2011-12-28 |
| ATE453135T1 (de) | 2010-01-15 |
| JP2005531680A (ja) | 2005-10-20 |
| US8114948B2 (en) | 2012-02-14 |
| US20040039153A1 (en) | 2004-02-26 |
| KR100688632B1 (ko) | 2007-03-02 |
| CN1666150A (zh) | 2005-09-07 |
| DE60330672D1 (de) | 2010-02-04 |
| EP1532486B1 (en) | 2009-12-23 |
| KR20050033565A (ko) | 2005-04-12 |
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