TWI397120B - 用於蝕刻一基材的設備與方法 - Google Patents

用於蝕刻一基材的設備與方法 Download PDF

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Publication number
TWI397120B
TWI397120B TW096102856A TW96102856A TWI397120B TW I397120 B TWI397120 B TW I397120B TW 096102856 A TW096102856 A TW 096102856A TW 96102856 A TW96102856 A TW 96102856A TW I397120 B TWI397120 B TW I397120B
Authority
TW
Taiwan
Prior art keywords
bubble
etching
glass substrates
substrate
gas
Prior art date
Application number
TW096102856A
Other languages
English (en)
Chinese (zh)
Other versions
TW200741850A (en
Inventor
金景滿
Original Assignee
三星顯示器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星顯示器有限公司 filed Critical 三星顯示器有限公司
Publication of TW200741850A publication Critical patent/TW200741850A/zh
Application granted granted Critical
Publication of TWI397120B publication Critical patent/TWI397120B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Liquid Crystal (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
TW096102856A 2006-04-27 2007-01-25 用於蝕刻一基材的設備與方法 TWI397120B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060038222A KR20070105699A (ko) 2006-04-27 2006-04-27 기판 식각 장치 및 이를 이용한 기판 식각 방법

Publications (2)

Publication Number Publication Date
TW200741850A TW200741850A (en) 2007-11-01
TWI397120B true TWI397120B (zh) 2013-05-21

Family

ID=38769293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102856A TWI397120B (zh) 2006-04-27 2007-01-25 用於蝕刻一基材的設備與方法

Country Status (4)

Country Link
JP (1) JP4980783B2 (https=)
KR (1) KR20070105699A (https=)
CN (1) CN101062837B (https=)
TW (1) TWI397120B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101375848B1 (ko) 2006-12-08 2014-03-18 (주)스마트에이스 기판식각장치 및 이를 이용한 액정표시소자 제조라인
KR100860294B1 (ko) * 2008-01-09 2008-09-25 주식회사 이코니 유리기판 에칭 장치와 상기 에칭 장치에 의하여 제조된유리박판
KR100911598B1 (ko) * 2008-01-09 2009-08-07 주식회사 실트론 버블 발생유닛 및 이를 포함하는 웨이퍼 에칭 장치
KR101304103B1 (ko) * 2011-10-17 2013-09-05 호서대학교 산학협력단 초박형 글래스판 제조 방법
KR101151296B1 (ko) * 2012-02-03 2012-06-08 주식회사 엠엠테크 기판 에칭 장치
CN103508675B (zh) * 2012-06-28 2016-09-14 Sti有限公司 用于玻璃蚀刻装置的气泡生成器
KR101404236B1 (ko) * 2013-03-13 2014-06-05 박경용 글라스 기판 식각장치 및 방법
CN104445975A (zh) * 2014-12-01 2015-03-25 欧浦登（顺昌）光学有限公司 一种玻璃局部防眩加工工艺及其产品
CN104891817B (zh) * 2015-06-09 2017-05-03 武汉华星光电技术有限公司 浸泡式玻璃基板蚀刻机
CN106356322A (zh) * 2016-10-20 2017-01-25 北方电子研究院安徽有限公司 一种晶圆腐蚀装置以及腐蚀方法
CN107357094B (zh) * 2017-08-16 2020-06-05 武汉华星光电技术有限公司 液晶滴下装置及液晶喷洒装置
JP6971124B2 (ja) * 2017-10-24 2021-11-24 東京エレクトロン株式会社 基板処理装置
CN108417509A (zh) * 2018-01-29 2018-08-17 九江维信诺科技有限公司 片材刻蚀装置
JP7176904B2 (ja) * 2018-09-21 2022-11-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR101999548B1 (ko) * 2019-02-28 2019-07-12 제일유리 주식회사 유리표면 처리장치
KR101976069B1 (ko) * 2019-03-06 2019-05-07 주식회사 삼성플랜텍 공기공급부를 가지는 판유리 적재용 지그
KR101994320B1 (ko) * 2019-03-11 2019-09-30 주식회사 삼성플랜텍 생산수율이 대폭 향상되는 화학강화 유리 제조장치
KR101995324B1 (ko) * 2019-03-12 2019-10-02 정창수 공기공급부를 가지는 원형 배치타입의 화학강화 유리 제조장치
JP7467233B2 (ja) * 2020-05-26 2024-04-15 東京エレクトロン株式会社 基板処理装置
JP7461269B2 (ja) * 2020-10-09 2024-04-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7716349B2 (ja) * 2022-01-28 2025-07-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN114899131A (zh) * 2022-06-09 2022-08-12 扬州赛诺高德电子科技有限公司 一种微小气泡辅助蚀刻加工装置以及方法
CN117945663B (zh) * 2024-02-04 2025-07-18 赛德半导体有限公司 一种湿法蚀刻设备

Citations (6)

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Publication number Priority date Publication date Assignee Title
TW543113B (en) * 2002-09-20 2003-07-21 Sti Co Ltd Auto-etching unit and method for TFT-LCD glass substrate
US20030190815A1 (en) * 1996-06-26 2003-10-09 Kim Woong Kwon Apparatus for etching glass substrate
TW200511412A (en) * 2003-06-19 2005-03-16 Samsung Electronics Co Ltd Substrate treatment apparatus
KR20050064377A (ko) * 2003-12-23 2005-06-29 엘지.필립스 엘시디 주식회사 버블판을 포함하는 식각장치 및 이를 이용한 식각 방법
JP2005211718A (ja) * 2004-01-27 2005-08-11 Dainippon Screen Mfg Co Ltd 基板処理装置
TW200531945A (en) * 2004-03-17 2005-10-01 Nishiyama Stainless Chemical Co Ltd Glass plate surface etching method, glass plate etching apparatus, glass plate for flat panel display, and flat panel display

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Publication number Priority date Publication date Assignee Title
JPS62119543A (ja) * 1985-11-20 1987-05-30 Mitsubishi Electric Corp 半導体製造装置
JP2522805B2 (ja) * 1987-11-20 1996-08-07 三井石油化学工業株式会社 洗浄方法
JP3183214B2 (ja) * 1997-05-26 2001-07-09 日本電気株式会社 洗浄方法および洗浄装置
US6911097B1 (en) * 2000-07-31 2005-06-28 Taiwan Semiconductor Manufacturing Company Photoresist stripper using nitrogen bubbler
AU2002950934A0 (en) * 2002-08-21 2002-09-12 U. S. Filter Wastewater Group, Inc. Aeration method
JP2006216742A (ja) * 2005-02-03 2006-08-17 Renesas Technology Corp 洗浄装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030190815A1 (en) * 1996-06-26 2003-10-09 Kim Woong Kwon Apparatus for etching glass substrate
TW543113B (en) * 2002-09-20 2003-07-21 Sti Co Ltd Auto-etching unit and method for TFT-LCD glass substrate
TW200511412A (en) * 2003-06-19 2005-03-16 Samsung Electronics Co Ltd Substrate treatment apparatus
KR20050064377A (ko) * 2003-12-23 2005-06-29 엘지.필립스 엘시디 주식회사 버블판을 포함하는 식각장치 및 이를 이용한 식각 방법
JP2005211718A (ja) * 2004-01-27 2005-08-11 Dainippon Screen Mfg Co Ltd 基板処理装置
TW200531945A (en) * 2004-03-17 2005-10-01 Nishiyama Stainless Chemical Co Ltd Glass plate surface etching method, glass plate etching apparatus, glass plate for flat panel display, and flat panel display

Also Published As

Publication number Publication date
JP4980783B2 (ja) 2012-07-18
JP2007300118A (ja) 2007-11-15
CN101062837A (zh) 2007-10-31
CN101062837B (zh) 2012-09-05
TW200741850A (en) 2007-11-01
KR20070105699A (ko) 2007-10-31

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