TW200741850A - Apparatus and method for etching a substrate - Google Patents

Apparatus and method for etching a substrate

Info

Publication number
TW200741850A
TW200741850A TW096102856A TW96102856A TW200741850A TW 200741850 A TW200741850 A TW 200741850A TW 096102856 A TW096102856 A TW 096102856A TW 96102856 A TW96102856 A TW 96102856A TW 200741850 A TW200741850 A TW 200741850A
Authority
TW
Taiwan
Prior art keywords
glass substrates
air bubble
etching container
etching
injectors
Prior art date
Application number
TW096102856A
Other languages
Chinese (zh)
Other versions
TWI397120B (en
Inventor
Kyong-Man Kim
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200741850A publication Critical patent/TW200741850A/en
Application granted granted Critical
Publication of TWI397120B publication Critical patent/TWI397120B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Surface Treatment Of Glass (AREA)
  • Liquid Crystal (AREA)
  • Weting (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

An apparatus includes an etching container, a plurality of air bubble injectors and a gas supplying part. The etching container receives a plurality of glass substrates are disposed perpendicular to a bottom of the etching container and are parallel with each other in the etching container. Each of the air bubble injectors is interposed among each of the glass substrates for injecting air bubble onto the glass substrates. The gas supplying part is disposed outside of the etching container for supplying a gas to the air bubble injectors. Therefore, the air bubble may be uniformly injected onto the glass substrates so that the glass substrates may be uniformly etched.
TW96102856A 2006-04-27 2007-01-25 Apparatus and method for etching a substrate TWI397120B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060038222A KR20070105699A (en) 2006-04-27 2006-04-27 Etching apparatus for glass plate and method of glass etching using the same

Publications (2)

Publication Number Publication Date
TW200741850A true TW200741850A (en) 2007-11-01
TWI397120B TWI397120B (en) 2013-05-21

Family

ID=38769293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96102856A TWI397120B (en) 2006-04-27 2007-01-25 Apparatus and method for etching a substrate

Country Status (4)

Country Link
JP (1) JP4980783B2 (en)
KR (1) KR20070105699A (en)
CN (1) CN101062837B (en)
TW (1) TWI397120B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489574B (en) * 2012-02-03 2015-06-21 Mm Tech Co Ltd Apparatus for etching substrate

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101375848B1 (en) * 2006-12-08 2014-03-18 (주)스마트에이스 Apparatus for etching substratee and fabrication line for fabricating liquid crystal display device using thereof
KR100911598B1 (en) * 2008-01-09 2009-08-07 주식회사 실트론 Bubble generation unit and substrate etching apparatus including the same
KR100860294B1 (en) * 2008-01-09 2008-09-25 주식회사 이코니 An apparatus for etching a glass wafer, and a glass sheet manufactured by the same
KR101304103B1 (en) * 2011-10-17 2013-09-05 호서대학교 산학협력단 Method for manufacturing ultra-thin type glass plate
CN103508675B (en) * 2012-06-28 2016-09-14 Sti有限公司 Bubble generator for glass etching device
KR101404236B1 (en) * 2013-03-13 2014-06-05 박경용 Apparatus and method for etching glass substrate
CN104445975A (en) * 2014-12-01 2015-03-25 欧浦登（顺昌）光学有限公司 Locally anti-dazzle processing process of glass and product thereof
CN104891817B (en) * 2015-06-09 2017-05-03 武汉华星光电技术有限公司 Soaking type etching machine for glass substrate
CN105225992B (en) * 2015-11-03 2018-08-24 株洲南车时代电气股份有限公司 A kind of etching device and wafer single side lithographic method
CN106356322A (en) * 2016-10-20 2017-01-25 北方电子研究院安徽有限公司 Wafer corrosion device and corrosion method
CN107357094B (en) * 2017-08-16 2020-06-05 武汉华星光电技术有限公司 Liquid crystal dripping device and liquid crystal spraying device
CN108417509A (en) * 2018-01-29 2018-08-17 九江维信诺科技有限公司 Sheet material etching device
JP7176904B2 (en) 2018-09-21 2022-11-22 株式会社Ｓｃｒｅｅｎホールディングス SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
KR101999548B1 (en) * 2019-02-28 2019-07-12 제일유리 주식회사 Apparauts for surface of glass
KR101976069B1 (en) * 2019-03-06 2019-05-07 주식회사 삼성플랜텍 Jig for mounting a plate glass having an air supply part
KR101994320B1 (en) * 2019-03-11 2019-09-30 주식회사 삼성플랜텍 Tempered glass manufacturing apparatus with greatly improved production yield
KR101995324B1 (en) * 2019-03-12 2019-10-02 정창수 Circular arrangement type tempered glass manufacturing apparatus having a jig having a hook formed therein
JP7461269B2 (en) 2020-10-09 2024-04-03 株式会社Ｓｃｒｅｅｎホールディングス Substrate Processing Equipment

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62119543A (en) * 1985-11-20 1987-05-30 Mitsubishi Electric Corp Apparatus for producing semiconductor
JP2522805B2 (en) * 1987-11-20 1996-08-07 三井石油化学工業株式会社 Cleaning method
US6630052B1 (en) * 1996-06-26 2003-10-07 Lg. Philips Lcd Co., Ltd. Apparatus for etching glass substrate
JP3183214B2 (en) * 1997-05-26 2001-07-09 日本電気株式会社 Cleaning method and cleaning device
US6911097B1 (en) * 2000-07-31 2005-06-28 Taiwan Semiconductor Manufacturing Company Photoresist stripper using nitrogen bubbler
AU2002950934A0 (en) * 2002-08-21 2002-09-12 U. S. Filter Wastewater Group, Inc. Aeration method
TW543113B (en) * 2002-09-20 2003-07-21 Sti Co Ltd Auto-etching unit and method for TFT-LCD glass substrate
KR20040110391A (en) * 2003-06-19 2004-12-31 삼성전자주식회사 substrate treatment apparatus
KR20050064377A (en) * 2003-12-23 2005-06-29 엘지.필립스 엘시디 주식회사 Apparatus for etching including bubble plate and etching method using thereof
JP2005211718A (en) * 2004-01-27 2005-08-11 Dainippon Screen Mfg Co Ltd Substrate treatment apparatus
JP4071220B2 (en) * 2004-03-17 2008-04-02 西山ステンレスケミカル株式会社 Manufacturing method of glass substrate
JP2006216742A (en) * 2005-02-03 2006-08-17 Renesas Technology Corp Washer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489574B (en) * 2012-02-03 2015-06-21 Mm Tech Co Ltd Apparatus for etching substrate

Also Published As

Publication number Publication date
JP2007300118A (en) 2007-11-15
CN101062837B (en) 2012-09-05
JP4980783B2 (en) 2012-07-18
KR20070105699A (en) 2007-10-31
CN101062837A (en) 2007-10-31
TWI397120B (en) 2013-05-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees