JP2007300118A5 - - Google Patents
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- JP2007300118A5 JP2007300118A5 JP2007119098A JP2007119098A JP2007300118A5 JP 2007300118 A5 JP2007300118 A5 JP 2007300118A5 JP 2007119098 A JP2007119098 A JP 2007119098A JP 2007119098 A JP2007119098 A JP 2007119098A JP 2007300118 A5 JP2007300118 A5 JP 2007300118A5
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- JP
- Japan
- Prior art keywords
- substrate
- bubble
- etching
- glass substrate
- injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (10)
前記エッチング容器に収容されたガラス基板に、それぞれの前記ガラス基板の間に介在して気泡を噴射する気泡噴射器と、
前記エッチング容器の外部に配置され前記気泡噴射器にガスを供給するガス供給器とを含む基板エッチング装置。 An etching container for accommodating a plurality of glass substrates arranged in parallel to each other perpendicular to the bottom, and
A bubble injector for injecting bubbles between the glass substrates on the glass substrate accommodated in the etching container,
A substrate etching apparatus including a gas supply device that is disposed outside the etching container and supplies gas to the bubble injector.
内部にガス通路部が形成されている噴射板と、
前記噴射板の前記ガラス基板と向き合う面に形成され、前記ガス通路部と連結されている複数の噴射ノズルとを有する請求項1に記載の基板エッチング装置。 The bubble injector
An injection plate having a gas passage formed therein;
The substrate etching apparatus according to claim 1, further comprising: a plurality of spray nozzles formed on a surface of the spray plate facing the glass substrate and connected to the gas passage portion.
中央に開口部が形成されているフレームと、
前記フレームの内部に配置され、前記ガス供給器と連結されている第1チューブと、
一定の間隔で前記第1チューブと連結され前記開口部を縦断していて、前記それぞれのガラス基板と向き合う面に対応して形成されている複数の噴射口を備える第2チューブとを有する請求項1に記載の基板エッチング装置。 The bubble injector
A frame having an opening in the center;
A first tube disposed within the frame and connected to the gas supply;
A second tube having a plurality of injection ports that are connected to the first tube at regular intervals and vertically cut through the opening, and are formed corresponding to surfaces facing the glass substrates. 2. The substrate etching apparatus according to 1.
それぞれの前記ガラス基板の間に介在されるように気泡噴射器を配置する段階と、
前記エッチング容器外部に配置されたガス供給器から前記気泡噴射器にガスを供給する段階と、
前記気泡噴射器が前記ガラス基板に気泡を噴射して不純物を除去する段階とを含む基板エッチング方法。 Arranging a plurality of glass substrates arranged parallel to each other perpendicular to the bottom plate of the etching vessel;
Placing a bubble injector to be interposed between each of the glass substrates;
Supplying gas from the gas supply device disposed outside the etching container to the bubble injector;
A substrate etching method including: a step of ejecting bubbles onto the glass substrate to remove impurities.
前記エッチング容器に収容されたガラス基板の配置方向とその長手方向が一致するように配置され前記ガラス基板に気泡を噴射する気泡噴射管と、
前記エッチング容器の外部に配置され前記気泡噴射管にガスを供給するガス供給器とを含む基板エッチング装置。 An etching container that houses a plurality of glass substrates arranged in parallel to each other and parallel to the bottom plate;
A bubble injection tube that is arranged so that the arrangement direction of the glass substrate accommodated in the etching container and the longitudinal direction thereof coincide with each other and injects bubbles to the glass substrate,
A substrate etching apparatus comprising: a gas supply device that is disposed outside the etching container and supplies gas to the bubble jet tube.
前記ガラス基板を挟んで2つの気泡噴射管を配置する段階と、
前記気泡噴射管を前記ガラス基板の配置方向と交差する方向に移動させながら前記ガラス基板に気泡を噴射して不純物を除去する段階とを含む基板エッチング方法。 Arranging a plurality of glass substrates arranged parallel to each other perpendicularly to the bottom of the etching vessel;
Placing two bubble jet tubes across the glass substrate;
And a step of removing impurities by ejecting bubbles to the glass substrate while moving the bubble injection tube in a direction intersecting with the direction of arrangement of the glass substrate.
The substrate etching method according to claim 9, wherein the bubble jet tubes move at the same speed.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060038222A KR20070105699A (en) | 2006-04-27 | 2006-04-27 | Etching apparatus for glass plate and method of glass etching using the same |
KR10-2006-0038222 | 2006-04-27 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007300118A JP2007300118A (en) | 2007-11-15 |
JP2007300118A5 true JP2007300118A5 (en) | 2010-05-27 |
JP4980783B2 JP4980783B2 (en) | 2012-07-18 |
Family
ID=38769293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007119098A Expired - Fee Related JP4980783B2 (en) | 2006-04-27 | 2007-04-27 | Substrate etching apparatus and substrate etching method using the same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4980783B2 (en) |
KR (1) | KR20070105699A (en) |
CN (1) | CN101062837B (en) |
TW (1) | TWI397120B (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101375848B1 (en) | 2006-12-08 | 2014-03-18 | (주)스마트에이스 | Apparatus for etching substratee and fabrication line for fabricating liquid crystal display device using thereof |
KR100860294B1 (en) * | 2008-01-09 | 2008-09-25 | 주식회사 이코니 | An apparatus for etching a glass wafer, and a glass sheet manufactured by the same |
KR100911598B1 (en) * | 2008-01-09 | 2009-08-07 | 주식회사 실트론 | Bubble generation unit and substrate etching apparatus including the same |
KR101304103B1 (en) * | 2011-10-17 | 2013-09-05 | 호서대학교 산학협력단 | Method for manufacturing ultra-thin type glass plate |
KR101151296B1 (en) * | 2012-02-03 | 2012-06-08 | 주식회사 엠엠테크 | Apparatus for etching substrate |
CN103508675B (en) * | 2012-06-28 | 2016-09-14 | Sti有限公司 | Bubble generator for glass etching device |
KR101404236B1 (en) * | 2013-03-13 | 2014-06-05 | 박경용 | Apparatus and method for etching glass substrate |
CN104445975A (en) * | 2014-12-01 | 2015-03-25 | 欧浦登(顺昌)光学有限公司 | Locally anti-dazzle processing process of glass and product thereof |
CN104891817B (en) * | 2015-06-09 | 2017-05-03 | 武汉华星光电技术有限公司 | Soaking type etching machine for glass substrate |
CN105225992B (en) * | 2015-11-03 | 2018-08-24 | 株洲南车时代电气股份有限公司 | A kind of etching device and wafer single side lithographic method |
CN106356322A (en) * | 2016-10-20 | 2017-01-25 | 北方电子研究院安徽有限公司 | Wafer corrosion device and corrosion method |
CN107357094B (en) * | 2017-08-16 | 2020-06-05 | 武汉华星光电技术有限公司 | Liquid crystal dripping device and liquid crystal spraying device |
CN108417509A (en) * | 2018-01-29 | 2018-08-17 | 九江维信诺科技有限公司 | Sheet material etching device |
JP7176904B2 (en) | 2018-09-21 | 2022-11-22 | 株式会社Screenホールディングス | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
KR101999548B1 (en) * | 2019-02-28 | 2019-07-12 | 제일유리 주식회사 | Apparauts for surface of glass |
KR101976069B1 (en) * | 2019-03-06 | 2019-05-07 | 주식회사 삼성플랜텍 | Jig for mounting a plate glass having an air supply part |
KR101994320B1 (en) * | 2019-03-11 | 2019-09-30 | 주식회사 삼성플랜텍 | Tempered glass manufacturing apparatus with greatly improved production yield |
KR101995324B1 (en) * | 2019-03-12 | 2019-10-02 | 정창수 | Circular arrangement type tempered glass manufacturing apparatus having a jig having a hook formed therein |
JP7461269B2 (en) | 2020-10-09 | 2024-04-03 | 株式会社Screenホールディングス | Substrate Processing Equipment |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62119543A (en) * | 1985-11-20 | 1987-05-30 | Mitsubishi Electric Corp | Apparatus for producing semiconductor |
JP2522805B2 (en) * | 1987-11-20 | 1996-08-07 | 三井石油化学工業株式会社 | Cleaning method |
US6630052B1 (en) * | 1996-06-26 | 2003-10-07 | Lg. Philips Lcd Co., Ltd. | Apparatus for etching glass substrate |
JP3183214B2 (en) * | 1997-05-26 | 2001-07-09 | 日本電気株式会社 | Cleaning method and cleaning device |
US6911097B1 (en) * | 2000-07-31 | 2005-06-28 | Taiwan Semiconductor Manufacturing Company | Photoresist stripper using nitrogen bubbler |
AU2002950934A0 (en) * | 2002-08-21 | 2002-09-12 | U. S. Filter Wastewater Group, Inc. | Aeration method |
TW543113B (en) * | 2002-09-20 | 2003-07-21 | Sti Co Ltd | Auto-etching unit and method for TFT-LCD glass substrate |
KR20040110391A (en) * | 2003-06-19 | 2004-12-31 | 삼성전자주식회사 | substrate treatment apparatus |
KR20050064377A (en) * | 2003-12-23 | 2005-06-29 | 엘지.필립스 엘시디 주식회사 | Apparatus for etching including bubble plate and etching method using thereof |
JP2005211718A (en) * | 2004-01-27 | 2005-08-11 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
JP4071220B2 (en) * | 2004-03-17 | 2008-04-02 | 西山ステンレスケミカル株式会社 | Manufacturing method of glass substrate |
JP2006216742A (en) * | 2005-02-03 | 2006-08-17 | Renesas Technology Corp | Washer |
-
2006
- 2006-04-27 KR KR1020060038222A patent/KR20070105699A/en not_active Application Discontinuation
-
2007
- 2007-01-25 TW TW96102856A patent/TWI397120B/en not_active IP Right Cessation
- 2007-01-29 CN CN2007100077287A patent/CN101062837B/en not_active Expired - Fee Related
- 2007-04-27 JP JP2007119098A patent/JP4980783B2/en not_active Expired - Fee Related
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