TWI384326B - Alkaline developing resin composition - Google Patents
Alkaline developing resin composition Download PDFInfo
- Publication number
- TWI384326B TWI384326B TW095116579A TW95116579A TWI384326B TW I384326 B TWI384326 B TW I384326B TW 095116579 A TW095116579 A TW 095116579A TW 95116579 A TW95116579 A TW 95116579A TW I384326 B TWI384326 B TW I384326B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- compound
- resin composition
- alkali
- carbon atoms
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005138282A JP4641861B2 (ja) | 2005-05-11 | 2005-05-11 | アルカリ現像性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200702921A TW200702921A (en) | 2007-01-16 |
TWI384326B true TWI384326B (zh) | 2013-02-01 |
Family
ID=37538325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095116579A TWI384326B (zh) | 2005-05-11 | 2006-05-10 | Alkaline developing resin composition |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4641861B2 (ja) |
KR (1) | KR101236851B1 (ja) |
CN (1) | CN1896871B (ja) |
TW (1) | TWI384326B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101528693B (zh) * | 2006-12-20 | 2014-07-02 | 三菱化学株式会社 | 肟酯系化合物、光聚合引发剂、光聚合性组合物、滤色器和液晶显示装置 |
JP5844267B2 (ja) * | 2010-09-22 | 2016-01-13 | 株式会社Adeka | 染料及び着色感光性組成物 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06228252A (ja) * | 1993-02-03 | 1994-08-16 | Nippon Shokubai Co Ltd | 液状感光性樹脂組成物 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3148429B2 (ja) * | 1992-02-04 | 2001-03-19 | 新日本製鐵株式会社 | 光重合性不飽和化合物及びアルカリ現像型感光性樹脂組成物 |
JP3274545B2 (ja) * | 1993-07-16 | 2002-04-15 | 株式会社日本触媒 | 液状感光性樹脂組成物 |
EP0728788B1 (en) * | 1994-09-14 | 2006-02-15 | Nippon Shokubai Co., Ltd. | Process for producing photosensitive resin and liquid photosensitive resin composition |
JP3156559B2 (ja) * | 1994-09-14 | 2001-04-16 | 株式会社日本触媒 | 感光性樹脂の製造方法および液状感光性樹脂組成物 |
JPH08208805A (ja) * | 1995-01-30 | 1996-08-13 | Asahi Denka Kogyo Kk | ポリオール樹脂組成物 |
JP3686699B2 (ja) * | 1995-03-31 | 2005-08-24 | 太陽インキ製造株式会社 | アルカリ現像型の光硬化性・熱硬化性樹脂組成物 |
JP3496674B2 (ja) * | 1997-11-28 | 2004-02-16 | 日立化成工業株式会社 | 光硬化性樹脂組成物及びこれを用いた感光性エレメント |
JP3541136B2 (ja) * | 1997-12-19 | 2004-07-07 | 太陽インキ製造株式会社 | アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜 |
JP3659825B2 (ja) * | 1997-12-19 | 2005-06-15 | 太陽インキ製造株式会社 | アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜 |
US6727042B2 (en) * | 2000-01-17 | 2004-04-27 | Showa Highpolymer Co., Ltd. | Photosensitive resin composition |
AU2001286239A1 (en) * | 2000-09-16 | 2002-04-02 | Goo Chemical Co., Ltd. | Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
JP3996802B2 (ja) * | 2002-05-15 | 2007-10-24 | 太陽インキ製造株式会社 | 低放射線性の光硬化性・熱硬化性樹脂組成物及びその硬化被膜 |
JP2004359890A (ja) * | 2003-06-06 | 2004-12-24 | Japan U-Pica Co Ltd | 光硬化性樹脂組成物及び感光性熱硬化性樹脂組成物並びにその硬化物 |
KR101169822B1 (ko) * | 2004-09-17 | 2012-07-30 | 가부시키가이샤 아데카 | 착색 알칼리 현상성 감광성 수지조성물 및 상기 착색 알칼리 현상성 감광성 수지조성물을 이용한 컬러필터 |
-
2005
- 2005-05-11 JP JP2005138282A patent/JP4641861B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-10 CN CN2006100798271A patent/CN1896871B/zh not_active Expired - Fee Related
- 2006-05-10 KR KR1020060042121A patent/KR101236851B1/ko not_active IP Right Cessation
- 2006-05-10 TW TW095116579A patent/TWI384326B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06228252A (ja) * | 1993-02-03 | 1994-08-16 | Nippon Shokubai Co Ltd | 液状感光性樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
CN1896871A (zh) | 2007-01-17 |
CN1896871B (zh) | 2013-06-12 |
KR20060116744A (ko) | 2006-11-15 |
JP4641861B2 (ja) | 2011-03-02 |
KR101236851B1 (ko) | 2013-02-26 |
JP2006317574A (ja) | 2006-11-24 |
TW200702921A (en) | 2007-01-16 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |