TWI378571B - Thin film semiconductor component and component combination - Google Patents

Thin film semiconductor component and component combination Download PDF

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Publication number
TWI378571B
TWI378571B TW096128339A TW96128339A TWI378571B TW I378571 B TWI378571 B TW I378571B TW 096128339 A TW096128339 A TW 096128339A TW 96128339 A TW96128339 A TW 96128339A TW I378571 B TWI378571 B TW I378571B
Authority
TW
Taiwan
Prior art keywords
layer
thin film
film semiconductor
semiconductor device
heat dissipation
Prior art date
Application number
TW096128339A
Other languages
English (en)
Chinese (zh)
Other versions
TW200816524A (en
Inventor
Berthold Hahn
Siegfried Herrmann
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of TW200816524A publication Critical patent/TW200816524A/zh
Application granted granted Critical
Publication of TWI378571B publication Critical patent/TWI378571B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00

Landscapes

  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
TW096128339A 2006-08-04 2007-08-02 Thin film semiconductor component and component combination TWI378571B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006036543 2006-08-04
DE102007004303A DE102007004303A1 (de) 2006-08-04 2007-01-29 Dünnfilm-Halbleiterbauelement und Bauelement-Verbund

Publications (2)

Publication Number Publication Date
TW200816524A TW200816524A (en) 2008-04-01
TWI378571B true TWI378571B (en) 2012-12-01

Family

ID=38596017

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096128339A TWI378571B (en) 2006-08-04 2007-08-02 Thin film semiconductor component and component combination

Country Status (8)

Country Link
US (1) US8872330B2 (enExample)
EP (1) EP2047525A2 (enExample)
JP (1) JP5517616B2 (enExample)
KR (1) KR101386303B1 (enExample)
CN (1) CN101542752B (enExample)
DE (1) DE102007004303A1 (enExample)
TW (1) TWI378571B (enExample)
WO (1) WO2008014750A2 (enExample)

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KR101386303B1 (ko) 2014-04-17
CN101542752A (zh) 2009-09-23
TW200816524A (en) 2008-04-01
US20100163915A1 (en) 2010-07-01
DE102007004303A1 (de) 2008-02-07
US8872330B2 (en) 2014-10-28
WO2008014750A2 (de) 2008-02-07
JP5517616B2 (ja) 2014-06-11
CN101542752B (zh) 2014-01-22
WO2008014750A3 (de) 2008-06-12
EP2047525A2 (de) 2009-04-15
JP2009545863A (ja) 2009-12-24
KR20090035040A (ko) 2009-04-08

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