TWI374473B - - Google Patents
Download PDFInfo
- Publication number
- TWI374473B TWI374473B TW093121036A TW93121036A TWI374473B TW I374473 B TWI374473 B TW I374473B TW 093121036 A TW093121036 A TW 093121036A TW 93121036 A TW93121036 A TW 93121036A TW I374473 B TWI374473 B TW I374473B
- Authority
- TW
- Taiwan
- Prior art keywords
- casing
- cover
- cover members
- vacuum container
- vacuum
- Prior art date
Links
- 238000007789 sealing Methods 0.000 claims description 54
- 230000007246 mechanism Effects 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 32
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 229920005668 polycarbonate resin Polymers 0.000 claims description 4
- 239000004431 polycarbonate resin Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 description 22
- 238000003825 pressing Methods 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Pressure Vessels And Lids Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003291989A JP4285642B2 (ja) | 2003-08-12 | 2003-08-12 | 真空容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200518176A TW200518176A (en) | 2005-06-01 |
| TWI374473B true TWI374473B (ko) | 2012-10-11 |
Family
ID=34369481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093121036A TW200518176A (en) | 2003-08-12 | 2004-07-14 | Vacuum container |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4285642B2 (ko) |
| KR (1) | KR100634902B1 (ko) |
| CN (1) | CN1324649C (ko) |
| TW (1) | TW200518176A (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7695232B2 (en) * | 2006-06-15 | 2010-04-13 | Applied Materials, Inc. | Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same |
| JP5601571B2 (ja) * | 2010-05-25 | 2014-10-08 | 新東工業株式会社 | 鋳型造型装置におけるサンドタンクの砂供給口開閉装置 |
| JP5585238B2 (ja) * | 2010-06-24 | 2014-09-10 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP5575558B2 (ja) * | 2010-06-30 | 2014-08-20 | 東京エレクトロン株式会社 | 処理装置 |
| JP5577185B2 (ja) * | 2010-08-06 | 2014-08-20 | 株式会社アルバック | 真空処理装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3287670B2 (ja) * | 1993-11-25 | 2002-06-04 | キヤノン株式会社 | 画像形成装置 |
-
2003
- 2003-08-12 JP JP2003291989A patent/JP4285642B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-14 TW TW093121036A patent/TW200518176A/zh not_active IP Right Cessation
- 2004-08-10 CN CNB2004100700594A patent/CN1324649C/zh not_active Expired - Lifetime
- 2004-08-11 KR KR1020040063228A patent/KR100634902B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| CN1324649C (zh) | 2007-07-04 |
| CN1581433A (zh) | 2005-02-16 |
| JP4285642B2 (ja) | 2009-06-24 |
| KR100634902B1 (ko) | 2006-10-17 |
| TW200518176A (en) | 2005-06-01 |
| KR20050016229A (ko) | 2005-02-21 |
| JP2005064213A (ja) | 2005-03-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |