KR100634902B1 - 진공 용기 - Google Patents
진공 용기 Download PDFInfo
- Publication number
- KR100634902B1 KR100634902B1 KR1020040063228A KR20040063228A KR100634902B1 KR 100634902 B1 KR100634902 B1 KR 100634902B1 KR 1020040063228 A KR1020040063228 A KR 1020040063228A KR 20040063228 A KR20040063228 A KR 20040063228A KR 100634902 B1 KR100634902 B1 KR 100634902B1
- Authority
- KR
- South Korea
- Prior art keywords
- housing
- cover
- opening
- vacuum
- cover body
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Pressure Vessels And Lids Thereof (AREA)
Abstract
Description
Claims (8)
- 하우징과, 이 하우징의 상단 개구부로부터 내부를 밀봉하는 개폐 가능한 커버체를 구비한 진공 용기에 있어서,상기 커버체를 복수의 커버 부재로 분할하는 동시에, 이러한 커버 부재와 상기 하우징의 상단 사이에 밀봉 보조 부재를 개재하고,상기 하우징과 상기 밀봉 보조 부재 사이에 그리고 상기 각 커버 부재와 상기 밀봉 보조 부재 사이에 각각 밀봉 부재를 개재하고,상기 하우징이 한 변이 적어도 1500㎜ 이상의 직사각형 형상으로서 형성되고,상기 밀봉 보조 부재는 상기 하우징의 상단면에 접촉하는 제 1 접촉부와, 제 1 접촉부와 일체화하고 또한 상기 하우징의 상단 개구부에서 상기 각 커버 부재와 접촉하는 제 2 접촉부를 갖는 것을 특징으로 하는진공 용기.
- 삭제
- 제 1 항에 있어서,상기 하우징의 상단 개구부에 상기 각 커버 부재를 지지하는 지지 부재를 가설한 것을 특징으로 하는진공 용기.
- 제 1 항에 있어서,상기 밀봉 보조 부재와 상기 지지 부재를 일체화한 것을 특징으로 하는진공 용기.
- 제 1 항에 있어서,상기 밀봉 보조 부재 및 상기 커버체중 적어도 하나를 투명한 재료로 형성한 것을 특징으로 하는진공 용기.
- 제 5 항에 있어서,상기 투명한 재료가 아크릴 수지 또는 폴리카보네이트 수지로 이루어지는 것을 특징으로 하는진공 용기.
- 제 1 항에 있어서,상기 하우징내에 기판을 지지하는 기구를 설치한 것을 특징으로 하는진공 용기.
- 제 1 항에 있어서,상기 하우징내에 기판을 반송하는 기구를 설치한 것을 특징으로 하는진공 용기.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003291989A JP4285642B2 (ja) | 2003-08-12 | 2003-08-12 | 真空容器 |
JPJP-P-2003-00291989 | 2003-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050016229A KR20050016229A (ko) | 2005-02-21 |
KR100634902B1 true KR100634902B1 (ko) | 2006-10-17 |
Family
ID=34369481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040063228A KR100634902B1 (ko) | 2003-08-12 | 2004-08-11 | 진공 용기 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4285642B2 (ko) |
KR (1) | KR100634902B1 (ko) |
CN (1) | CN1324649C (ko) |
TW (1) | TW200518176A (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7695232B2 (en) * | 2006-06-15 | 2010-04-13 | Applied Materials, Inc. | Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same |
JP5601571B2 (ja) * | 2010-05-25 | 2014-10-08 | 新東工業株式会社 | 鋳型造型装置におけるサンドタンクの砂供給口開閉装置 |
JP5585238B2 (ja) * | 2010-06-24 | 2014-09-10 | 東京エレクトロン株式会社 | 基板処理装置 |
JP5575558B2 (ja) * | 2010-06-30 | 2014-08-20 | 東京エレクトロン株式会社 | 処理装置 |
JP5577185B2 (ja) * | 2010-08-06 | 2014-08-20 | 株式会社アルバック | 真空処理装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3287670B2 (ja) * | 1993-11-25 | 2002-06-04 | キヤノン株式会社 | 画像形成装置 |
-
2003
- 2003-08-12 JP JP2003291989A patent/JP4285642B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-14 TW TW093121036A patent/TW200518176A/zh unknown
- 2004-08-10 CN CNB2004100700594A patent/CN1324649C/zh active Active
- 2004-08-11 KR KR1020040063228A patent/KR100634902B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20050016229A (ko) | 2005-02-21 |
CN1581433A (zh) | 2005-02-16 |
JP4285642B2 (ja) | 2009-06-24 |
CN1324649C (zh) | 2007-07-04 |
TW200518176A (en) | 2005-06-01 |
TWI374473B (ko) | 2012-10-11 |
JP2005064213A (ja) | 2005-03-10 |
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