KR100831950B1 - 챔버 - Google Patents
챔버 Download PDFInfo
- Publication number
- KR100831950B1 KR100831950B1 KR1020050114435A KR20050114435A KR100831950B1 KR 100831950 B1 KR100831950 B1 KR 100831950B1 KR 1020050114435 A KR1020050114435 A KR 1020050114435A KR 20050114435 A KR20050114435 A KR 20050114435A KR 100831950 B1 KR100831950 B1 KR 100831950B1
- Authority
- KR
- South Korea
- Prior art keywords
- seal
- main body
- chamber
- mounting portion
- seal mounting
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (9)
- 절단면을 따라 분할가능한 본체를 구비하는 챔버에 있어서,상기 본체는,상기 본체의 상면에 개방되도록 형성되어 상기 절단면을 따라 분할되는 상부 개방부의 둘레를 따라 상기 상면으로부터 함몰되어 형성되며, 상부씰이 삽입장착되는 상부씰 장착부; 및상기 본체의 절단면 상에 상기 절단면으로부터 함몰되어 형성되며, 절단면씰이 삽입장착되는 절단면씰 장착부를 구비하되,상기 상부씰 장착부 및 상기 절단면씰 장착부는 서로 연통되도록 배치되어 상기 상부씰 및 상기 절단면씰은 서로 접촉하는 것을 특징으로 하는 챔버.
- 제1항에 있어서,상기 상부씰 장착부는 상기 절단면씰 장착부의 상부에 배치되는 것을 특징으로 하는 챔버.
- 제1항 또는 제2항에 있어서,상기 본체는 상기 본체의 하면에 개방되도록 형성되어 상기 절단면을 따라 분할되는 하부 개방부의 둘레를 따라 상기 하면으로부터 함몰되어 형성되며, 하부씰이 삽입장착되는 하부씰 장착부를 구비하며,상기 하부씰 장착부 및 상기 절단면씰 장착부는 서로 연통되도록 배치되어 상기 하부씰 및 상기 절단면씰은 서로 접촉하는 것을 특징으로 하는 챔버.
- 제1항 또는 제2항에 있어서,상기 절단면씰 장착부는 상기 절단면 중 상기 상면과 인접한 상부가장자리 및 상기 절단면 중 상기 본체의 측면과 인접한 측부가장자리, 그리고 상기 절단면 중 상기 본체의 하면과 인접한 하부가장자리를 따라 배치되는 것을 특징으로 하는 챔버.
- 제1항에 있어서,상기 본체는 육각 형상의 상면과 하면을 가지고, 상기 절단면은 상기 육각형의 마주보는 모서리를 따라 배치되며,상기 본체의 측면에는 측면 개방부가 형성되는 것을 특징으로 하는 챔버.
- 제1항에 있어서,상기 본체는 팔각 형상의 상면과 하면을 가지고, 상기 절단면은 상기 팔각형의 마주보는 모서리를 따라 배치되며,상기 본체의 측면에는 측면 개방부가 형성되는 것을 특징으로 하는 챔버.
- 제1항에 있어서,상기 챔버는 상기 상부 개방부를 개폐하는 상부덮개 및 상기 하부 개방부를 개폐하는 하부덮개를 더 포함하는 것을 특징으로 하는 챔버.
- 제1항에 있어서,상기 챔버는 상기 본체의 내측 공간에 설치되어 상기 챔버의 내외로 기판을 이송하는 이송로봇을 더 포함하는 것을 특징으로 하는 챔버.
- 제1항에 있어서,상기 본체의 일측에는 증착대상물로서 기판을 수납하는 로드락 유닛이 배치되고,상기 본체의 내부에는 상기 기판을 운송하는 로봇이 장착되며,상기 본체의 타측에는 상기 기판에 대한 증착공정이 수행되는 프로세스 챔버가 배치되는 것을 특징으로 하는 챔버.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050114435A KR100831950B1 (ko) | 2005-11-28 | 2005-11-28 | 챔버 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050114435A KR100831950B1 (ko) | 2005-11-28 | 2005-11-28 | 챔버 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070055918A KR20070055918A (ko) | 2007-05-31 |
KR100831950B1 true KR100831950B1 (ko) | 2008-05-23 |
Family
ID=38277181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050114435A KR100831950B1 (ko) | 2005-11-28 | 2005-11-28 | 챔버 |
Country Status (1)
Country | Link |
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KR (1) | KR100831950B1 (ko) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100441875B1 (ko) * | 2003-06-02 | 2004-07-27 | 주성엔지니어링(주) | 분리형 이송 챔버 |
KR20050086265A (ko) * | 2004-02-25 | 2005-08-30 | 주식회사 에이디피엔지니어링 | 분리형 진공챔버 |
-
2005
- 2005-11-28 KR KR1020050114435A patent/KR100831950B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100441875B1 (ko) * | 2003-06-02 | 2004-07-27 | 주성엔지니어링(주) | 분리형 이송 챔버 |
KR20050086265A (ko) * | 2004-02-25 | 2005-08-30 | 주식회사 에이디피엔지니어링 | 분리형 진공챔버 |
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Publication number | Publication date |
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KR20070055918A (ko) | 2007-05-31 |
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