KR100803726B1 - 반송챔버의 구조 - Google Patents
반송챔버의 구조 Download PDFInfo
- Publication number
- KR100803726B1 KR100803726B1 KR1020050074137A KR20050074137A KR100803726B1 KR 100803726 B1 KR100803726 B1 KR 100803726B1 KR 1020050074137 A KR1020050074137 A KR 1020050074137A KR 20050074137 A KR20050074137 A KR 20050074137A KR 100803726 B1 KR100803726 B1 KR 100803726B1
- Authority
- KR
- South Korea
- Prior art keywords
- chamber
- plate
- coupled
- central chamber
- present
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (6)
- 삭제
- 삭제
- 삭제
- 사방이 개방된 다각면으로 이루어진 몸체와, 상기 몸체 상면을 밀폐시키는 상판과, 상기 몸체 하면을 밀폐시키는 하판을 포함하는 중앙챔버와;상기 중앙챔버의 측벽과 결합되고, 측판과 상기 측판과 결합되는 상판 및 하판을 포함하며, 상기 측판은 곡면형상을 이루는 하나 이상의 측면챔버;를 포함하며,상기 측판은 하나 이상의 개폐구를 더 포함하는 것을 특징으로 하는 반송챔버.
- 사방이 개방된 다각면으로 이루어진 몸체와, 상기 몸체 상면을 밀폐시키는 상판과, 상기 몸체 하면을 밀폐시키는 하판을 포함하는 중앙챔버와;상기 중앙챔버의 측벽과 결합되고, 측판과 상기 측판과 결합되는 상판 및 하판을 포함하며, 상기 측판은 곡면형상을 이루는 하나 이상의 측면챔버;를 포함하며,상기 중앙챔버는 상부에 탈부착 가능한 하나 이상의 덮개를 더 포함하여 이루어지는 것을 특징으로 하는 반송챔버.
- 삭제
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050074137A KR100803726B1 (ko) | 2005-08-12 | 2005-08-12 | 반송챔버의 구조 |
TW094147570A TWI287823B (en) | 2005-08-12 | 2005-12-30 | Chamber for vacuum processing apparatus and apparatus having the same |
CNB2006100020763A CN100411095C (zh) | 2005-08-12 | 2006-01-24 | 用于真空处理装置的腔室以及具有该腔室的装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050074137A KR100803726B1 (ko) | 2005-08-12 | 2005-08-12 | 반송챔버의 구조 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070019309A KR20070019309A (ko) | 2007-02-15 |
KR100803726B1 true KR100803726B1 (ko) | 2008-02-15 |
Family
ID=37721985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050074137A KR100803726B1 (ko) | 2005-08-12 | 2005-08-12 | 반송챔버의 구조 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100803726B1 (ko) |
CN (1) | CN100411095C (ko) |
TW (1) | TWI287823B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102097289A (zh) * | 2009-12-15 | 2011-06-15 | Tes股份有限公司 | 真空进样室 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101308389B1 (ko) * | 2011-03-14 | 2013-09-16 | 엘아이지에이디피 주식회사 | 기판처리장치의 챔버 |
CN103367195B (zh) * | 2012-03-26 | 2016-11-23 | 上海华虹宏力半导体制造有限公司 | 一种适用于具有多处理腔的半导体设备的传输腔顶盖 |
US10998209B2 (en) | 2019-05-31 | 2021-05-04 | Applied Materials, Inc. | Substrate processing platforms including multiple processing chambers |
US11817331B2 (en) | 2020-07-27 | 2023-11-14 | Applied Materials, Inc. | Substrate holder replacement with protective disk during pasting process |
US11749542B2 (en) | 2020-07-27 | 2023-09-05 | Applied Materials, Inc. | Apparatus, system, and method for non-contact temperature monitoring of substrate supports |
US11600507B2 (en) | 2020-09-09 | 2023-03-07 | Applied Materials, Inc. | Pedestal assembly for a substrate processing chamber |
US11610799B2 (en) | 2020-09-18 | 2023-03-21 | Applied Materials, Inc. | Electrostatic chuck having a heating and chucking capabilities |
US11674227B2 (en) | 2021-02-03 | 2023-06-13 | Applied Materials, Inc. | Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05319513A (ja) * | 1992-05-20 | 1993-12-03 | Tokyo Electron Tohoku Ltd | 搬送装置 |
JPH10125764A (ja) | 1996-10-15 | 1998-05-15 | Applied Materials Inc | 高生産性ウェハ処理装置と方法 |
JPH10247676A (ja) | 1997-03-04 | 1998-09-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH1154721A (ja) | 1997-07-29 | 1999-02-26 | Nec Corp | 半導体装置の製造方法および製造装置 |
KR100270459B1 (ko) | 1996-05-21 | 2000-12-01 | 니시히라 쥰지 | 멀티챔버 스퍼터링 장치 |
KR20040090496A (ko) * | 2003-05-08 | 2004-10-25 | 가부시키가이샤 아루박 | 진공처리장치용 진공챔버 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0711442A (ja) * | 1993-06-28 | 1995-01-13 | Fuji Electric Co Ltd | 半導体装置製造用スパッタ装置 |
JPH1064973A (ja) * | 1996-08-22 | 1998-03-06 | Kokusai Electric Co Ltd | 半導体製造装置 |
US6440261B1 (en) * | 1999-05-25 | 2002-08-27 | Applied Materials, Inc. | Dual buffer chamber cluster tool for semiconductor wafer processing |
US7351291B2 (en) * | 2002-02-20 | 2008-04-01 | Tokyo Electron Limited | Semiconductor processing system |
-
2005
- 2005-08-12 KR KR1020050074137A patent/KR100803726B1/ko active IP Right Grant
- 2005-12-30 TW TW094147570A patent/TWI287823B/zh active
-
2006
- 2006-01-24 CN CNB2006100020763A patent/CN100411095C/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05319513A (ja) * | 1992-05-20 | 1993-12-03 | Tokyo Electron Tohoku Ltd | 搬送装置 |
KR100270459B1 (ko) | 1996-05-21 | 2000-12-01 | 니시히라 쥰지 | 멀티챔버 스퍼터링 장치 |
JPH10125764A (ja) | 1996-10-15 | 1998-05-15 | Applied Materials Inc | 高生産性ウェハ処理装置と方法 |
JPH10247676A (ja) | 1997-03-04 | 1998-09-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH1154721A (ja) | 1997-07-29 | 1999-02-26 | Nec Corp | 半導体装置の製造方法および製造装置 |
KR20040090496A (ko) * | 2003-05-08 | 2004-10-25 | 가부시키가이샤 아루박 | 진공처리장치용 진공챔버 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102097289A (zh) * | 2009-12-15 | 2011-06-15 | Tes股份有限公司 | 真空进样室 |
Also Published As
Publication number | Publication date |
---|---|
TW200707508A (en) | 2007-02-16 |
KR20070019309A (ko) | 2007-02-15 |
TWI287823B (en) | 2007-10-01 |
CN1913099A (zh) | 2007-02-14 |
CN100411095C (zh) | 2008-08-13 |
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