CN1913099A - 用于真空处理装置的腔室以及具有该腔室的装置 - Google Patents
用于真空处理装置的腔室以及具有该腔室的装置 Download PDFInfo
- Publication number
- CN1913099A CN1913099A CNA2006100020763A CN200610002076A CN1913099A CN 1913099 A CN1913099 A CN 1913099A CN A2006100020763 A CNA2006100020763 A CN A2006100020763A CN 200610002076 A CN200610002076 A CN 200610002076A CN 1913099 A CN1913099 A CN 1913099A
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- China
- Prior art keywords
- chamber
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- chamber body
- sidewall
- wall element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000009434 installation Methods 0.000 claims description 34
- 238000009489 vacuum treatment Methods 0.000 claims description 28
- 230000005540 biological transmission Effects 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 10
- 238000005137 deposition process Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050074137 | 2005-08-12 | ||
KR1020050074137A KR100803726B1 (ko) | 2005-08-12 | 2005-08-12 | 반송챔버의 구조 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1913099A true CN1913099A (zh) | 2007-02-14 |
CN100411095C CN100411095C (zh) | 2008-08-13 |
Family
ID=37721985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100020763A Active CN100411095C (zh) | 2005-08-12 | 2006-01-24 | 用于真空处理装置的腔室以及具有该腔室的装置 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100803726B1 (zh) |
CN (1) | CN100411095C (zh) |
TW (1) | TWI287823B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367195B (zh) * | 2012-03-26 | 2016-11-23 | 上海华虹宏力半导体制造有限公司 | 一种适用于具有多处理腔的半导体设备的传输腔顶盖 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110067939A (ko) * | 2009-12-15 | 2011-06-22 | 주식회사 테스 | 로드락 챔버 |
KR101308389B1 (ko) * | 2011-03-14 | 2013-09-16 | 엘아이지에이디피 주식회사 | 기판처리장치의 챔버 |
US10998209B2 (en) | 2019-05-31 | 2021-05-04 | Applied Materials, Inc. | Substrate processing platforms including multiple processing chambers |
US12080571B2 (en) | 2020-07-08 | 2024-09-03 | Applied Materials, Inc. | Substrate processing module and method of moving a workpiece |
US11817331B2 (en) | 2020-07-27 | 2023-11-14 | Applied Materials, Inc. | Substrate holder replacement with protective disk during pasting process |
US11749542B2 (en) | 2020-07-27 | 2023-09-05 | Applied Materials, Inc. | Apparatus, system, and method for non-contact temperature monitoring of substrate supports |
US11600507B2 (en) | 2020-09-09 | 2023-03-07 | Applied Materials, Inc. | Pedestal assembly for a substrate processing chamber |
US11610799B2 (en) | 2020-09-18 | 2023-03-21 | Applied Materials, Inc. | Electrostatic chuck having a heating and chucking capabilities |
US11674227B2 (en) | 2021-02-03 | 2023-06-13 | Applied Materials, Inc. | Symmetric pump down mini-volume with laminar flow cavity gas injection for high and low pressure |
US12002668B2 (en) | 2021-06-25 | 2024-06-04 | Applied Materials, Inc. | Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05319513A (ja) * | 1992-05-20 | 1993-12-03 | Tokyo Electron Tohoku Ltd | 搬送装置 |
JPH0711442A (ja) * | 1993-06-28 | 1995-01-13 | Fuji Electric Co Ltd | 半導体装置製造用スパッタ装置 |
JP3537269B2 (ja) | 1996-05-21 | 2004-06-14 | アネルバ株式会社 | マルチチャンバースパッタリング装置 |
JPH1064973A (ja) * | 1996-08-22 | 1998-03-06 | Kokusai Electric Co Ltd | 半導体製造装置 |
JPH10125764A (ja) | 1996-10-15 | 1998-05-15 | Applied Materials Inc | 高生産性ウェハ処理装置と方法 |
JPH10247676A (ja) | 1997-03-04 | 1998-09-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JPH1154721A (ja) | 1997-07-29 | 1999-02-26 | Nec Corp | 半導体装置の製造方法および製造装置 |
US6440261B1 (en) * | 1999-05-25 | 2002-08-27 | Applied Materials, Inc. | Dual buffer chamber cluster tool for semiconductor wafer processing |
US7351291B2 (en) * | 2002-02-20 | 2008-04-01 | Tokyo Electron Limited | Semiconductor processing system |
JP2004335743A (ja) * | 2003-05-08 | 2004-11-25 | Ulvac Japan Ltd | 真空処理装置用真空チャンバー |
-
2005
- 2005-08-12 KR KR1020050074137A patent/KR100803726B1/ko active IP Right Grant
- 2005-12-30 TW TW094147570A patent/TWI287823B/zh active
-
2006
- 2006-01-24 CN CNB2006100020763A patent/CN100411095C/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367195B (zh) * | 2012-03-26 | 2016-11-23 | 上海华虹宏力半导体制造有限公司 | 一种适用于具有多处理腔的半导体设备的传输腔顶盖 |
Also Published As
Publication number | Publication date |
---|---|
CN100411095C (zh) | 2008-08-13 |
TWI287823B (en) | 2007-10-01 |
KR100803726B1 (ko) | 2008-02-15 |
KR20070019309A (ko) | 2007-02-15 |
TW200707508A (en) | 2007-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: YUANYI IPS CO., LTD. Free format text: FORMER NAME: IPS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Gyeonggi Do, South Korea Patentee after: WONIK IPS Co.,Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Wonik IPS Co.,Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: Gyeonggi Do Korea Pyeongtaek paint 78-40 (jije Dong strange street) Patentee after: Lap Yi Cmi Holdings Ltd. Address before: Gyeonggi Do, South Korea Patentee before: WONIK IPS Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20160729 Address after: South Korea Gyeonggi Do Ping Ze Zhenwei Zhenwei group produced 75 road surface Patentee after: WONIK IPS Co.,Ltd. Address before: Gyeonggi Do Korea Pyeongtaek paint 78-40 (jije Dong strange street) Patentee before: Lap Yi Cmi Holdings Ltd. |