TW200518176A - Vacuum container - Google Patents

Vacuum container

Info

Publication number
TW200518176A
TW200518176A TW093121036A TW93121036A TW200518176A TW 200518176 A TW200518176 A TW 200518176A TW 093121036 A TW093121036 A TW 093121036A TW 93121036 A TW93121036 A TW 93121036A TW 200518176 A TW200518176 A TW 200518176A
Authority
TW
Taiwan
Prior art keywords
lid
frame
top end
opening
vacuum
Prior art date
Application number
TW093121036A
Other languages
Chinese (zh)
Other versions
TWI374473B (en
Inventor
Hoshiji Okabe
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200518176A publication Critical patent/TW200518176A/en
Application granted granted Critical
Publication of TWI374473B publication Critical patent/TWI374473B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Vessels And Lids Thereof (AREA)

Abstract

Due to the size of processing device for LCD substrate (S) is being increased, the area of a lid (1B) that is applied with pressure becomes large if the lid (1B) of the vacuum preparing chamber (1) exceeds 1500mm. The lid (1B) must be manufactured to have a very large thickness according to special specification so as to resist the vacuum status in a frame (1). However, this significantly increases the manufacturing cost. Furthermore, the height of the lid (1B) that is opened (bounced height) also becomes large, and thus a secure safety strategy for opening/closing must be provided in maintenance, resulting a very high total cost. To solve the problem, the vacuum container (10) of the present invention comprises a frame (11) having an opening at the top end and an openable lid (12) for sealing the interior from the top end opening of the frame (11). The lid (12) is divided into a first and second cover members (12A), (12B) and has a seal-assisting member (28) between the cover members (12A), (12B) and the top end face (11A) of the frame (11).
TW093121036A 2003-08-12 2004-07-14 Vacuum container TW200518176A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003291989A JP4285642B2 (en) 2003-08-12 2003-08-12 Vacuum vessel

Publications (2)

Publication Number Publication Date
TW200518176A true TW200518176A (en) 2005-06-01
TWI374473B TWI374473B (en) 2012-10-11

Family

ID=34369481

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093121036A TW200518176A (en) 2003-08-12 2004-07-14 Vacuum container

Country Status (4)

Country Link
JP (1) JP4285642B2 (en)
KR (1) KR100634902B1 (en)
CN (1) CN1324649C (en)
TW (1) TW200518176A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7695232B2 (en) * 2006-06-15 2010-04-13 Applied Materials, Inc. Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same
JP5601571B2 (en) * 2010-05-25 2014-10-08 新東工業株式会社 Sand tank opening and closing device for sand tank in mold making machine
JP5585238B2 (en) * 2010-06-24 2014-09-10 東京エレクトロン株式会社 Substrate processing equipment
JP5575558B2 (en) * 2010-06-30 2014-08-20 東京エレクトロン株式会社 Processing equipment
JP5577185B2 (en) * 2010-08-06 2014-08-20 株式会社アルバック Vacuum processing equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3287670B2 (en) * 1993-11-25 2002-06-04 キヤノン株式会社 Image forming device

Also Published As

Publication number Publication date
KR20050016229A (en) 2005-02-21
CN1581433A (en) 2005-02-16
JP4285642B2 (en) 2009-06-24
CN1324649C (en) 2007-07-04
KR100634902B1 (en) 2006-10-17
TWI374473B (en) 2012-10-11
JP2005064213A (en) 2005-03-10

Similar Documents

Publication Publication Date Title
WO2008049420A8 (en) Package with a sealing region
KR101184583B1 (en) Storage container for semiconductor wafers
KR101147005B1 (en) Button type container lid
KR100759487B1 (en) Cover for airtight container
WO2010054226A3 (en) Flexible, stackable container and method and system for manufacturing same
WO2008092151A3 (en) Polymeric package with resealable closure and valve and methods relating thereto
EP1595812A3 (en) Tamper evident closure with reclose feature
US20160297597A1 (en) Vacuum Bottle Sealing Apparatus
ZA200409770B (en) Prevaporatively cooled containers.
WO2007086969A3 (en) Containers for powdered products
WO2007007046A3 (en) Forming a hermetic seal about a cable
DE60132912D1 (en) CLOSING MEMBRANE FOR A PACKAGING FOR PRODUCTS TO BE STERILIZED BY A HIGH-TEMPERATURE-STERILIZING FLUID
WO2003010061A3 (en) Hinged tamper evident closure
WO2010131834A3 (en) Dust-collecting apparatus with a packing member
TW200518176A (en) Vacuum container
GB2399331A (en) Napkin container having a sealable closure
KR101063241B1 (en) Easy-to-close vacuum container lid
JP2021042109A5 (en) Solid product discharge recovery system and method
CN101409246A (en) Crystal boat box with inlet valve
HK1043161A1 (en) Lock for vacuum chamber
KR101402423B1 (en) Autoclave device that offers a closed ring shape deformation
KR102515385B1 (en) Upper plate and open-type drum comprising the same
CN217440815U (en) Prevent novel plate valve of jam
PL371029A1 (en) Reclosable pouring element
CN208856126U (en) A kind of recyclable valve bag