JP2005064213A - 真空容器 - Google Patents
真空容器 Download PDFInfo
- Publication number
- JP2005064213A JP2005064213A JP2003291989A JP2003291989A JP2005064213A JP 2005064213 A JP2005064213 A JP 2005064213A JP 2003291989 A JP2003291989 A JP 2003291989A JP 2003291989 A JP2003291989 A JP 2003291989A JP 2005064213 A JP2005064213 A JP 2005064213A
- Authority
- JP
- Japan
- Prior art keywords
- lid
- housing
- vacuum
- vacuum container
- lid members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims abstract description 34
- 230000007246 mechanism Effects 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 32
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920005668 polycarbonate resin Polymers 0.000 claims description 4
- 239000004431 polycarbonate resin Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 4
- 230000007723 transport mechanism Effects 0.000 description 10
- 238000012423 maintenance Methods 0.000 description 8
- 238000003825 pressing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Pressure Vessels And Lids Thereof (AREA)
Abstract
【解決手段】真空容器10は、上端に開口部を有する筐体11と、この筐体11の上端開口から内部を封止する開閉可能な蓋体12とを備え、蓋体12を第1、第2の蓋部材12A、12Bとして二分割すると共にこれらの蓋部材12A、12Bと筐体11の上端面11Aとの間にシール補助部材18を設けた。
【選択図】図1
Description
11、21、31 筐体
11A、21A、31A 筐体の上端面
12、22、32 蓋体
12A、22A、32A 第1の蓋部材
12B、22B、32B 第2の蓋部材
13、23 第1のシール部材(封止部材)
16 第2のシール部材(封止部材)
17、27、37 支持部材
18、28、38 シール補助部材(封止補助部材)
18A、28A、38A 第1の当接部
18B、28B、38B 第2の当接部
32C 第3の蓋部材
32D 第4の蓋部材
Claims (10)
- 筐体と、この筐体の上端開口部から内部を封止する開閉可能な蓋体とを備えた真空容器において、上記蓋体を複数の蓋部材に分割すると共にこれらの蓋部材と上記筐体の上端との間に封止補助部材を介装したことを特徴とする真空容器。
- 上記封止補助部材は、上記筐体の上端面に当接する第1の当接部と、第1の当接部と一体化し且つ上記筐体の上端開口部で上記各蓋部材と当接する第2の当接部とを有することを特徴とする請求項1に記載の真空容器。
- 上記各蓋部材を上記筐体の上端開口部で支持する支持部材を上記筐体の上端間に架設したことを特徴とする請求項1または請求項2に記載の真空容器。
- 上記筐体と上記封止補助部材の第1の当接部との間及び上記各蓋部材と上記封止補助部材との間に、それぞれ封止部材を介装したことを特徴とする請求項1〜請求項3のいずれか1項に記載の真空容器。
- 上記封止補助部材と上記支持部材とを一体化したことを特徴とする請求項1〜請求項4のいずれか1項に記載の真空容器。
- 上記筐体を、一辺が少なくとも1500mmの矩形状として形成したことを特徴とする請求項1〜請求項5のいずれか1項に記載の真空容器。
- 上記封止補助部材及び/または上記蓋体を透明な材料によって形成したことを特徴とする請求項1〜請求項6のいずれか1項に記載の真空容器。
- 上記透明な材料がアクリル樹脂またはポリカーボネート樹脂からなることを特徴とする請求項7に記載の真空容器。
- 上記筐体内に基板を保持する機構を設けたことを特徴とする請求項1〜請求項8のいずれか1項に記載の真空容器。
- 上記筐体内に基板を搬送する機構を設けたことを特徴とする請求項1〜請求項9のいずれか1項に記載の真空容器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003291989A JP4285642B2 (ja) | 2003-08-12 | 2003-08-12 | 真空容器 |
TW093121036A TW200518176A (en) | 2003-08-12 | 2004-07-14 | Vacuum container |
CNB2004100700594A CN1324649C (zh) | 2003-08-12 | 2004-08-10 | 真空容器 |
KR1020040063228A KR100634902B1 (ko) | 2003-08-12 | 2004-08-11 | 진공 용기 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003291989A JP4285642B2 (ja) | 2003-08-12 | 2003-08-12 | 真空容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005064213A true JP2005064213A (ja) | 2005-03-10 |
JP4285642B2 JP4285642B2 (ja) | 2009-06-24 |
Family
ID=34369481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003291989A Expired - Lifetime JP4285642B2 (ja) | 2003-08-12 | 2003-08-12 | 真空容器 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4285642B2 (ja) |
KR (1) | KR100634902B1 (ja) |
CN (1) | CN1324649C (ja) |
TW (1) | TW200518176A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009540613A (ja) * | 2006-06-15 | 2009-11-19 | アプライド マテリアルズ インコーポレイテッド | 複数レベルのロードロックチャンバ、移送チャンバ、及びこれにインターフェイスするのに適したロボット |
JP2011245500A (ja) * | 2010-05-25 | 2011-12-08 | Sintokogio Ltd | 鋳型造型装置におけるサンドタンクの砂供給口開閉装置 |
JP2012009620A (ja) * | 2010-06-24 | 2012-01-12 | Tokyo Electron Ltd | 基板処理装置 |
JP2012015261A (ja) * | 2010-06-30 | 2012-01-19 | Tokyo Electron Ltd | 処理装置 |
JP2012038876A (ja) * | 2010-08-06 | 2012-02-23 | Ulvac Japan Ltd | 真空処理装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3287670B2 (ja) * | 1993-11-25 | 2002-06-04 | キヤノン株式会社 | 画像形成装置 |
-
2003
- 2003-08-12 JP JP2003291989A patent/JP4285642B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-14 TW TW093121036A patent/TW200518176A/zh not_active IP Right Cessation
- 2004-08-10 CN CNB2004100700594A patent/CN1324649C/zh not_active Expired - Lifetime
- 2004-08-11 KR KR1020040063228A patent/KR100634902B1/ko active IP Right Grant
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009540613A (ja) * | 2006-06-15 | 2009-11-19 | アプライド マテリアルズ インコーポレイテッド | 複数レベルのロードロックチャンバ、移送チャンバ、及びこれにインターフェイスするのに適したロボット |
JP2013141015A (ja) * | 2006-06-15 | 2013-07-18 | Applied Materials Inc | 複数レベルのロードロックチャンバ、移送チャンバ、及びこれにインターフェイスするのに適したロボット |
JP2011245500A (ja) * | 2010-05-25 | 2011-12-08 | Sintokogio Ltd | 鋳型造型装置におけるサンドタンクの砂供給口開閉装置 |
JP2012009620A (ja) * | 2010-06-24 | 2012-01-12 | Tokyo Electron Ltd | 基板処理装置 |
JP2012015261A (ja) * | 2010-06-30 | 2012-01-19 | Tokyo Electron Ltd | 処理装置 |
JP2012038876A (ja) * | 2010-08-06 | 2012-02-23 | Ulvac Japan Ltd | 真空処理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1324649C (zh) | 2007-07-04 |
CN1581433A (zh) | 2005-02-16 |
JP4285642B2 (ja) | 2009-06-24 |
KR100634902B1 (ko) | 2006-10-17 |
TWI374473B (ja) | 2012-10-11 |
TW200518176A (en) | 2005-06-01 |
KR20050016229A (ko) | 2005-02-21 |
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