TWI370713B - - Google Patents
Info
- Publication number
- TWI370713B TWI370713B TW095103719A TW95103719A TWI370713B TW I370713 B TWI370713 B TW I370713B TW 095103719 A TW095103719 A TW 095103719A TW 95103719 A TW95103719 A TW 95103719A TW I370713 B TWI370713 B TW I370713B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005033327A JP4607612B2 (ja) | 2005-02-09 | 2005-02-09 | 配線回路基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200638829A TW200638829A (en) | 2006-11-01 |
TWI370713B true TWI370713B (zh) | 2012-08-11 |
Family
ID=36293312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095103719A TW200638829A (en) | 2005-02-09 | 2006-02-03 | Wired circuit board and producing method thereof |
Country Status (7)
Country | Link |
---|---|
US (3) | US7371971B2 (zh) |
EP (1) | EP1691589B1 (zh) |
JP (1) | JP4607612B2 (zh) |
KR (1) | KR101195685B1 (zh) |
CN (1) | CN1819746B (zh) |
DE (1) | DE602006000514T2 (zh) |
TW (1) | TW200638829A (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4762749B2 (ja) | 2006-02-14 | 2011-08-31 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP2008198738A (ja) * | 2007-02-09 | 2008-08-28 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
FR2930399B1 (fr) * | 2008-04-17 | 2010-05-14 | Continental Automotive France | Circuit imprime muni de reliefs de separation pour vernis de protection |
WO2010018759A1 (ja) * | 2008-08-11 | 2010-02-18 | シャープ株式会社 | フレキシブル基板および電気回路構造体 |
JP5249096B2 (ja) * | 2009-03-13 | 2013-07-31 | アイシン・エィ・ダブリュ株式会社 | 電子回路装置 |
TWI392409B (zh) * | 2009-05-26 | 2013-04-01 | Wistron Corp | 電子裝置及其軟性電路板 |
JP4875124B2 (ja) * | 2009-09-17 | 2012-02-15 | シャープ株式会社 | 太陽電池モジュール |
US9066439B2 (en) * | 2011-07-14 | 2015-06-23 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
CN103677368B (zh) * | 2012-09-20 | 2016-11-23 | 瀚宇彩晶股份有限公司 | 触控面板与软性电路板的接合结构 |
WO2014080476A1 (ja) * | 2012-11-21 | 2014-05-30 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JP6257428B2 (ja) * | 2014-04-15 | 2018-01-10 | 株式会社ジャパンディスプレイ | 電極基板、表示装置、入力装置および電極基板の製造方法 |
JP5968514B1 (ja) * | 2015-11-05 | 2016-08-10 | 株式会社フジクラ | プリント配線板 |
CN105578720B (zh) * | 2015-12-29 | 2018-07-06 | 广东欧珀移动通信有限公司 | 柔性电路板及移动终端 |
JP7101512B2 (ja) * | 2018-03-28 | 2022-07-15 | Fdk株式会社 | 回路基板及びその製造方法 |
JP7124757B2 (ja) * | 2019-02-20 | 2022-08-24 | 株式会社村田製作所 | インダクタ |
JP2021111711A (ja) * | 2020-01-10 | 2021-08-02 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板及びその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53103659U (zh) * | 1977-01-25 | 1978-08-21 | ||
JPS58147274A (ja) | 1982-02-26 | 1983-09-02 | Fuji Photo Film Co Ltd | 光電子増倍管の過電流検出保護方法 |
JPS58147274U (ja) * | 1982-03-29 | 1983-10-03 | 松下電器産業株式会社 | 印刷配線板 |
JP2695419B2 (ja) | 1987-11-20 | 1997-12-24 | 工業技術院長 | 2−(ポリフルオロアルキル)ハロゲノベンズイミダゾール類、その製造法およびそれを有効成分とする殺虫、殺ダニ剤 |
JPH01135773U (zh) * | 1988-03-09 | 1989-09-18 | ||
JP2807336B2 (ja) * | 1990-11-21 | 1998-10-08 | 東芝メカトロニクス株式会社 | 部品実装装置 |
JPH0529719A (ja) * | 1991-07-19 | 1993-02-05 | Sony Corp | プリント配線基板 |
JPH06326434A (ja) * | 1993-05-10 | 1994-11-25 | Brother Ind Ltd | 印刷回路基板 |
JP3256391B2 (ja) * | 1994-11-28 | 2002-02-12 | キヤノン株式会社 | 回路基板構造 |
WO1998026641A1 (fr) | 1996-12-13 | 1998-06-18 | Matsushita Electric Industrial Co., Ltd. | Composant electronique et son procede et son dispositif de montage |
JP3650500B2 (ja) * | 1997-01-24 | 2005-05-18 | 新光電気工業株式会社 | 回路基板およびその製造方法 |
JP2000077835A (ja) * | 1998-09-02 | 2000-03-14 | Sony Corp | プリント配線基板上のランド |
JP4135256B2 (ja) * | 1999-04-14 | 2008-08-20 | ソニー株式会社 | マーク付き部品搭載用ランドを有するプリント配線基板 |
JP3554533B2 (ja) * | 2000-10-13 | 2004-08-18 | シャープ株式会社 | チップオンフィルム用テープおよび半導体装置 |
US6668449B2 (en) * | 2001-06-25 | 2003-12-30 | Micron Technology, Inc. | Method of making a semiconductor device having an opening in a solder mask |
JP3687623B2 (ja) | 2002-04-16 | 2005-08-24 | 日立電線株式会社 | 半導体装置用テープキャリア |
JP3840180B2 (ja) * | 2002-12-26 | 2006-11-01 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板 |
KR100546698B1 (ko) * | 2003-07-04 | 2006-01-26 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지의 서브스트레이트 |
DE10342298A1 (de) * | 2003-09-12 | 2005-04-21 | Siemens Ag | Alterungs- und Lötbarkeitsbeurteilung von OSP-geschützten Kupferoberflächen |
-
2005
- 2005-02-09 JP JP2005033327A patent/JP4607612B2/ja active Active
-
2006
- 2006-01-25 CN CN2006100043407A patent/CN1819746B/zh not_active Expired - Fee Related
- 2006-01-31 DE DE602006000514T patent/DE602006000514T2/de active Active
- 2006-01-31 EP EP06001974A patent/EP1691589B1/en not_active Expired - Fee Related
- 2006-02-03 TW TW095103719A patent/TW200638829A/zh not_active IP Right Cessation
- 2006-02-08 US US11/349,188 patent/US7371971B2/en active Active
- 2006-02-08 KR KR1020060012125A patent/KR101195685B1/ko not_active IP Right Cessation
-
2008
- 2008-02-07 US US12/068,501 patent/US7629540B2/en not_active Expired - Fee Related
- 2008-02-07 US US12/068,502 patent/US7971353B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200638829A (en) | 2006-11-01 |
DE602006000514T2 (de) | 2008-05-29 |
EP1691589B1 (en) | 2008-02-13 |
US20090025212A1 (en) | 2009-01-29 |
KR20060090614A (ko) | 2006-08-14 |
EP1691589A1 (en) | 2006-08-16 |
US20060176069A1 (en) | 2006-08-10 |
JP2006222218A (ja) | 2006-08-24 |
JP4607612B2 (ja) | 2011-01-05 |
US7371971B2 (en) | 2008-05-13 |
DE602006000514D1 (de) | 2008-03-27 |
US7629540B2 (en) | 2009-12-08 |
US20090025963A1 (en) | 2009-01-29 |
CN1819746A (zh) | 2006-08-16 |
US7971353B2 (en) | 2011-07-05 |
KR101195685B1 (ko) | 2012-10-30 |
CN1819746B (zh) | 2010-09-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |