DE10342298A1 - Alterungs- und Lötbarkeitsbeurteilung von OSP-geschützten Kupferoberflächen - Google Patents

Alterungs- und Lötbarkeitsbeurteilung von OSP-geschützten Kupferoberflächen Download PDF

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Publication number
DE10342298A1
DE10342298A1 DE10342298A DE10342298A DE10342298A1 DE 10342298 A1 DE10342298 A1 DE 10342298A1 DE 10342298 A DE10342298 A DE 10342298A DE 10342298 A DE10342298 A DE 10342298A DE 10342298 A1 DE10342298 A1 DE 10342298A1
Authority
DE
Germany
Prior art keywords
solder ability
aging
effect
circuit boards
ability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10342298A
Other languages
English (en)
Inventor
Anton Wimmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE10342298A priority Critical patent/DE10342298A1/de
Publication of DE10342298A1 publication Critical patent/DE10342298A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Ein Bauelement mit einer OSP-Beschichtung weist eine Teststruktur auf, an der die Lötbarkeit und/oder Alterung des Bauelements getestet werden kann.
DE10342298A 2003-09-12 2003-09-12 Alterungs- und Lötbarkeitsbeurteilung von OSP-geschützten Kupferoberflächen Withdrawn DE10342298A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10342298A DE10342298A1 (de) 2003-09-12 2003-09-12 Alterungs- und Lötbarkeitsbeurteilung von OSP-geschützten Kupferoberflächen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10342298A DE10342298A1 (de) 2003-09-12 2003-09-12 Alterungs- und Lötbarkeitsbeurteilung von OSP-geschützten Kupferoberflächen

Publications (1)

Publication Number Publication Date
DE10342298A1 true DE10342298A1 (de) 2005-04-21

Family

ID=34352819

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10342298A Withdrawn DE10342298A1 (de) 2003-09-12 2003-09-12 Alterungs- und Lötbarkeitsbeurteilung von OSP-geschützten Kupferoberflächen

Country Status (1)

Country Link
DE (1) DE10342298A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1691589A1 (de) * 2005-02-09 2006-08-16 Nitto Denko Corporation Leiterplatte und Herstellungsverfahren dafür

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1691589A1 (de) * 2005-02-09 2006-08-16 Nitto Denko Corporation Leiterplatte und Herstellungsverfahren dafür
US7371971B2 (en) 2005-02-09 2008-05-13 Nitto Denko Corporation Wired circuit board and producing method thereof
US7629540B2 (en) 2005-02-09 2009-12-08 Nitto Denko Corporation Wired circuit board and production method thereof
US7971353B2 (en) 2005-02-09 2011-07-05 Nitto Denko Corporation Production method of a wired circuit board

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8139 Disposal/non-payment of the annual fee