DE602004012910D1 - Kupferfolie für gedruckte Leiterplatten mit feinen Strukturen und Herstellungsverfahren - Google Patents

Kupferfolie für gedruckte Leiterplatten mit feinen Strukturen und Herstellungsverfahren

Info

Publication number
DE602004012910D1
DE602004012910D1 DE200460012910 DE602004012910T DE602004012910D1 DE 602004012910 D1 DE602004012910 D1 DE 602004012910D1 DE 200460012910 DE200460012910 DE 200460012910 DE 602004012910 T DE602004012910 T DE 602004012910T DE 602004012910 D1 DE602004012910 D1 DE 602004012910D1
Authority
DE
Germany
Prior art keywords
printed circuit
copper foil
circuit boards
manufacturing processes
fine structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE200460012910
Other languages
English (en)
Other versions
DE602004012910T2 (de
Inventor
Kensaku Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Circuit Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Circuit Foil Co Ltd filed Critical Furukawa Circuit Foil Co Ltd
Publication of DE602004012910D1 publication Critical patent/DE602004012910D1/de
Application granted granted Critical
Publication of DE602004012910T2 publication Critical patent/DE602004012910T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE200460012910 2003-02-12 2004-02-12 Kupferfolie für gedruckte Leiterplatten mit feinen Strukturen und Herstellungsverfahren Expired - Lifetime DE602004012910T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003033160 2003-02-12
JP2003033160 2003-02-12

Publications (2)

Publication Number Publication Date
DE602004012910D1 true DE602004012910D1 (de) 2008-05-21
DE602004012910T2 DE602004012910T2 (de) 2009-06-04

Family

ID=32677574

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200460012910 Expired - Lifetime DE602004012910T2 (de) 2003-02-12 2004-02-12 Kupferfolie für gedruckte Leiterplatten mit feinen Strukturen und Herstellungsverfahren

Country Status (6)

Country Link
US (1) US7052779B2 (de)
EP (1) EP1448036B1 (de)
KR (1) KR101090199B1 (de)
CN (1) CN1551710B (de)
DE (1) DE602004012910T2 (de)
TW (1) TW200500199A (de)

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TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board
KR100654737B1 (ko) * 2004-07-16 2006-12-08 일진소재산업주식회사 미세회로기판용 표면처리동박의 제조방법 및 그 동박
KR100951211B1 (ko) * 2004-09-10 2010-04-05 미쓰이 긴조꾸 고교 가부시키가이샤 프라이머 수지층을 구비한 캐리어박 부착 전해 동박 및 그제조 방법
JP2006103189A (ja) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk 表面処理銅箔並びに回路基板
KR100692426B1 (ko) * 2005-01-18 2007-03-09 창춘 페트로케미칼 컴퍼니 리미티드 구리 포일을 제조하는 방법 및 이를 제조하기 위한 구리메시 보드
TW200704833A (en) * 2005-06-13 2007-02-01 Mitsui Mining & Smelting Co Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
US7976956B2 (en) 2005-08-01 2011-07-12 Furukawa Circuit Foil., Ltd. Laminated circuit board
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
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KR100822092B1 (ko) * 2007-02-07 2008-04-15 엘에스전선 주식회사 미세 회로용 동박 제조 방법 및 장치, 이를 이용하여제조된 동박
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KR20130007022A (ko) * 2011-06-28 2013-01-18 삼성전기주식회사 인쇄회로기판 및 이의 제조방법
KR101669087B1 (ko) 2011-07-29 2016-10-25 후루카와 덴키 고교 가부시키가이샤 전해 동합금박, 그 제조 방법, 그것의 제조에 이용하는 전해액, 그것을 이용한 2차 전지용 음극 집전체, 2차 전지 및 그 전극
CN102383148A (zh) * 2011-11-18 2012-03-21 山东金宝电子股份有限公司 电解铜箔用混合添加剂、其配制方法以及用于制备超低轮廓电解铜箔的方法
CN102560584B (zh) * 2012-02-14 2014-06-11 联合铜箔(惠州)有限公司 一种电解铜箔用添加剂及甚低轮廓电解铜箔表面处理工艺
JP5858849B2 (ja) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 金属箔
WO2014010707A1 (ja) * 2012-07-13 2014-01-16 古河電気工業株式会社 集電箔、電極構造体、リチウム二次電池または電気二重層キャパシタ
KR20140034698A (ko) * 2012-09-12 2014-03-20 주식회사 두산 동박의 표면처리 방법 및 그 방법으로 표면처리된 동박
CN103469267B (zh) * 2013-08-07 2015-11-25 江西省江铜-耶兹铜箔有限公司 一种表面处理电解铜箔的工艺方法及其处理的铜箔
JP5901848B2 (ja) * 2014-01-27 2016-04-13 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
TWI542739B (zh) * 2014-03-21 2016-07-21 長春石油化學股份有限公司 電解銅箔
CN107614760B (zh) * 2015-07-03 2018-07-13 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板和印刷电路板
KR102037846B1 (ko) 2015-09-05 2019-10-29 가부시키가이샤 유에이씨제이 전해 알루미늄박의 제조 방법
KR20170037750A (ko) * 2015-09-25 2017-04-05 일진머티리얼즈 주식회사 표면처리동박 및 그의 제조방법
KR20170038969A (ko) * 2015-09-30 2017-04-10 일진머티리얼즈 주식회사 표면처리동박 및 그의 제조방법
KR20170085425A (ko) * 2016-01-13 2017-07-24 엘에스엠트론 주식회사 동박, 그 제조방법, 그것을 포함하는 전극, 및 그것을 포함하는 이차전지
KR20180047897A (ko) 2016-11-01 2018-05-10 케이씨에프테크놀로지스 주식회사 표면처리 전해동박, 이의 제조방법, 및 이의 용도
CN106757191B (zh) * 2016-11-23 2019-10-01 苏州昕皓新材料科技有限公司 一种具有高择优取向的铜晶体颗粒及其制备方法
CN111655908B (zh) * 2017-12-05 2022-03-29 古河电气工业株式会社 表面处理铜箔以及使用该表面处理铜箔的覆铜层叠板和印刷布线板
JP6606317B1 (ja) * 2018-04-25 2019-11-13 古河電気工業株式会社 表面処理銅箔、銅張積層板、及びプリント配線板
JP7014695B2 (ja) * 2018-10-18 2022-02-01 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品
TWM593711U (zh) 2019-06-12 2020-04-11 金居開發股份有限公司 進階反轉電解銅箔及其銅箔基板
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
CN111394765A (zh) * 2020-04-02 2020-07-10 广东嘉元科技股份有限公司 一种电解铜箔表面处理工艺
CN113737238B (zh) * 2021-10-11 2023-04-11 中色奥博特铜铝业有限公司 一种超低轮廓度压延铜箔表面粗化处理方法
CN114184831B (zh) * 2021-11-04 2024-01-26 苏州浪潮智能科技有限公司 一种电源铜皮的通流能力检测方法和系统

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Also Published As

Publication number Publication date
EP1448036A1 (de) 2004-08-18
KR101090199B1 (ko) 2011-12-07
TWI366512B (de) 2012-06-21
KR20040073376A (ko) 2004-08-19
CN1551710B (zh) 2010-06-02
US20040157080A1 (en) 2004-08-12
CN1551710A (zh) 2004-12-01
EP1448036B1 (de) 2008-04-09
DE602004012910T2 (de) 2009-06-04
TW200500199A (en) 2005-01-01
US7052779B2 (en) 2006-05-30

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Date Code Title Description
8381 Inventor (new situation)

Inventor name: SHINOZAKI, KENSAKU, IMAICHI-CITY, TOCHIGI-KEN , JP

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: THE FURUKAWA ELECTRIC CO., LTD., TOKIO/TOKYO, JP