TWI365026B - Method for fabricating packaging substrate and base therefor - Google Patents

Method for fabricating packaging substrate and base therefor Download PDF

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Publication number
TWI365026B
TWI365026B TW098119494A TW98119494A TWI365026B TW I365026 B TWI365026 B TW I365026B TW 098119494 A TW098119494 A TW 098119494A TW 98119494 A TW98119494 A TW 98119494A TW I365026 B TWI365026 B TW I365026B
Authority
TW
Taiwan
Prior art keywords
layer
dielectric layer
auxiliary
release film
substrate
Prior art date
Application number
TW098119494A
Other languages
English (en)
Chinese (zh)
Other versions
TW201044940A (en
Inventor
Chin Ming Liu
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW098119494A priority Critical patent/TWI365026B/zh
Priority to JP2009263134A priority patent/JP5390346B2/ja
Priority to US12/780,439 priority patent/US8168513B2/en
Publication of TW201044940A publication Critical patent/TW201044940A/zh
Application granted granted Critical
Publication of TWI365026B publication Critical patent/TWI365026B/zh

Links

Classifications

    • H10P72/74—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H10W70/05—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW098119494A 2009-06-11 2009-06-11 Method for fabricating packaging substrate and base therefor TWI365026B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW098119494A TWI365026B (en) 2009-06-11 2009-06-11 Method for fabricating packaging substrate and base therefor
JP2009263134A JP5390346B2 (ja) 2009-06-11 2009-11-18 パッケージ基板の製造方法
US12/780,439 US8168513B2 (en) 2009-06-11 2010-05-14 Method for fabricating packaging substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098119494A TWI365026B (en) 2009-06-11 2009-06-11 Method for fabricating packaging substrate and base therefor

Publications (2)

Publication Number Publication Date
TW201044940A TW201044940A (en) 2010-12-16
TWI365026B true TWI365026B (en) 2012-05-21

Family

ID=43305372

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098119494A TWI365026B (en) 2009-06-11 2009-06-11 Method for fabricating packaging substrate and base therefor

Country Status (3)

Country Link
US (1) US8168513B2 (enExample)
JP (1) JP5390346B2 (enExample)
TW (1) TWI365026B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8354598B2 (en) 2009-06-23 2013-01-15 Unimicron Technology Corporation Packaging substrate and fabrication method thereof
TWI461135B (zh) * 2013-03-01 2014-11-11 Nan Ya Printed Circuit Board 製作電路板之方法
TWI463928B (zh) * 2012-09-25 2014-12-01 臻鼎科技股份有限公司 晶片封裝基板和結構及其製作方法
TWI489649B (zh) * 2008-01-11 2015-06-21 立敦照明珍朵夫公司 發光二極體總成及其生產之方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI365026B (en) * 2009-06-11 2012-05-21 Unimicron Technology Corp Method for fabricating packaging substrate and base therefor
KR101216926B1 (ko) * 2011-07-12 2012-12-28 삼성전기주식회사 캐리어 부재와 그 제조방법 및 이를 이용한 인쇄회로기판의 제조방법
KR101776322B1 (ko) * 2011-09-02 2017-09-07 엘지이노텍 주식회사 칩 패키지 부재 제조 방법
TWI442482B (zh) * 2011-10-17 2014-06-21 Advance Materials Corp 封裝基板之製法
US8685761B2 (en) * 2012-02-02 2014-04-01 Harris Corporation Method for making a redistributed electronic device using a transferrable redistribution layer
JP5955050B2 (ja) * 2012-03-26 2016-07-20 京セラ株式会社 配線基板の製造方法
JP6054080B2 (ja) * 2012-07-20 2016-12-27 新光電気工業株式会社 支持体及びその製造方法、配線基板の製造方法、電子部品装置の製造方法、配線構造体
TWI484600B (zh) * 2012-08-15 2015-05-11 Unimicron Technology Corp 無核心封裝基板及其製法
CN103681586B (zh) * 2012-08-30 2016-07-06 欣兴电子股份有限公司 无核心封装基板及其制法
CN104254197B (zh) * 2013-06-27 2017-10-27 碁鼎科技秦皇岛有限公司 电路板及其制作方法
TWI474449B (zh) * 2013-09-27 2015-02-21 旭德科技股份有限公司 封裝載板及其製作方法
TWI474450B (zh) * 2013-09-27 2015-02-21 旭德科技股份有限公司 封裝載板及其製作方法
TWI571994B (zh) * 2015-06-30 2017-02-21 旭德科技股份有限公司 封裝基板及其製作方法
KR101672641B1 (ko) * 2015-07-01 2016-11-03 앰코 테크놀로지 코리아 주식회사 반도체 디바이스의 제조 방법 및 이에 따른 반도체 디바이스
US11217445B2 (en) 2016-08-05 2022-01-04 Mitsubishi Gas Chemical Company, Inc. Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device
US11640934B2 (en) * 2018-03-30 2023-05-02 Intel Corporation Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate
DE102018215943A1 (de) * 2018-09-19 2020-03-19 Robert Bosch Gmbh Verfahren zum Fügen und elektrischen Kontaktieren von Einzelfolien eines Folienstapels und dessen Verwendung
US10624213B1 (en) * 2018-12-20 2020-04-14 Intel Corporation Asymmetric electronic substrate and method of manufacture

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7351300B2 (en) * 2001-08-22 2008-04-01 Semiconductor Energy Laboratory Co., Ltd. Peeling method and method of manufacturing semiconductor device
JP3854910B2 (ja) * 2002-08-21 2006-12-06 日本特殊陶業株式会社 配線基板の製造方法及び配線基板
JP2004087701A (ja) * 2002-08-26 2004-03-18 Nec Toppan Circuit Solutions Toyama Inc 多層配線構造の製造方法および半導体装置の搭載方法
JP2004186265A (ja) * 2002-11-29 2004-07-02 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
JP4267903B2 (ja) * 2002-11-29 2009-05-27 日本特殊陶業株式会社 多層配線基板の製造方法
JP2004214273A (ja) * 2002-12-27 2004-07-29 Ngk Spark Plug Co Ltd 片面積層配線基板の製造方法
JP4866268B2 (ja) * 2007-02-28 2012-02-01 新光電気工業株式会社 配線基板の製造方法及び電子部品装置の製造方法
TWI365026B (en) * 2009-06-11 2012-05-21 Unimicron Technology Corp Method for fabricating packaging substrate and base therefor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489649B (zh) * 2008-01-11 2015-06-21 立敦照明珍朵夫公司 發光二極體總成及其生產之方法
US8354598B2 (en) 2009-06-23 2013-01-15 Unimicron Technology Corporation Packaging substrate and fabrication method thereof
TWI463928B (zh) * 2012-09-25 2014-12-01 臻鼎科技股份有限公司 晶片封裝基板和結構及其製作方法
TWI461135B (zh) * 2013-03-01 2014-11-11 Nan Ya Printed Circuit Board 製作電路板之方法

Also Published As

Publication number Publication date
TW201044940A (en) 2010-12-16
JP5390346B2 (ja) 2014-01-15
US20100314037A1 (en) 2010-12-16
JP2010287874A (ja) 2010-12-24
US8168513B2 (en) 2012-05-01

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