TWI355545B - - Google Patents

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Publication number
TWI355545B
TWI355545B TW095136690A TW95136690A TWI355545B TW I355545 B TWI355545 B TW I355545B TW 095136690 A TW095136690 A TW 095136690A TW 95136690 A TW95136690 A TW 95136690A TW I355545 B TWI355545 B TW I355545B
Authority
TW
Taiwan
Prior art keywords
flat panel
panel display
group
sealing material
weight
Prior art date
Application number
TW095136690A
Other languages
English (en)
Chinese (zh)
Other versions
TW200720796A (en
Inventor
Yugo Yamamoto
Yuichi Ito
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of TW200720796A publication Critical patent/TW200720796A/zh
Application granted granted Critical
Publication of TWI355545B publication Critical patent/TWI355545B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647—Polyepoxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/055—Epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2209/00—Apparatus and processes for manufacture of discharge tubes
    • H01J2209/26—Sealing parts of the vessel to provide a vacuum enclosure
    • H01J2209/264—Materials for sealing vessels, e.g. frit glass compounds, resins or structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Sealing Material Composition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Epoxy Resins (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW095136690A 2005-10-03 2006-10-03 Sealing material for flat panel display TW200720796A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005289855 2005-10-03

Publications (2)

Publication Number Publication Date
TW200720796A TW200720796A (en) 2007-06-01
TWI355545B true TWI355545B (https=) 2012-01-01

Family

ID=37906250

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136690A TW200720796A (en) 2005-10-03 2006-10-03 Sealing material for flat panel display

Country Status (7)

Country Link
US (1) US7914641B2 (https=)
EP (1) EP1947157A1 (https=)
JP (1) JP4786663B2 (https=)
KR (1) KR101012971B1 (https=)
CN (1) CN101278028A (https=)
TW (1) TW200720796A (https=)
WO (1) WO2007040209A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101376319B1 (ko) * 2007-07-27 2014-03-20 주식회사 동진쎄미켐 디스플레이 소자의 실링방법
KR101245079B1 (ko) * 2008-09-29 2013-03-18 미쓰이 가가쿠 가부시키가이샤 봉지제 및 봉지 부재, 및 유기 ｅｌ 디바이스
KR101321683B1 (ko) * 2008-11-28 2013-10-23 미쓰이 가가쿠 가부시키가이샤 유기 ｅｌ 소자의 면 봉지제, 표시 장치의 제조방법 및 표시 장치
JP5965730B2 (ja) * 2011-06-03 2016-08-10 積水化学工業株式会社 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
CN103487995B (zh) * 2011-08-17 2018-01-09 积水化学工业株式会社 液晶显示元件用密封剂以及液晶显示元件
JPWO2013118509A1 (ja) * 2012-02-10 2015-05-11 三井化学株式会社 有機ｅｌ素子用の面封止剤、これを用いた有機ｅｌデバイス、及びその製造方法
JP5959274B2 (ja) * 2012-03-30 2016-08-02 古河電気工業株式会社 有機エレクトロルミネッセンス素子封止用樹脂組成物、これを用いた有機エレクトロルミネッセンス素子およびディスプレイ装置
JP5697048B2 (ja) 2012-06-15 2015-04-08 古河電気工業株式会社 有機エレクトロルミネッセンス素子封止用樹脂組成物、有機エレクトロルミネッセンス素子用封止フィルム、有機エレクトロルミネッセンス素子用ガスバリアフィルムおよびこれを用いた有機エレクトロルミネッセンス素子
JPWO2014017524A1 (ja) * 2012-07-26 2016-07-11 デンカ株式会社 樹脂組成物
US9021037B2 (en) 2012-12-06 2015-04-28 Airwatch Llc Systems and methods for controlling email access
US9787686B2 (en) 2013-04-12 2017-10-10 Airwatch Llc On-demand security policy activation
CN106062121B (zh) * 2014-05-02 2018-03-13 三井化学株式会社 密封材及其固化物
TWI671343B (zh) * 2014-06-27 2019-09-11 Fujifilm Corporation 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置
KR102016407B1 (ko) * 2015-06-18 2019-09-02 후지필름 가부시키가이샤 적층 필름
JP2017149794A (ja) * 2016-02-22 2017-08-31 三井化学株式会社 光硬化性樹脂組成物、表示素子シール剤、液晶シール剤及び液晶表示パネル
JP6554233B2 (ja) * 2017-05-08 2019-07-31 積水化学工業株式会社 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子
JP7199008B2 (ja) 2018-11-06 2023-01-05 パナソニックＩｐマネジメント株式会社 光硬化性組成物および液晶表示装置
CN110518145B (zh) * 2019-08-28 2022-02-22 云谷（固安）科技有限公司 薄膜封装结构及其制备方法、显示面板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW436491B (en) * 1997-08-22 2001-05-28 Ciba Sc Holding Ag Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions
JP2000330270A (ja) 1999-05-24 2000-11-30 Kunihiro Ichimura 塩基増殖剤、塩基増殖剤組成物、塩基反応性組成物及びパターン形成方法
WO2001012745A1 (fr) * 1999-08-12 2001-02-22 Mitsui Chemicals, Inc. Composition de resine photodurcissable pour materiau d'etancheite et procede correspondant
CN1125488C (zh) 2000-08-25 2003-10-22 中国科学院化学研究所 一种半导体封装用的液体环氧组合物及其用途
JP4836325B2 (ja) 2000-12-28 2011-12-14 昭和電工株式会社 封止樹脂用組成物
JP2003096184A (ja) * 2001-07-17 2003-04-03 Mitsui Chemicals Inc 光硬化型樹脂組成物
KR20030007186A (ko) * 2001-07-17 2003-01-23 미쯔이카가쿠 가부시기가이샤 광 양이온성 경화가능 수지 조성물 및 그 용도
JP2003277712A (ja) * 2002-03-26 2003-10-02 Asahi Kasei Corp 光硬化性封止接着剤
JP3821059B2 (ja) 2002-06-25 2006-09-13 松下電工株式会社 光半導体封止用エポキシ樹脂組成物及び光半導体装置
WO2004086145A1 (ja) * 2003-03-24 2004-10-07 Dai Nippon Printing Co. Ltd. 硬化性樹脂組成物、感光性パターン形成用硬化性樹脂組成物、カラーフィルター、液晶パネル用基板、及び、液晶パネル
WO2005014686A1 (ja) * 2003-08-12 2005-02-17 Mitsui Chemicals, Inc. 光硬化型樹脂組成物及びそれを用いたフラットパネルディスプレイ用シール剤
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
JP2005232369A (ja) * 2004-02-20 2005-09-02 Sekisui Chem Co Ltd 硬化性樹脂組成物、液晶滴下工法用シール剤、上下導通材料及び液晶表示素子
US20080161471A1 (en) * 2006-02-10 2008-07-03 Mitsui Chemicals, Inc. Resin Composition for Sealing Material, Sealing Material, Sealing Method, and Electroluminescent Display

Also Published As

Publication number Publication date
US7914641B2 (en) 2011-03-29
JPWO2007040209A1 (ja) 2009-04-16
EP1947157A1 (en) 2008-07-23
US20100152315A1 (en) 2010-06-17
KR101012971B1 (ko) 2011-02-10
JP4786663B2 (ja) 2011-10-05
WO2007040209A1 (ja) 2007-04-12
CN101278028A (zh) 2008-10-01
TW200720796A (en) 2007-06-01
KR20080059274A (ko) 2008-06-26

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MM4A Annulment or lapse of patent due to non-payment of fees