JP4786663B2 - フラットパネルディスプレイ用シール材 - Google Patents

フラットパネルディスプレイ用シール材 Download PDF

Info

Publication number
JP4786663B2
JP4786663B2 JP2007538760A JP2007538760A JP4786663B2 JP 4786663 B2 JP4786663 B2 JP 4786663B2 JP 2007538760 A JP2007538760 A JP 2007538760A JP 2007538760 A JP2007538760 A JP 2007538760A JP 4786663 B2 JP4786663 B2 JP 4786663B2
Authority
JP
Japan
Prior art keywords
group
flat panel
panel display
sealing material
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007538760A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2007040209A1 (ja
Inventor
祐五 山本
祐一 伊東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Priority to JP2007538760A priority Critical patent/JP4786663B2/ja
Publication of JPWO2007040209A1 publication Critical patent/JPWO2007040209A1/ja
Application granted granted Critical
Publication of JP4786663B2 publication Critical patent/JP4786663B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647—Polyepoxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/055—Epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2209/00—Apparatus and processes for manufacture of discharge tubes
    • H01J2209/26—Sealing parts of the vessel to provide a vacuum enclosure
    • H01J2209/264—Materials for sealing vessels, e.g. frit glass compounds, resins or structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Sealing Material Composition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Epoxy Resins (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2007538760A 2005-10-03 2006-10-02 フラットパネルディスプレイ用シール材 Expired - Fee Related JP4786663B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007538760A JP4786663B2 (ja) 2005-10-03 2006-10-02 フラットパネルディスプレイ用シール材

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005289855 2005-10-03
JP2005289855 2005-10-03
PCT/JP2006/319733 WO2007040209A1 (ja) 2005-10-03 2006-10-02 フラットパネルディスプレイ用シール材
JP2007538760A JP4786663B2 (ja) 2005-10-03 2006-10-02 フラットパネルディスプレイ用シール材

Publications (2)

Publication Number Publication Date
JPWO2007040209A1 JPWO2007040209A1 (ja) 2009-04-16
JP4786663B2 true JP4786663B2 (ja) 2011-10-05

Family

ID=37906250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007538760A Expired - Fee Related JP4786663B2 (ja) 2005-10-03 2006-10-02 フラットパネルディスプレイ用シール材

Country Status (7)

Country Link
US (1) US7914641B2 (https=)
EP (1) EP1947157A1 (https=)
JP (1) JP4786663B2 (https=)
KR (1) KR101012971B1 (https=)
CN (1) CN101278028A (https=)
TW (1) TW200720796A (https=)
WO (1) WO2007040209A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101376319B1 (ko) * 2007-07-27 2014-03-20 주식회사 동진쎄미켐 디스플레이 소자의 실링방법
KR101245079B1 (ko) * 2008-09-29 2013-03-18 미쓰이 가가쿠 가부시키가이샤 봉지제 및 봉지 부재, 및 유기 ｅｌ 디바이스
KR101321683B1 (ko) * 2008-11-28 2013-10-23 미쓰이 가가쿠 가부시키가이샤 유기 ｅｌ 소자의 면 봉지제, 표시 장치의 제조방법 및 표시 장치
JP5965730B2 (ja) * 2011-06-03 2016-08-10 積水化学工業株式会社 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
CN103487995B (zh) * 2011-08-17 2018-01-09 积水化学工业株式会社 液晶显示元件用密封剂以及液晶显示元件
JPWO2013118509A1 (ja) * 2012-02-10 2015-05-11 三井化学株式会社 有機ｅｌ素子用の面封止剤、これを用いた有機ｅｌデバイス、及びその製造方法
JP5959274B2 (ja) * 2012-03-30 2016-08-02 古河電気工業株式会社 有機エレクトロルミネッセンス素子封止用樹脂組成物、これを用いた有機エレクトロルミネッセンス素子およびディスプレイ装置
JP5697048B2 (ja) 2012-06-15 2015-04-08 古河電気工業株式会社 有機エレクトロルミネッセンス素子封止用樹脂組成物、有機エレクトロルミネッセンス素子用封止フィルム、有機エレクトロルミネッセンス素子用ガスバリアフィルムおよびこれを用いた有機エレクトロルミネッセンス素子
JPWO2014017524A1 (ja) * 2012-07-26 2016-07-11 デンカ株式会社 樹脂組成物
US9021037B2 (en) 2012-12-06 2015-04-28 Airwatch Llc Systems and methods for controlling email access
US9787686B2 (en) 2013-04-12 2017-10-10 Airwatch Llc On-demand security policy activation
CN106062121B (zh) * 2014-05-02 2018-03-13 三井化学株式会社 密封材及其固化物
TWI671343B (zh) * 2014-06-27 2019-09-11 Fujifilm Corporation 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置
KR102016407B1 (ko) * 2015-06-18 2019-09-02 후지필름 가부시키가이샤 적층 필름
JP2017149794A (ja) * 2016-02-22 2017-08-31 三井化学株式会社 光硬化性樹脂組成物、表示素子シール剤、液晶シール剤及び液晶表示パネル
JP6554233B2 (ja) * 2017-05-08 2019-07-31 積水化学工業株式会社 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子
JP7199008B2 (ja) 2018-11-06 2023-01-05 パナソニックＩｐマネジメント株式会社 光硬化性組成物および液晶表示装置
CN110518145B (zh) * 2019-08-28 2022-02-22 云谷（固安）科技有限公司 薄膜封装结构及其制备方法、显示面板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003096184A (ja) * 2001-07-17 2003-04-03 Mitsui Chemicals Inc 光硬化型樹脂組成物
JP2003277712A (ja) * 2002-03-26 2003-10-02 Asahi Kasei Corp 光硬化性封止接着剤
JP2005232369A (ja) * 2004-02-20 2005-09-02 Sekisui Chem Co Ltd 硬化性樹脂組成物、液晶滴下工法用シール剤、上下導通材料及び液晶表示素子

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW436491B (en) * 1997-08-22 2001-05-28 Ciba Sc Holding Ag Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions
JP2000330270A (ja) 1999-05-24 2000-11-30 Kunihiro Ichimura 塩基増殖剤、塩基増殖剤組成物、塩基反応性組成物及びパターン形成方法
WO2001012745A1 (fr) * 1999-08-12 2001-02-22 Mitsui Chemicals, Inc. Composition de resine photodurcissable pour materiau d'etancheite et procede correspondant
CN1125488C (zh) 2000-08-25 2003-10-22 中国科学院化学研究所 一种半导体封装用的液体环氧组合物及其用途
JP4836325B2 (ja) 2000-12-28 2011-12-14 昭和電工株式会社 封止樹脂用組成物
KR20030007186A (ko) * 2001-07-17 2003-01-23 미쯔이카가쿠 가부시기가이샤 광 양이온성 경화가능 수지 조성물 및 그 용도
JP3821059B2 (ja) 2002-06-25 2006-09-13 松下電工株式会社 光半導体封止用エポキシ樹脂組成物及び光半導体装置
WO2004086145A1 (ja) * 2003-03-24 2004-10-07 Dai Nippon Printing Co. Ltd. 硬化性樹脂組成物、感光性パターン形成用硬化性樹脂組成物、カラーフィルター、液晶パネル用基板、及び、液晶パネル
WO2005014686A1 (ja) * 2003-08-12 2005-02-17 Mitsui Chemicals, Inc. 光硬化型樹脂組成物及びそれを用いたフラットパネルディスプレイ用シール剤
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
US20080161471A1 (en) * 2006-02-10 2008-07-03 Mitsui Chemicals, Inc. Resin Composition for Sealing Material, Sealing Material, Sealing Method, and Electroluminescent Display

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003096184A (ja) * 2001-07-17 2003-04-03 Mitsui Chemicals Inc 光硬化型樹脂組成物
JP2003277712A (ja) * 2002-03-26 2003-10-02 Asahi Kasei Corp 光硬化性封止接着剤
JP2005232369A (ja) * 2004-02-20 2005-09-02 Sekisui Chem Co Ltd 硬化性樹脂組成物、液晶滴下工法用シール剤、上下導通材料及び液晶表示素子

Also Published As

Publication number Publication date
US7914641B2 (en) 2011-03-29
TWI355545B (https=) 2012-01-01
JPWO2007040209A1 (ja) 2009-04-16
EP1947157A1 (en) 2008-07-23
US20100152315A1 (en) 2010-06-17
KR101012971B1 (ko) 2011-02-10
WO2007040209A1 (ja) 2007-04-12
CN101278028A (zh) 2008-10-01
TW200720796A (en) 2007-06-01
KR20080059274A (ko) 2008-06-26

Similar Documents

Publication Publication Date Title
JP4786663B2 (ja) フラットパネルディスプレイ用シール材
CN102472928B (zh) 液晶滴下工艺用液晶密封剂以及使用了该密封剂的液晶显示单元
KR20100084162A (ko) 액정 실링제 및 이것을 사용한 액정 표시 셀
KR101194558B1 (ko) 액정 실란트 및 그것을 사용하여 제조한 액정표시 셀
JP2010018797A (ja) 光学部品用硬化性組成物、光学部品用接着剤及び有機エレクトロルミネッセンス素子用封止剤
JPWO2011118191A1 (ja) 液晶シール剤、それを用いた液晶表示パネルの製造方法、および液晶表示パネル
JP6014325B2 (ja) 有機エレクトロルミネッセンス表示素子用封止剤
JP2009098187A (ja) 光学部品用接着剤
JPWO2012011220A1 (ja) 液晶シール剤及びそれを用いた液晶表示セル
KR101342155B1 (ko) 액정 실링제 및 이를 이용한 액정 표시 셀
JP2009298887A (ja) 光学部品用硬化性組成物
JP2004037937A (ja) 液晶シール剤およびそれを用いた液晶表示セル
KR102016781B1 (ko) 액정 시일제 및 그것을 사용한 액정 표시 셀
KR20190049451A (ko) 디스플레이용 봉지제 및 그것을 이용한 액정 표시 셀
JP5555614B2 (ja) 有機エレクトロルミネッセンス表示素子用封止剤
JP2010197692A (ja) 光学部材用光硬化性樹脂組成物、接着剤、及び、タッチパネル
TW201728604A (zh) 二苯基乙二酮之單縮酮化物及其用途
JP2013015646A (ja) 液晶シール剤及びそれを用いた液晶表示セル
JP4937410B2 (ja) 色素増感型太陽電池用封止剤及び色素増感型太陽電池
EP1873223A1 (en) Resin composition for sealing material, sealing material, sealing method and electroluminescent display
KR20190044497A (ko) 디스플레이용 봉지제 및 그것을 이용한 액정 시일제, 그리고 액정 표시 셀
JP4909581B2 (ja) 有機ｅｌ素子のシール方法
JP2016038508A (ja) 液晶シール剤及びそれを用いた液晶表示セル
WO2018129686A1 (en) Radiation curable sealant composition
JP2005115255A (ja) 液晶シール剤及びそれを用いた液晶表示セル

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110405

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110606

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20110606

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110705

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110713

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140722

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees