TW200720796A - Sealing material for flat panel display - Google Patents
Sealing material for flat panel displayInfo
- Publication number
- TW200720796A TW200720796A TW095136690A TW95136690A TW200720796A TW 200720796 A TW200720796 A TW 200720796A TW 095136690 A TW095136690 A TW 095136690A TW 95136690 A TW95136690 A TW 95136690A TW 200720796 A TW200720796 A TW 200720796A
- Authority
- TW
- Taiwan
- Prior art keywords
- sealing material
- compound
- flat panel
- irradiated
- generates
- Prior art date
Links
- 239000003566 sealing material Substances 0.000 title abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 4
- 230000005855 radiation Effects 0.000 abstract 3
- 239000002253 acid Substances 0.000 abstract 1
- 150000007513 acids Chemical class 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 150000003512 tertiary amines Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
- C09K2200/0647—Polyepoxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
- C09K2323/055—Epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2209/00—Apparatus and processes for manufacture of discharge tubes
- H01J2209/26—Sealing parts of the vessel to provide a vacuum enclosure
- H01J2209/264—Materials for sealing vessels, e.g. frit glass compounds, resins or structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Sealing Material Composition (AREA)
- Electroluminescent Light Sources (AREA)
- Epoxy Resins (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005289855 | 2005-10-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200720796A true TW200720796A (en) | 2007-06-01 |
TWI355545B TWI355545B (zh) | 2012-01-01 |
Family
ID=37906250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095136690A TW200720796A (en) | 2005-10-03 | 2006-10-03 | Sealing material for flat panel display |
Country Status (7)
Country | Link |
---|---|
US (1) | US7914641B2 (zh) |
EP (1) | EP1947157A1 (zh) |
JP (1) | JP4786663B2 (zh) |
KR (1) | KR101012971B1 (zh) |
CN (1) | CN101278028A (zh) |
TW (1) | TW200720796A (zh) |
WO (1) | WO2007040209A1 (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101376319B1 (ko) * | 2007-07-27 | 2014-03-20 | 주식회사 동진쎄미켐 | 디스플레이 소자의 실링방법 |
KR101245079B1 (ko) * | 2008-09-29 | 2013-03-18 | 미쓰이 가가쿠 가부시키가이샤 | 봉지제 및 봉지 부재, 및 유기 el 디바이스 |
JP5639476B2 (ja) * | 2008-11-28 | 2014-12-10 | 三井化学株式会社 | 有機el素子の面封止剤、表示装置の製造方法および表示装置 |
JP5965730B2 (ja) * | 2011-06-03 | 2016-08-10 | 積水化学工業株式会社 | 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子 |
WO2013024768A1 (ja) * | 2011-08-17 | 2013-02-21 | 積水化学工業株式会社 | 液晶表示素子用シール剤及び液晶表示素子 |
CN104105733A (zh) * | 2012-02-10 | 2014-10-15 | 三井化学株式会社 | 有机el元件用面封装剂、使用该面封装剂的有机el装置及其制造方法 |
JP5959274B2 (ja) * | 2012-03-30 | 2016-08-02 | 古河電気工業株式会社 | 有機エレクトロルミネッセンス素子封止用樹脂組成物、これを用いた有機エレクトロルミネッセンス素子およびディスプレイ装置 |
JP5697048B2 (ja) | 2012-06-15 | 2015-04-08 | 古河電気工業株式会社 | 有機エレクトロルミネッセンス素子封止用樹脂組成物、有機エレクトロルミネッセンス素子用封止フィルム、有機エレクトロルミネッセンス素子用ガスバリアフィルムおよびこれを用いた有機エレクトロルミネッセンス素子 |
WO2014017524A1 (ja) * | 2012-07-26 | 2014-01-30 | 電気化学工業株式会社 | 樹脂組成物 |
US9021037B2 (en) | 2012-12-06 | 2015-04-28 | Airwatch Llc | Systems and methods for controlling email access |
US9787686B2 (en) | 2013-04-12 | 2017-10-10 | Airwatch Llc | On-demand security policy activation |
CN106062121B (zh) * | 2014-05-02 | 2018-03-13 | 三井化学株式会社 | 密封材及其固化物 |
TWI671343B (zh) * | 2014-06-27 | 2019-09-11 | 日商富士軟片股份有限公司 | 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置 |
WO2016204181A1 (ja) * | 2015-06-18 | 2016-12-22 | 富士フイルム株式会社 | 積層フィルム |
JP2017149794A (ja) * | 2016-02-22 | 2017-08-31 | 三井化学株式会社 | 光硬化性樹脂組成物、表示素子シール剤、液晶シール剤及び液晶表示パネル |
CN110168441B (zh) * | 2017-05-08 | 2022-07-29 | 积水化学工业株式会社 | 液晶显示元件用密封剂、上下导通材料和液晶显示元件 |
JP7199008B2 (ja) | 2018-11-06 | 2023-01-05 | パナソニックIpマネジメント株式会社 | 光硬化性組成物および液晶表示装置 |
CN110518145B (zh) * | 2019-08-28 | 2022-02-22 | 云谷(固安)科技有限公司 | 薄膜封装结构及其制备方法、显示面板 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW436491B (en) * | 1997-08-22 | 2001-05-28 | Ciba Sc Holding Ag | Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions |
JP2000330270A (ja) | 1999-05-24 | 2000-11-30 | Kunihiro Ichimura | 塩基増殖剤、塩基増殖剤組成物、塩基反応性組成物及びパターン形成方法 |
KR20010080093A (ko) * | 1999-08-12 | 2001-08-22 | 사토 아키오 | 실링제용광경화형수지조성물 및 실링방법. |
CN1125488C (zh) | 2000-08-25 | 2003-10-22 | 中国科学院化学研究所 | 一种半导体封装用的液体环氧组合物及其用途 |
JP4836325B2 (ja) | 2000-12-28 | 2011-12-14 | 昭和電工株式会社 | 封止樹脂用組成物 |
KR20030007186A (ko) | 2001-07-17 | 2003-01-23 | 미쯔이카가쿠 가부시기가이샤 | 광 양이온성 경화가능 수지 조성물 및 그 용도 |
JP2003096184A (ja) * | 2001-07-17 | 2003-04-03 | Mitsui Chemicals Inc | 光硬化型樹脂組成物 |
JP2003277712A (ja) * | 2002-03-26 | 2003-10-02 | Asahi Kasei Corp | 光硬化性封止接着剤 |
JP3821059B2 (ja) | 2002-06-25 | 2006-09-13 | 松下電工株式会社 | 光半導体封止用エポキシ樹脂組成物及び光半導体装置 |
WO2004086145A1 (ja) * | 2003-03-24 | 2004-10-07 | Dai Nippon Printing Co. Ltd. | 硬化性樹脂組成物、感光性パターン形成用硬化性樹脂組成物、カラーフィルター、液晶パネル用基板、及び、液晶パネル |
US7495035B2 (en) * | 2003-08-12 | 2009-02-24 | Mitsui Chemicals, Inc. | Photo-curable resin composition and sealing agent for flat panel display using the same |
US20050126697A1 (en) * | 2003-12-11 | 2005-06-16 | International Business Machines Corporation | Photochemically and thermally curable adhesive formulations |
JP2005232369A (ja) * | 2004-02-20 | 2005-09-02 | Sekisui Chem Co Ltd | 硬化性樹脂組成物、液晶滴下工法用シール剤、上下導通材料及び液晶表示素子 |
US20080161471A1 (en) * | 2006-02-10 | 2008-07-03 | Mitsui Chemicals, Inc. | Resin Composition for Sealing Material, Sealing Material, Sealing Method, and Electroluminescent Display |
-
2006
- 2006-10-02 JP JP2007538760A patent/JP4786663B2/ja not_active Expired - Fee Related
- 2006-10-02 US US12/089,152 patent/US7914641B2/en not_active Expired - Fee Related
- 2006-10-02 KR KR1020087010483A patent/KR101012971B1/ko not_active IP Right Cessation
- 2006-10-02 CN CNA2006800365502A patent/CN101278028A/zh active Pending
- 2006-10-02 WO PCT/JP2006/319733 patent/WO2007040209A1/ja active Application Filing
- 2006-10-02 EP EP06811081A patent/EP1947157A1/en not_active Withdrawn
- 2006-10-03 TW TW095136690A patent/TW200720796A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7914641B2 (en) | 2011-03-29 |
US20100152315A1 (en) | 2010-06-17 |
JPWO2007040209A1 (ja) | 2009-04-16 |
KR101012971B1 (ko) | 2011-02-10 |
TWI355545B (zh) | 2012-01-01 |
EP1947157A1 (en) | 2008-07-23 |
KR20080059274A (ko) | 2008-06-26 |
CN101278028A (zh) | 2008-10-01 |
WO2007040209A1 (ja) | 2007-04-12 |
JP4786663B2 (ja) | 2011-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |