KR101012971B1 - 플랫 패널 디스플레이용 실링재 - Google Patents

플랫 패널 디스플레이용 실링재 Download PDF

Info

Publication number
KR101012971B1
KR101012971B1 KR1020087010483A KR20087010483A KR101012971B1 KR 101012971 B1 KR101012971 B1 KR 101012971B1 KR 1020087010483 A KR1020087010483 A KR 1020087010483A KR 20087010483 A KR20087010483 A KR 20087010483A KR 101012971 B1 KR101012971 B1 KR 101012971B1
Authority
KR
South Korea
Prior art keywords
flat panel
group
formula
sealing material
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020087010483A
Other languages
English (en)
Korean (ko)
Other versions
KR20080059274A (ko
Inventor
유고 야마모토
유이치 이토
Original Assignee
미쓰이 가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이 가가쿠 가부시키가이샤 filed Critical 미쓰이 가가쿠 가부시키가이샤
Publication of KR20080059274A publication Critical patent/KR20080059274A/ko
Application granted granted Critical
Publication of KR101012971B1 publication Critical patent/KR101012971B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0647—Polyepoxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/055—Epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2209/00—Apparatus and processes for manufacture of discharge tubes
    • H01J2209/26—Sealing parts of the vessel to provide a vacuum enclosure
    • H01J2209/264—Materials for sealing vessels, e.g. frit glass compounds, resins or structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Sealing Material Composition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Epoxy Resins (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020087010483A 2005-10-03 2006-10-02 플랫 패널 디스플레이용 실링재 Expired - Fee Related KR101012971B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005289855 2005-10-03
JPJP-P-2005-00289855 2005-10-03

Publications (2)

Publication Number Publication Date
KR20080059274A KR20080059274A (ko) 2008-06-26
KR101012971B1 true KR101012971B1 (ko) 2011-02-10

Family

ID=37906250

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087010483A Expired - Fee Related KR101012971B1 (ko) 2005-10-03 2006-10-02 플랫 패널 디스플레이용 실링재

Country Status (7)

Country Link
US (1) US7914641B2 (https=)
EP (1) EP1947157A1 (https=)
JP (1) JP4786663B2 (https=)
KR (1) KR101012971B1 (https=)
CN (1) CN101278028A (https=)
TW (1) TW200720796A (https=)
WO (1) WO2007040209A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101376319B1 (ko) * 2007-07-27 2014-03-20 주식회사 동진쎄미켐 디스플레이 소자의 실링방법
KR101245079B1 (ko) * 2008-09-29 2013-03-18 미쓰이 가가쿠 가부시키가이샤 봉지제 및 봉지 부재, 및 유기 ｅｌ 디바이스
KR101321683B1 (ko) * 2008-11-28 2013-10-23 미쓰이 가가쿠 가부시키가이샤 유기 ｅｌ 소자의 면 봉지제, 표시 장치의 제조방법 및 표시 장치
JP5965730B2 (ja) * 2011-06-03 2016-08-10 積水化学工業株式会社 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
CN103487995B (zh) * 2011-08-17 2018-01-09 积水化学工业株式会社 液晶显示元件用密封剂以及液晶显示元件
JPWO2013118509A1 (ja) * 2012-02-10 2015-05-11 三井化学株式会社 有機ｅｌ素子用の面封止剤、これを用いた有機ｅｌデバイス、及びその製造方法
JP5959274B2 (ja) * 2012-03-30 2016-08-02 古河電気工業株式会社 有機エレクトロルミネッセンス素子封止用樹脂組成物、これを用いた有機エレクトロルミネッセンス素子およびディスプレイ装置
JP5697048B2 (ja) 2012-06-15 2015-04-08 古河電気工業株式会社 有機エレクトロルミネッセンス素子封止用樹脂組成物、有機エレクトロルミネッセンス素子用封止フィルム、有機エレクトロルミネッセンス素子用ガスバリアフィルムおよびこれを用いた有機エレクトロルミネッセンス素子
JPWO2014017524A1 (ja) * 2012-07-26 2016-07-11 デンカ株式会社 樹脂組成物
US9021037B2 (en) 2012-12-06 2015-04-28 Airwatch Llc Systems and methods for controlling email access
US9787686B2 (en) 2013-04-12 2017-10-10 Airwatch Llc On-demand security policy activation
CN106062121B (zh) * 2014-05-02 2018-03-13 三井化学株式会社 密封材及其固化物
TWI671343B (zh) * 2014-06-27 2019-09-11 Fujifilm Corporation 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置
KR102016407B1 (ko) * 2015-06-18 2019-09-02 후지필름 가부시키가이샤 적층 필름
JP2017149794A (ja) * 2016-02-22 2017-08-31 三井化学株式会社 光硬化性樹脂組成物、表示素子シール剤、液晶シール剤及び液晶表示パネル
JP6554233B2 (ja) * 2017-05-08 2019-07-31 積水化学工業株式会社 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子
JP7199008B2 (ja) 2018-11-06 2023-01-05 パナソニックＩｐマネジメント株式会社 光硬化性組成物および液晶表示装置
CN110518145B (zh) * 2019-08-28 2022-02-22 云谷（固安）科技有限公司 薄膜封装结构及其制备方法、显示面板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277712A (ja) * 2002-03-26 2003-10-02 Asahi Kasei Corp 光硬化性封止接着剤
JP2005232369A (ja) * 2004-02-20 2005-09-02 Sekisui Chem Co Ltd 硬化性樹脂組成物、液晶滴下工法用シール剤、上下導通材料及び液晶表示素子

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW436491B (en) * 1997-08-22 2001-05-28 Ciba Sc Holding Ag Compositions for use in base-catalysed reactions, a process for curing said compostions and a process for photochemically generating bases in base catalysed polymeriaztion reactions
JP2000330270A (ja) 1999-05-24 2000-11-30 Kunihiro Ichimura 塩基増殖剤、塩基増殖剤組成物、塩基反応性組成物及びパターン形成方法
WO2001012745A1 (fr) * 1999-08-12 2001-02-22 Mitsui Chemicals, Inc. Composition de resine photodurcissable pour materiau d'etancheite et procede correspondant
CN1125488C (zh) 2000-08-25 2003-10-22 中国科学院化学研究所 一种半导体封装用的液体环氧组合物及其用途
JP4836325B2 (ja) 2000-12-28 2011-12-14 昭和電工株式会社 封止樹脂用組成物
JP2003096184A (ja) * 2001-07-17 2003-04-03 Mitsui Chemicals Inc 光硬化型樹脂組成物
KR20030007186A (ko) * 2001-07-17 2003-01-23 미쯔이카가쿠 가부시기가이샤 광 양이온성 경화가능 수지 조성물 및 그 용도
JP3821059B2 (ja) 2002-06-25 2006-09-13 松下電工株式会社 光半導体封止用エポキシ樹脂組成物及び光半導体装置
WO2004086145A1 (ja) * 2003-03-24 2004-10-07 Dai Nippon Printing Co. Ltd. 硬化性樹脂組成物、感光性パターン形成用硬化性樹脂組成物、カラーフィルター、液晶パネル用基板、及び、液晶パネル
WO2005014686A1 (ja) * 2003-08-12 2005-02-17 Mitsui Chemicals, Inc. 光硬化型樹脂組成物及びそれを用いたフラットパネルディスプレイ用シール剤
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
US20080161471A1 (en) * 2006-02-10 2008-07-03 Mitsui Chemicals, Inc. Resin Composition for Sealing Material, Sealing Material, Sealing Method, and Electroluminescent Display

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003277712A (ja) * 2002-03-26 2003-10-02 Asahi Kasei Corp 光硬化性封止接着剤
JP2005232369A (ja) * 2004-02-20 2005-09-02 Sekisui Chem Co Ltd 硬化性樹脂組成物、液晶滴下工法用シール剤、上下導通材料及び液晶表示素子

Also Published As

Publication number Publication date
US7914641B2 (en) 2011-03-29
TWI355545B (https=) 2012-01-01
JPWO2007040209A1 (ja) 2009-04-16
EP1947157A1 (en) 2008-07-23
US20100152315A1 (en) 2010-06-17
JP4786663B2 (ja) 2011-10-05
WO2007040209A1 (ja) 2007-04-12
CN101278028A (zh) 2008-10-01
TW200720796A (en) 2007-06-01
KR20080059274A (ko) 2008-06-26

Similar Documents

Publication Publication Date Title
KR101012971B1 (ko) 플랫 패널 디스플레이용 실링재
CN102612521B (zh) 新型热自由基产生剂、其制造方法、液晶密封剂和液晶显示单元
CN102472928B (zh) 液晶滴下工艺用液晶密封剂以及使用了该密封剂的液晶显示单元
KR101194558B1 (ko) 액정 실란트 및 그것을 사용하여 제조한 액정표시 셀
WO2005052021A1 (ja) １液型の光及び熱併用硬化性樹脂組成物及びその用途
WO2004090621A1 (ja) 液晶シール剤およびそれを用いた液晶表示セル
KR20100084162A (ko) 액정 실링제 및 이것을 사용한 액정 표시 셀
KR20130140544A (ko) 액정 실링제 및 그것을 사용한 액정 표시셀
JP6014325B2 (ja) 有機エレクトロルミネッセンス表示素子用封止剤
JP2010018797A (ja) 光学部品用硬化性組成物、光学部品用接着剤及び有機エレクトロルミネッセンス素子用封止剤
KR20110090947A (ko) 유기 ｅｌ 소자의 면 봉지제, 표시 장치의 제조방법 및 표시 장치
KR101342155B1 (ko) 액정 실링제 및 이를 이용한 액정 표시 셀
JP2018203910A (ja) 電子部品用樹脂組成物
CN108700785A (zh) 显示元件密封剂、液晶密封剂及其固化物以及液晶显示面板及其制造方法
KR101189591B1 (ko) 방사선 경화성 수지, 액정 실링제 및 이것을 사용한 액정표시 셀
JP2009298887A (ja) 光学部品用硬化性組成物
JP5555614B2 (ja) 有機エレクトロルミネッセンス表示素子用封止剤
KR20060061821A (ko) 광경화형 수지 조성물 및 그것을 이용한 플랫 패널디스플레이용 실링제
JP2010197692A (ja) 光学部材用光硬化性樹脂組成物、接着剤、及び、タッチパネル
JP2013157205A (ja) 有機エレクトロルミネッセンス表示素子用封止剤
JP2009013282A (ja) 液晶シール剤およびそれを用いた液晶表示セル
KR102019660B1 (ko) 광경화성 수지 조성물, 표시 소자 실링제, 액정 표시 소자 실링제, 및 액정 표시 패널과 그의 제조 방법
KR20240032949A (ko) 경화성 수지 조성물
JP4909581B2 (ja) 有機ｅｌ素子のシール方法
KR20090021797A (ko) 표면처리된 무기물을 포함하는 액정 디스플레이 패널용밀봉제 조성물

Legal Events

Date Code Title Description
A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20140107

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20150116

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160119

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20170120

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20180119

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20190128

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20190128

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000