TWI352735B - - Google Patents
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- TWI352735B TWI352735B TW96100913A TW96100913A TWI352735B TW I352735 B TWI352735 B TW I352735B TW 96100913 A TW96100913 A TW 96100913A TW 96100913 A TW96100913 A TW 96100913A TW I352735 B TWI352735 B TW I352735B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- weight
- polishing pad
- surfactant
- isocyanate
- Prior art date
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- 238000005498 polishing Methods 0.000 claims description 176
- 239000004094 surface-active agent Substances 0.000 claims description 28
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- 239000012948 isocyanate Substances 0.000 claims description 22
- 150000002513 isocyanates Chemical class 0.000 claims description 22
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- 239000004065 semiconductor Substances 0.000 claims description 20
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- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
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- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 5
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- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
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- 238000010438 heat treatment Methods 0.000 description 2
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- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- QPILZZVXGUNELN-UHFFFAOYSA-M sodium;4-amino-5-hydroxynaphthalene-2,7-disulfonate;hydron Chemical compound [Na+].OS(=O)(=O)C1=CC(O)=C2C(N)=CC(S([O-])(=O)=O)=CC2=C1 QPILZZVXGUNELN-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/61—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2101/00—Manufacture of cellular products
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0025—Foam properties rigid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polyurethanes Or Polyureas (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006002608 | 2006-01-10 | ||
| JP2006006210A JP5031236B2 (ja) | 2006-01-10 | 2006-01-13 | 研磨パッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200736373A TW200736373A (en) | 2007-10-01 |
| TWI352735B true TWI352735B (enExample) | 2011-11-21 |
Family
ID=38256254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096100913A TW200736373A (en) | 2006-01-10 | 2007-01-10 | Polishing pad |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8094456B2 (enExample) |
| JP (1) | JP5031236B2 (enExample) |
| MY (1) | MY149939A (enExample) |
| TW (1) | TW200736373A (enExample) |
| WO (1) | WO2007080848A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI488712B (zh) * | 2011-12-16 | 2015-06-21 | Toyo Tire & Rubber Co | Polishing pad and manufacturing method thereof |
| TWI715539B (zh) * | 2014-09-11 | 2021-01-11 | 日商荏原製作所股份有限公司 | 處理模組、處理裝置、及處理方法 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100909605B1 (ko) * | 2005-03-08 | 2009-07-27 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| KR101134058B1 (ko) * | 2005-05-17 | 2012-04-16 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| SG162794A1 (en) * | 2005-07-15 | 2010-07-29 | Toyo Tire & Rubber Co | Layered sheets and processes for producing the same |
| JP4884725B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4884726B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
| WO2008026451A1 (fr) | 2006-08-28 | 2008-03-06 | Toyo Tire & Rubber Co., Ltd. | Tampon de polissage |
| JP5008927B2 (ja) | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
| US20100009611A1 (en) * | 2006-09-08 | 2010-01-14 | Toyo Tire & Rubber Co., Ltd. | Method for manufacturing a polishing pad |
| US8257153B2 (en) | 2007-01-15 | 2012-09-04 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and a method for manufacturing the same |
| JP5078000B2 (ja) | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5230227B2 (ja) * | 2008-03-10 | 2013-07-10 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4593643B2 (ja) * | 2008-03-12 | 2010-12-08 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5306677B2 (ja) * | 2008-03-13 | 2013-10-02 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5945874B2 (ja) * | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| JP6222930B2 (ja) * | 2013-01-15 | 2017-11-01 | 東洋ゴム工業株式会社 | センサ |
Family Cites Families (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0291279A (ja) | 1988-09-29 | 1990-03-30 | Achilles Corp | 合成皮革及びその製造方法 |
| GB9216631D0 (en) * | 1992-08-05 | 1992-09-16 | Ici Plc | Reaction system for preparing microcellular elastomers |
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| JPH06220151A (ja) | 1993-01-22 | 1994-08-09 | Sanyo Chem Ind Ltd | 研磨材用ポリウレタン樹脂 |
| JPH0871378A (ja) | 1994-09-09 | 1996-03-19 | Kanegafuchi Chem Ind Co Ltd | 中空糸膜ポッティング用ウレタン樹脂 |
| US5614575A (en) * | 1995-04-24 | 1997-03-25 | Rpg. Inc. | Sprayable polyurethane compositions |
| US5587502A (en) | 1995-06-02 | 1996-12-24 | Minnesota Mining & Manufacturing Company | Hydroxy functional alkoxysilane and alkoxysilane functional polyurethane made therefrom |
| WO1998045087A1 (en) | 1997-04-04 | 1998-10-15 | Rodel Holdings, Inc. | Improved polishing pads and methods relating thereto |
| WO1999007515A1 (en) | 1997-08-06 | 1999-02-18 | Rodel Holdings, Inc. | Improved polishing pads and methods relating thereto |
| JP2000017252A (ja) | 1998-06-29 | 2000-01-18 | Dainippon Ink & Chem Inc | 研磨材組成物及びその研磨材 |
| JP3516874B2 (ja) | 1998-12-15 | 2004-04-05 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法及び研磨シート |
| US6354915B1 (en) | 1999-01-21 | 2002-03-12 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| JP2000248034A (ja) | 1999-03-02 | 2000-09-12 | Mitsubishi Chemicals Corp | 研磨材用ポリウレタン系樹脂組成物及びその発泡体 |
| JP3316756B2 (ja) | 1999-06-04 | 2002-08-19 | 富士紡績株式会社 | 研磨パッド用ウレタン成形物の製造方法及び研磨パッド用ウレタン成形物 |
| JP3880028B2 (ja) | 1999-08-06 | 2007-02-14 | Ｊｓｒ株式会社 | 研磨パッド用重合体組成物及びそれを用いた研磨パッド |
| JP3558273B2 (ja) | 1999-09-22 | 2004-08-25 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法及び研磨シート |
| JP4296655B2 (ja) | 1999-10-12 | 2009-07-15 | 東レ株式会社 | 半導体基板用研磨パッド |
| JP2001277101A (ja) | 2000-03-28 | 2001-10-09 | Rodel Nitta Co | 研磨布 |
| WO2001096434A1 (en) | 2000-06-13 | 2001-12-20 | Toyo Tire & Rubber Co., Ltd. | Process for producing polyurethane foam, polyurethane foam, and abrasive sheet |
| US20020016139A1 (en) * | 2000-07-25 | 2002-02-07 | Kazuto Hirokawa | Polishing tool and manufacturing method therefor |
| JP2003011066A (ja) | 2000-07-25 | 2003-01-15 | Ebara Corp | 研磨工具及びその製造方法 |
| JP2002059358A (ja) | 2000-08-24 | 2002-02-26 | Toray Ind Inc | 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法 |
| US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| US6679769B2 (en) * | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| US6641471B1 (en) | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| JP3826702B2 (ja) | 2000-10-24 | 2006-09-27 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| US6706383B1 (en) * | 2001-11-27 | 2004-03-16 | Psiloquest, Inc. | Polishing pad support that improves polishing performance and longevity |
| WO2002059175A2 (en) * | 2001-01-24 | 2002-08-01 | Huntsman International Llc | Molded foam articles prepared with reduced mold residence time and improved quality |
| JP3455187B2 (ja) | 2001-02-01 | 2003-10-14 | 東洋ゴム工業株式会社 | 研磨パッド用ポリウレタン発泡体の製造装置 |
| JP2002239905A (ja) | 2001-02-21 | 2002-08-28 | Allied Material Corp | Ｃｍｐ用パッドコンディショナー及びその製造方法 |
| US7378454B2 (en) * | 2001-04-09 | 2008-05-27 | Toyo Tire & Rubber Co., Ltd. | Polyurethane composition and polishing pad |
| JP2003062748A (ja) | 2001-08-24 | 2003-03-05 | Inoac Corp | 研磨用パッド |
| JP2003089051A (ja) | 2001-09-17 | 2003-03-25 | Tokyo Seimitsu Co Ltd | 研磨装置 |
| JP3851135B2 (ja) | 2001-10-17 | 2006-11-29 | ニッタ・ハース株式会社 | 研磨パッド |
| KR100877390B1 (ko) | 2001-11-13 | 2009-01-07 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| JP2003145414A (ja) | 2001-11-13 | 2003-05-20 | Toyobo Co Ltd | 研磨パッド及びその製造方法 |
| JP3325562B1 (ja) | 2001-12-07 | 2002-09-17 | 東洋ゴム工業株式会社 | 発泡ポリウレタン研磨パッドの製造方法 |
| JP3455208B2 (ja) * | 2001-11-13 | 2003-10-14 | 東洋紡績株式会社 | 半導体ウエハ研磨パッド、半導体ウエハの研磨方法、研磨パッド用研磨シート、及び研磨シート用発泡体ブロック |
| KR100467765B1 (ko) | 2002-02-04 | 2005-01-24 | 에스케이씨 주식회사 | 고경도 및 우수한 내마모성을 갖는 폴리우레탄 탄성체제조용 조성물 |
| JP3571334B2 (ja) | 2002-05-20 | 2004-09-29 | 東洋紡績株式会社 | 研磨パッド |
| JP2004167680A (ja) | 2002-05-20 | 2004-06-17 | Toyobo Co Ltd | 研磨パッド |
| JP4101584B2 (ja) | 2002-08-09 | 2008-06-18 | 東洋ゴム工業株式会社 | 研磨シート用ポリウレタン発泡体及びその製造方法、研磨パッド用研磨シート、並びに研磨パッド |
| US7094811B2 (en) * | 2002-10-03 | 2006-08-22 | Bayer Corporation | Energy absorbing flexible foams produced in part with a double metal cyanide catalyzed polyol |
| US8845852B2 (en) * | 2002-11-27 | 2014-09-30 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and method of producing semiconductor device |
| JP4078643B2 (ja) | 2002-12-10 | 2008-04-23 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法、研磨パッド、及び半導体デバイスの製造方法 |
| JP4233319B2 (ja) | 2002-12-12 | 2009-03-04 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法及び研磨パッド |
| JP3637568B2 (ja) | 2002-12-17 | 2005-04-13 | 大日本インキ化学工業株式会社 | 二液硬化型発泡砥石用ポリオール組成物、二液硬化型発泡砥石用組成物、発泡砥石、及び発泡砥石の製造法 |
| JP4324785B2 (ja) | 2003-04-15 | 2009-09-02 | Ｊｓｒ株式会社 | 研磨パッドの製造方法 |
| US20040224622A1 (en) * | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
| JP2005052907A (ja) | 2003-08-07 | 2005-03-03 | Diatex Co Ltd | 研磨パッド用下地材 |
| JP4189963B2 (ja) | 2003-08-21 | 2008-12-03 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4189962B2 (ja) | 2003-08-21 | 2008-12-03 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| JP4265366B2 (ja) * | 2003-10-17 | 2009-05-20 | 日本ポリウレタン工業株式会社 | 軟質ポリウレタンフォームの製造方法 |
| CN1926666A (zh) * | 2004-03-11 | 2007-03-07 | 东洋橡胶工业株式会社 | 研磨垫及半导体器件的制造方法 |
| KR100909605B1 (ko) * | 2005-03-08 | 2009-07-27 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| KR101134058B1 (ko) * | 2005-05-17 | 2012-04-16 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| JP4884725B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP4884726B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
| CN101268111B (zh) * | 2005-09-22 | 2012-07-18 | 可乐丽股份有限公司 | 高分子材料、由其得到的发泡体以及使用它们的研磨垫 |
-
2006
- 2006-01-13 JP JP2006006210A patent/JP5031236B2/ja active Active
-
2007
- 2007-01-09 WO PCT/JP2007/050072 patent/WO2007080848A1/ja not_active Ceased
- 2007-01-09 MY MYPI20081682A patent/MY149939A/en unknown
- 2007-01-09 US US12/095,859 patent/US8094456B2/en active Active
- 2007-01-10 TW TW096100913A patent/TW200736373A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI488712B (zh) * | 2011-12-16 | 2015-06-21 | Toyo Tire & Rubber Co | Polishing pad and manufacturing method thereof |
| TWI715539B (zh) * | 2014-09-11 | 2021-01-11 | 日商荏原製作所股份有限公司 | 處理模組、處理裝置、及處理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| MY149939A (en) | 2013-11-15 |
| US8094456B2 (en) | 2012-01-10 |
| TW200736373A (en) | 2007-10-01 |
| US20090047872A1 (en) | 2009-02-19 |
| JP5031236B2 (ja) | 2012-09-19 |
| JP2007214151A (ja) | 2007-08-23 |
| WO2007080848A1 (ja) | 2007-07-19 |
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